• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1977-1979
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• 2005

열저항 측정법에는 정상상태보다는 과도응답 특성을 이용하는 것이 우수한 것으로 20년부터 알려져 왔다. 온도를 시간의 함수로 나타내는 열적 계단응답함수를 이용하면 칩에서 주위 분위기, 냉각장치 또는 마운트를 포함한 열 임피던스를 측정할 수 있다. 소자 접합부의 열적 동특성을 측정함으로써 칩 주변의 기하학적 물질에 대한 특성을 파악할 수 있으며 나아가 측정으로부터 소자의 열적 구조를 유추할 수 있다. 본 논문에서는 열적 계단응답 특성을 이용한 열 임피던스 측정이론 및 원리에 대해서 개관하였다.

• Transactions on Electrical and Electronic Materials
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• v.12 no.1
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• pp.7-10
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• 2011

High voltage (HV) integrated circuits are viable alternatives to discrete circuits in a wide variety of applications. A HV device generally used in these circuits is a lateral double diffused metal oxide semiconductor (LDMOS) transistor. Attempts to model LDMOS devices are complicated by the existence of the lightly doped drain and by the extension of the poly-silicon and the gate oxide. Several physically based investigations of the bias-dependent drift resistance of HV devices have been conducted, but a complete physical model has not been reported. We propose a new technique to model HV devices using both the BSIM3 SPICE model and a bias dependent resistor model (sub-circuit macro model).

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.41.2-41
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• 1998

• Journal of Korean Society of Industrial and Systems Engineering
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• v.26 no.3
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• pp.67-73
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• 2003

Manufacturing technologies of compound semiconductor are similar to the process of memory device, but management technology of manufacturing process for compound semiconductor is not enough developed. Semiconductor manufacturing environment also has been emerged as mass customization and open foundry service so integrated manufacturing system is needed. In this study we design the integrated manufacturing system for compound semiconductor fabrication t hat has monitoring of process, reduction of lead-time, obedience of due-dates and so on. This study presents integrated manufacturing system having database system that based on web and data acquisition system. And we will implement them in the actual compound semiconductor fabrication.

• Proceedings of the Korean Magnestics Society Conference
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• 2016.05a
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• pp.134-134
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• 2016

• Electronics and Telecommunications Trends
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• v.38 no.4
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• pp.25-35
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• 2023

As the global semiconductor supply chain falters, major countries are pushing to increase their self-sufficiency in semiconductors. In accordance with these global changes, R&D cooperation is evolving in the semiconductor industry. Previously, as for the case of Interuniversity Microelectronics Center (IMEC) in Europe, many cooperation initiatives were established regardless of nationality for improving productivity through measures such as reducing the time and cost required for joint research. Recently, however, cooperation aimed at strengthening one's own industry has been prominent, such as that led by Taiwan Semiconductor Research Institute (TSRI) and the United States National Semiconductor Technology Center (NSTC). Hence, the Korean semiconductor industry also needs to respond. Internally, technology localization should be promoted by strengthening the foundation for domestic R&D cooperation, while externally, it should expand close cooperation with companies from countries leading the semiconductor industry, such as the United States, Europe, and Japan.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.67-72
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• 2023

In this paper, a dye-sensitized solar cell (DSSC), one of the representative third-generation solar cells with eco-friendly materials and processes compared to other solar cells, was modeled using MATLAB/Simulink. The simulation was conducted by designating values of series resistance, parallel resistance, light absorption coefficient, and thin film electrode thickness, which are directly related to the efficiency of dye-sensitized solar cells, as arbitrary experimental values. In order to analyze the performance of dye-sensitized solar cells, the optimal value among each parameter experimental value related to efficiency was found using formulas for fill factor (FF) and conversion efficiency.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.1240-1243
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• 2004

Multi-Valued Image Entropy Coding (MVIEC) is a new class of joint source channel coding, which reduces both input-width (1/4) and average current (0.36-1.3) for LCD source drivers. This paper describes the detail results on MVIEC for several image sets in order to verify the practical performance.

• Proceedings of the Korean Vacuum Society Conference
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• 1997.07a
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• pp.37-38
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• 1997

• Proceedings of the Korean Vacuum Society Conference
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• 1996.06a
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• pp.96-96
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• 1996