• 한국진공학회지
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• 제18권6호
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• pp.468-473
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• 2009

Chemical beam epitaxy 성장법으로 InP/InGaAs 다층구조의 선택적 영역 에피성장 (selective area epitaxy)을 하였다. <011> 방향에 평행한 직선패턴에서는 선폭이 작아지고, <01-1> 방향에 평행한 직선패턴에서는 선폭이 증가하는 현상이 나타났는데 이는 InGaAs의 <311>A와 B면이 <01-1> 방향에 평행한 직선패턴에서 성장되었기 때문으로 설명되었다. 성장속도가 $1\;{\mu}m/h$인 조건에서 5족 가스의 압력이 감소할수록 (100) 면 위에서 평평한 에피층이 성장되었는데 이는 5족 가스의 과포화현상에 의한 3족 원소의 표면이동으로 설명하였다.

• 대한전자공학회논문지
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• 제23권6호
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• pp.801-806
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• 1986

The effect of SiH2Cl2 -HCl gas on the growth rate of epitaxial layer is studied. The temperature, pressure and gas mixing ratio of SiH2Cl2 and HCl are varied to study the growth rate dependence and selective Si epitaxy. The P-n junction diode is fabricated on the epitaxial layer and electrical characteristics are examined. Also, using selective Si epitaxy, a possibility of thin dielectric isolation process, that gives an independent isolation width on the mask dimension, is examined.

• 한국재료학회지
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• 제12권5호
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• pp.363-368
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• 2002

we proposed the use of $Si_2H_ 6/H_2$ chemistry for selective silicon epitaxy growth by low-pressure chemical vapor deposition(LPCVD) in the temperature range $600~710^{\circ}C$ under an ultraclean environment. As a result of ultraclean processing, an incubation period of Si deposition only on $SiO_2$ was found, and low temperature epitaxy selective deposition on Si was achieved without addition of HCI. Total gas flow rate and deposition pressure were 16.6sccm and 3.5mtorr, respectively. In this condition, we selectively obtained high-quality epitaxial Si layers of the 350~1050$\AA$ thickness. In older to extend the selectivity, we kept high pressure $H_2$ environment without $Si_2H_6$ gas for few minutes after first incubation period and then we conformed the existence of second incubation period.

• 한국전기전자재료학회논문지
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• 제19권11호
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• pp.1005-1009
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• 2006

High quality three-dimensional (3D) heterostructures were constructed by selective area (SA) molecular beam epitaxy (MBE) using a specially patterned GaAs (001) substrate to improve the efficiency of tarrier transport. MBE growth parameters such as substrate temperature, V/III ratio, growth ratio, group V sources (As2, As4) were varied to calibrate the selective area growth conditions and the 3D GaAs-AlGaAs heterostructures were fabricated into the ridge type and the V-groove type. Scanning micro-photoluminescence $({\mu}-PL)$ measurements and the following analysis revealed that the gradually (adiabatically) coupled 1D-2DEG (electron gas) field effect transistor (FET) system was successfully realized. These 3D-heterostructures are expected to be useful for the realization of high-performance mesoscopic electronic devices and circuits since it makes it possible to form direct ohmic contact onto the (quasi) 1D electron channel.

• 대한전자공학회논문지
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• 제23권6호
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• pp.820-832
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• 1986

In contrast to conventional liquid phase epitaxy of GaAs, surface kinetics limited growth is predominant in selective liquid phase epitaxy. For the stripe openings in the high-index crystal-lographic directions, the well-known facet formations and the decompositions into the low index planes or smooth circular surfaces are observed depending on the growth kinetics. For the low index direction stripe, surface kinetics limited growth is evident. By a numerical calcualtion we show that these phenomena are due to the enhanced masstransport by two dimensional diffusion and growth rate anisotropy which is found to be very stdrong with cusped minima for some singular planes in the solution growth as well as in vapor phase epitaxy. Morphological stability is briefly treated in terms of diffusion and its implications on device application are stated. Tese phenomena may be common to III-V compound semiconductors as well as GaAs.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1994년도 추계 학술발표 강연 및 논문 개요집
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• pp.21-22
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• 1994

• 대한전기학회:학술대회논문집
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• 대한전기학회 1986년도 하계학술대회논문집
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• pp.595-598
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• 1986

• 대한전자공학회논문지
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• 제22권1호
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• pp.34-40
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• 1985

시스뎀 압력이 1.0 기압[대기압 공정]일 경우와 0.1 기압(감압 공정)일 경우에 대해, SiH2Cl2를 사용했을 때의 에퍼택셜층 및 폴리실리콘의 성장 현상과 HCI을 사용했을 때의 이것들의 에칭 현상을 조사하였다. 실험적으로 구한 성장 속도 및 에칭 속도에 대한 식들로부터 Sih2Cl2와 HCI을 혼합하여 사용할 경우에 대한 선화적 에퍼택시가 가능한 공정 조건이 예측되었다. 그 결과, 선택적 에퍼택셜 성장 영역이 감압 공정에서는 실험 범위내에서 존재하였지만 대기압 공정에서는 존재하지 않는 것으로 나타났다. 이 것은 대기압과 감압에서의 성장 속도 및 에칭 속도가 차이가 나기 때문에 기인하는 것이다.

• 반도체디스플레이기술학회지
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• 제10권3호
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• pp.29-33
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• 2011

Film growth rate and composition variation are numerically analyzed during the selective area growth of InGaN on the GaN triangular stripe microfacet in this study. Both the vapor phase diffusion and the surface diffusion are considered to determine the In composition on the InGaN surface. To obtain the In composition on the surface, flux of In atoms due to the surface diffusion is added to the concentration determined from the Laplace equation which is governing the gas phase diffusion. The solution model is validated by comparing the growth rates from the analyses to the experimental results of GaN and InN films. The In composition and resulting wave length are increased when the surface diffusion is considered. The In content is also increased according to the increasing mask width. The effect of mask width to the In content and wave length is increasing in the case of a small open region.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.167-168
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• 2006

High quality 3D-heterostructures were constructed by selective area (SA) molecular beam epitaxy (MBE) using a specially patterned GaAs (001) substrate. MBE growth parameters such as substrate temperature, V/III ratio, growth ratio, group V sources ($As_2$, $As_4$) were varied to calibrate the selective area growth conditions. Scanning micro-photoluminescence ($\mu$-PL) measurements and following analysis revealed that the gradually (adiabatically) coupled 2DEG-1D-1DEG field effect transistor (FET) system was realized. This 3D-heterostructure is very promising for the realization of the meso-scopic electronic devices and circuits since it makes it possible to form direct ohmic contact to the (quasi) 1DEG.