• 한국반도체및디스플레이장비학회:학술대회논문집
• /
• 한국반도체및디스플레이장비학회 2002년도 추계학술대회 발표 논문집
• /
• pp.123-126
• /
• 2002

For the mold die sticking mechanism, the major explanation is that EMC filler of silica wears die surface roughened, which results in increase of adhesion strength. As big differences in experimental results from semiconductor manufacturers are dependent on EMC models, however, chemisorptions or acid-base interaction is apt to be also functioning as major mechanisms. In this investigation, the plasma source ion implantation (PSII) using $O_2$, $N_2$, and $CF_4$ modifies sample surface to form a new dense layer and improve surface hardness, and change metal surface condition from hydrophilic to hydrophobic and vice versa. Through surface energy quantification by measuring contact angle and surface ion coupling state analysis by Auger, major governing mechanism for sticking issue was figured out to be a complex of mechanical and chemical factors.

• 반도체디스플레이기술학회지
• /
• 제14권1호
• /
• pp.61-65
• /
• 2015

We have fabricated poly(3,4-ethylenedioxythiophene) : poly(4-styrenesulfonate) (PEDOT : PSS) thin films using a slotdie coater for the applications of OLED lightings. It is demonstrated that the properties of slot-die coated PEDOT : PSS films are comparable with those of spin-coated ones. Namely, the average and peak-to-peak roughness of the slot-die coated 50-nm-thick PEDOT : PSS film are measured to be as low as 0.247 nm and 1.3 nm, respectively. Moreover, we have obtained excellent thickness uniformity (~1.91%). With the slot-die coated PEDOT : PSS films, we have fabricated green phosphorescent OLED devices. For comparison, we have also fabricated OLED devices with spin-coated PEDOT : PSS films. Both show almost no discrepancy in device performance. The power efficiency (25.4 lm/W) and emission uniformity (77%) of OLEDs with slot-die coated PEDOT : PSS films are shown to be slightly lower than those (27.3 lm/W, 80%) of OLEDs with spin-coated PEDOT : PSS films at the luminance of 1,000nit, increasing the feasibility of using a slot-die coating process for the fabrication of large-area OLED lighting sources at a competitive price.

• 반도체디스플레이기술학회지
• /
• 제17권1호
• /
• pp.27-34
• /
• 2018

Industrially, die-casting products are formed through casting, and so the methods to inspect the defects inside them are very restrictive. External inspection methods including visual inspection, sampling judgment, etc. enables researchers to inspect possible external defects, but x-ray inspection equipment has been generally used to inspect internal ones. Recently, they have been also applying three-dimensional internal inspections using CT equipment. However, they have their own limitations in applying to the use of industrial inspection due to limited detection size and long calculation time. To overcome the above problems, this paper has suggested a method to inspect internal defects by comparing the CAD data of the product to be inspected with the 3D data of the CT image. In this paper, we proposed a method for fast and accurate inspection in three dimensions by applying x-ray inspection to find internal defects in industrial parts such as aluminum die casting products. To show the effectiveness of the proposed method, a series of experiments have been carried out.

• 한국정밀공학회지
• /
• 제17권6호
• /
• pp.162-168
• /
• 2000

The automatic die polishing machine by liquid honing has been developed and experimented on the surface of machined die. The goal of development in the automatic die polishing machine by liquid honing is to increase the accuracy and the productivity in die polishing. To reach this goal, the polishing machine consists of the automatic measuring device for contour of die, the nozzle and pumping system to spray the powder mixed with liquid, and the 3-axis guides. Before polishing, the measuring device with a semiconductor laser scans the surface of mould to get the data of contour. The data store a PC and use to control the nozzle head to move above a couple of centimeters on the machined surface of die. The experimental parameters are the spraying time, the pressure, the size of abrasive grain and the mixing ratio between abrasive grain and liquid. The surface roughness is measured on the polished die which are SKDl 1 and Al7075 machined by NC. The surface roughness indicates the values of Rmax 0.5${\mu}{\textrm}{m}$ for Al7075 and Rmax 1.4${\mu}{\textrm}{m}$ for SKDl 1. It reduces the polishing time significantly and reduces the monotonous work for labors. As the results, the liquid honing system is useful method to apply for the die polishing and the automatic die polishing machine using liquid honing shows that it's very effective processing ability.

• 한국전기전자재료학회논문지
• /
• 제17권5호
• /
• pp.515-520
• /
• 2004

We report on the development of a Piezoelectric valvc that is designed to have a high reliability for fluid control systems, such as mass flow control, transportation and chemical analysis. The valve was fabricated using a MCA(multilayer ceramic actuator), which has a low consumption power, high resolution and accurate control. The fabricated valve is composed of MCA, a valve actuator die and an seat die. The design of the actuator dic was done by FEM(finite element method) modeling, respectively. And, the valve seat die with 6 trenches was made. and the actuator die, which possible to optimize control to MCA, was fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the scat/actuator die structure. PDMS(poly dimethylsiloxane) sealing pad was fabricated to minimize a leak-rate. It was also bonded to scat die and stainless steel package. The flow rate was 9.13 sccm at a supplied voltage of 100 V with a 50 % duty ratio and non-linearity was 2.24 % FS. From these results, the fabricated MCA valve is suitable for a variety of flow control equipments, a medical bio-system, semiconductor fabrication process, automobile and air transportation industry with low cost, batch recess and mass production.

• Design & Manufacturing
• /
• 제13권1호
• /
• pp.13-18
• /
• 2019

The size and prospects of the domestic semiconductor equipment market are increasing every year. In the case of various parts used inside semiconductor equipments, high durability such as high strength and abrasion resistance is demanded. Particularly, the gases used in semiconductor production processes are toxic. In order to prevent such toxic gas leakage, a precision processing technique and a surface treatment technique for preventing corrosion are required. Electro-polishing is an electro-chemical method of polishing a metal surface to make it smooth and polished. Electro-polishing is mainly used in the finishing process of metal surface. Unlike mechanical polishing, electro-polishing is used in many fields, such as fine chemical etching equipment, since no damaged layer or burr, fine polishing groove and particles are generated. However, in order to withstand the gas used in the semiconductor equipment, the parts must have high corrosion resistance. However, the surface hardness generally become lowered through electro-polishing. Therefore, in this study, surface hardness were experimentally observed before and after electro-polishing. Then, a method of improving hardness by preparing a nitrided layer by plasma ion nitriding treatment.

• 마이크로전자및패키징학회지
• /
• 제30권1호
• /
• pp.1-16
• /
• 2023

전기차용 전력변환모듈의 성능향상 요구와 종래의 Si 전력반도체의 한계 극복을 위해 차세대 전력반도체인 wide-bandgap (WBG) 기반 전력반도체로의 전환이 가속화되고 있다. WBG 전력반도체로의 전환을 위해 전력변환모듈 패키징 소재 역시 높은 고온 내구성을 요구받고 있다. 전력변환모듈 패키징 공정 중 하나인 Ag 소결 다이접합 기술은 종래의 고온용 Pb 솔더링의 대체 기술로 주목받고 있다. 본 논문에서는 Ag 소결 다이접합 기술 관련 최신 연구동향에 대해 소개하고자 한다. 소결 다이접합 공정 조건에 따른 접합부 특성을 비교하고 Ag 소결층의 3차원 이미지 구현에 따른 다공성 Ag 소결 접합부의 물성 측정 방법론에 대해 고찰하였다. 또한 열충격 및 파워사이클 신뢰성 평가 연구동향을 분석하였다.

• 반도체디스플레이기술학회지
• /
• 제12권4호
• /
• pp.55-59
• /
• 2013

Mold die sticking arises from silica filler abrasion to the cavity surface. Ni-P electroplating was examined to substitute conventional hard Cr plating. More than 4% of Phosphorus in the electroplated film produces nano crystal structure and annealing makes $Ni_3P$ precipitated to get hardness values equivalent to hard Cr.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제12권2호
• /
• pp.139-149
• /
• 2012

A 3D stacked IC is made by multiple dies (possibly) with heterogeneous process technologies. Therefore, die-to-die variation in 2D chips renders on-package variation (OPV) in a 3D chip. In spite of the different variation effect in 3D chips, generally, 3D die stacking can produce high yield due to the smaller individual die area and the averaging effect of variation on data path. However, 3D clock network can experience unintended huge clock skew due to the different clock propagation routes on multiple stacked dies. In this paper, we analyze the on-package variation effect on 3D clock networks and show the necessity of a post silicon management method such as body biasing technique for the OPV induced 3D clock skew control in 3D stacked IC designs. Then, we present a parametric yield improvement method to mitigate the OPV induced 3D clock skew.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2009년도 추계학술대회 논문집
• /
• pp.179-179
• /
• 2009

For the deposition of the semiconductor nanocrystals or quantum dots, it is required to have the substrates with smooth surface roughness. Slot-die coating method wad adopted and optimized varying the processing parameters like coating speed, gap distance, solution concentration, etc to get the smooth coated films on flexible substrates. The coating speed in slot-die method was varied from 1 m/min to 2.5 m/min focusing especially on its industrial usage. The gap distance between the substrate surface and slot-die lip was changed also to control mainly the thickness of coated films.