• Journal of the Korean Society of Safety
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• v.38 no.3
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• pp.27-34
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• 2023

With the technological development of the semiconductor industry, the roles of electrical and thermal energy supply and control of semiconductor equipment in ultrafine processes have become very important. However, instances of electrical fires in the chiller heater, which is used for cooling in the semiconductor manufacturing process, are increasing. A fire occurs in combustibles due to high heat at the connection part of the chiller heater, that is, when the number of electrical wires in the connection part is reduced or when the wires are completely disconnected. In this study, the temperature characteristics were compared and analyzed through experiments and 3D simulations. The number of electrical wires, which is the connection part of the chiller heater, was reduced by 90%, 50%, 30%, 10%, and 5%, and the wires were completely disconnected. When the number of electrical wires was reduced by 5%, heat of up to 80℃ was generated, which is a relatively high temperature but insufficient to cause a fire in combustibles. Complete disconnection occurred due to the vibration of the motor and other components, and sparks and arcs were generated, resulting in a rapid increase in temperature to up to 680℃. When completely disconnected, the temperature increase was sufficient to cause a fire in the combustibles covering the terminal block. Therefore, in this study, the causes of electrical fires in chiller heaters were investigated and preventive measures were proposed by analyzing abnormal signals and thermal characteristics caused by the electrical wiring being reduced and completely disconnected.

• Journal of the Korean Society of Safety
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• v.15 no.4
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• pp.62-68
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• 2000

Static electricity in electronics manufacturing plants causes the economic loss, yet it is one of the least understood and least recognized effects haunting the industry today. Today's challenge in semiconductor devices is to achieve greater functional density pattern and to miniaturize electronic systems of being more fragile by electrostatic discharges(ESD) phenomena. As the use of automatic handling equipment for static-sensitive semiconductor components is rapidly increased, most manufacturers need to be more alert to the problem of ESD. One of the most common causes of electrostatic damage is the direct transfer of electrostatic charge from the human body or a charged material to the static-sensitive devices. To evaluate the ESD hazards by charged human body and devices, in this paper, characteristics of electrostatic attenuation in domestic semiconductor devices is investigated and the voltage to cause electronic component failures is investigated by field-induced charged device model(FCDM) tester. The FCDM simulator provides a fast and inexpensive test that faithfully represents ESD hazards in plants. Also the results obtained in this paper can be used for the prevention of semiconductor failure from ESD hazards.

• Journal of Information Processing Systems
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• v.10 no.3
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• pp.429-442
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• 2014

In this paper, we investigated the use of seasonal autoregressive integrated moving average (SARIMA) time series models for fault detection in semiconductor etch equipment data. The derivative dynamic time warping algorithm was employed for the synchronization of data. The models were generated using a set of data from healthy runs, and the established models were compared with the experimental runs to find the faulty runs. It has been shown that the SARIMA modeling for this data can detect faults in the etch tool data from the semiconductor industry with an accuracy of 80% and 90% using the parameter-wise error computation and the step-wise error computation, respectively. We found that SARIMA is useful to detect incipient faults in semiconductor fabrication.

• Journal of the Semiconductor & Display Technology
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• v.9 no.4
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• pp.71-76
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• 2010

According to recent changes in industry for semiconductor devices, a low-temperature treatment has become a necessity. These changes relate to size refinement and the development of new materials. While variation in cooling efficiency does not affect the yield when using a high-temperature treatment, uniform cooling efficiency is necessary avoid "inconsistencies/bends" in low temperature treatments. However it is difficult to increase temperature stabilization in low temperature treatments. In this paper, using CFD (Computer Fluid Dynamics), we analyze and manipulate the design and input of the low-temperature system to attempt to control for temperature variations within the quartz tube, of which airflow appears to be a predominant factor. This simulation includes variable inputs such as airflow rate, head pressure, and design manipulations in the S.C.U. (Super Cooling Unit).

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.6
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• pp.2472-2478
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• 2012

This research is aiming to develop Semiconductor equipment maintenance certification course to train qualified maintenance experts more effectively requested in related semiconductor industry. In the course of research, we adopted diverse research technique such as interview, on-spot investigation, documentary references to analyze current status of related training facilities, and forecast the population of test applicants. We analyzed similar certification course(Craftsman SMT, Industrial Engineer SMT, Craftsman Mechatronics, Industrial Enginee Mechatronics, et) as reference to set up job objectives and curriculum of semiconductor equipment maintenance certification. We conducted survey on expectations on newly created certificate, presented evaluation standard and objective of test, and preliminary writing test and demonstration test. Based on the result of various research, we were able to present training program for semiconductor equipment maintenance certification and set the assessment standard of qualification exam.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.25 no.3
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• pp.294-300
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• 2015

Objectives: The aim of this study is to identify physicochemical properties such as chemical composition, size, shape and crystal structure of powder byproducts generated from a metallization process and its 1st scrubber in the semiconductor industry. Methods: Powder samples were collected from inner chambers during maintenance of the W-plug process equipment (using tungsten hexafluoride as a precursor material) and its 1st scrubber. The chemical composition, size and shape of the powder particles were determined by field emission scanning electron microscopy (SEM) and transmission electron microscopy (TEM) equipped with an energy dispersive spectroscope (EDS). The crystal structure of the powders was analyzed by X-ray diffraction (XRD). Results: From the SEM-EDS and TEM-EDS analyses, O and W were mainly detected, which indicates the powder byproducts are tungsten trioxide ($WO_3$), whereas Al, F and Ti were detected as low peaks. The powder particles were spherical and nearly spherical, and the particle size collected from the process equipment and its 1st scrubber showed 10-20 nm (agglomerates: 55-90 nm) and 16-20 nm (agglomerates: 80-120 nm) as primary particles, respectively. The XRD patterns of the yellow powder byproducts exhibit five peaks at $23.8^{\circ}$ $33.9^{\circ}$ $41.74^{\circ}$ $48.86^{\circ}$ and $54.78^{\circ}$ which correspond to the (200), (220), (222), (400), and (420) planes of cubic $WO_3$. Conclusions: We elucidated the physicochemical characteristics of the powder byproducts collected from W-plug process equipment and its 1st scrubber. This study should provide useful information for the development of alternative strategies to improve the working environment and workers' health.

• Knowledge Management Research
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• v.3 no.2
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• pp.49-70
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• 2002

The purpose of this study is to investigate the process and its influencing factors of technological capability building in a small and medium-sized capital goods sector. This paper first reviews the influencing factors of accumulating technological capability-technology trajectory, technology sources, technological capability, technological learning, technology strategy, and entrepreneurship. The paper then presents the integrative model of technological capability building. The experience of Mirae Corporation, the first generation of venture company in Korea, is also discussed as a case in point to analyse the process of technological capability building in a small and medium-sized capital goods company. Finally, the implications and limitations of the study arc discussed.

• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.15-20
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• 2011

The lithography system installed inside precision industry's (e.g. TFT-LCD) production factories are increasing in size, thereby increasing its dynamic load along with it. Such condition causes vibration within the area where the system is installed, which then negatively affects the production line to produce defective products. To prevent this type of situation, the facilities should adopt dynamic design that considers the lithography system's dynamic load. This study predicts the maximum value allowed for dynamic stiffness (which is a ratio of vibration response against a single unit of the dynamic load) of the lithography system and explains the result of its application on actual structures inside the facilities.

• Journal of the Semiconductor & Display Technology
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• v.10 no.2
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• pp.1-5
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• 2011

In recent years, worldwide production of solar wafers increased rapidly. Therefore, the solar wafer technology in the developed countries already has become an industry, and related industries such as solar wafer manufacturing equipment have developed rapidly. In this paper we propose the color classification method of the polycrystalline solar wafer that needed in manufacturing equipment. The solar wafer produced in the manufacturing process does not have a uniform color. Therefore, the solar wafer panels made with insensitive color uniformity will fall off the aesthetics. Gaussian mixture models (GMM) are among the most statistically mature methods for clustering and we use the Gaussian mixture models for the classification of the polycrystalline solar wafers. In addition, we compare the performance of the color feature vector from various color space for color classification. Experimental results show that the feature vector from YCbCr color space has the most efficient performance and the correct classification rate is 97.4%.

• Journal of the Semiconductor & Display Technology
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• v.17 no.4
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• pp.51-55
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• 2018

As the OLED industry develops, display equipment is becoming larger. As a result, the stage required for display equipment is getting bigger. This enlargement led to increase in OLED production and industrial development. However, due to the large scale of the stage, other problems due to overheating and overheating caused by heavy load on the linear motor, which is mainly used in the stage, must be solved. In this study, a linear motor equipped with a cooling channel is modeled and the three - dimensional heat conduction flow analysis for this model is simulated using Fluent to analyze the cooling efficiency and cooling efficiency according to the cooling water flow rate. As a result, the cooling channel was effective and the cooling effect and efficiency were the best when the flow rate was about 5 ~ 10 L./min. In addition, the cooling effect is increased when the flow rate is increased, but the efficiency is significantly lowered when the flow rate is more than the predetermined value.