• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.85-86
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• 2012

• Journal of the Korean Vacuum Society
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• v.14 no.3
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• pp.153-158
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• 2005

The effective mean free path model was adopted to examine the thickness effect on the thermoelectric properties of flash-evaporated n-type $Bi_2Te_{2.4}Se_{0.6}$ thin films. Annealing effects on the electron concentration and mobility were also studied, and their variations were analyzed in conjunction with antisite defects. Seebeck coefficient and electrical resistivity versus inverse thickness showed a linear relationship, and the mean free path was found to be $5120\AA$ Electron mobility was increased by annealing treatment and electron concentration was decreased considerably due to reduction of antisite defects, so that electrical conductivity was decreased and Seebeck coefficient was increased. When annealed at 473k for 1 hour, Seebeck coefficient and electrical conductivity were $-200\;\mu V/k\;and\;510\omega^{-1}cm^{-1}$, respectively. Therefore, the thermoelectric power factor was improved to be $20\times10^{-4}\;W/(mK^2)$.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.695-695
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• 2013

양단간의 온도차를 이용한 열전 발전 및 펠티어 효과를 이용한 열전냉각 소자는 전기와 열의 직접적인 변환으로 활용도가 높아 차세대 에너지 연구 분야로 각광 받고 있다. 열전 소자의 성능 척도는 성능지수 Z (Figure of Merit)로 나타내며, Seebeck 계수 및 전기전도도, 열전도도의 관계로 주어지게 되고 재료의 물성치가 소자의 성능에 큰 영향을 주게 된다. 따라서, 열전재료의 성능을 높이는 연구가 활발히 진행되어 왔으며, 최근 에너지 밴드 구조를 조절하여 Seebeck계수의 향상을 시도하는 연구가 많이 진행되고 있다. 이는 페르미 레벨근처에 도핑 된 원자들이 Density of states에 추가로 준위를 형성하여 Seebeck 계수 향상을 가능하게 한다. 본 연구에서는 상온용 열전 물질인 $Bi_2Te_3$에 Iodine 도핑을 통한 열전 성능 변화를 고찰하고자 한다. $Bi_2Te_3$는 유기금속 화합물 증착 방법으로 성장하였고 기판으로 $4^{\circ}$기울어진 GaAs를 사용 하였다. 전기적 특성은 Seebeck 측정 및 Van der Pauw법에 의한 Hall measurement 방법으로 분석하였다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.3
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• pp.13-19
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• 2021

This study examined the effects of stacking faults on the thermoelectric properties for n-type SiC semiconductors. Porous SiC semiconductors with 30~42 % porosity were fabricated by the heat treatment of pressed ��-SiC powder compacts at 1600~2100 ℃ for 20~120 min in an N2 atmosphere. XRD was performed to examine the stacking faults, lattice strain, and precise lattice parameters of the specimens. The porosity and surface area were analyzed, and SEM, TEM, and HRTEM were carried out to examine the microstructure. The electrical conductivity and the Seebeck coefficient were measured at 550~900 ℃ in an Ar atmosphere. The electrical conductivity increased with increasing heat treatment temperature and time, which might be due to an increase in carrier concentration and improvement in grain-to-grain connectivity. The Seebeck coefficients were negative due to nitrogen behaving as a donor, and their absolute values also increased with increasing heat treatment temperature and time. This might be due to a decrease in stacking fault density, i.e., a decrease in stacking fault density accompanied by grain growth and crystallite growth must have increased the phonon mean free path, enhancing the phonon-drag effect, leading to a larger Seebeck coefficient.

• Journal of the Korean Institute of Telematics and Electronics
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• v.21 no.5
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• pp.7-10
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• 1984

Generally, free carrier densities of single crystal semiconductors are indifferent to methods of measurement. Free carrier densities of CdSe thin films, however, were measured invarious values with different methods In this paper, C-V method, Seebeck effect and a.c. Hall effect were used to measure carries densities of CdSe thin films. Carrier densities of CdSe thin films were in the range of 10 - 10 carriers/㎤. And causes of different results were discussed.

• Journal of the Korean Ceramic Society
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• v.40 no.10
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• pp.991-997
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• 2003

The effect of A1$_4$C$_3$ additive on the thermoelectric properties of SiC ceramics were studied. Porous SiC ceramics with 47∼59% relative density were fabricated by sintering the pressed $\alpha$-SiC powder compacts with A1$_4$C$_3$at 2100∼220$0^{\circ}C$ for 3 h in Ar atmosphere. Crystalline phases of the sintered bodies were identified by powder X-Ray Diffraction (XRD) and their microstructures were observed with a Scanning Electron Microscope (SEM). In the case of A1$_4$C$_3$ addition, the phase transformation of 6H-SiC to 4H-SiC could be observed during sintering. The Seebeck coefficient and electrical conductivity were measured at 550∼95$0^{\circ}C$ in Ar atmosphere. In the case of undoped specimens, the Seebeck coefficients were positive (p-type semiconducting) possibly due to a dominant effect of the acceptor impurities (Al, Fe) contained in the starting powder and electrical conductivity increased as increasing sintering temperature. Electrical conductivity of A1$_4$C$_3$doped specimen is larger than that of undoped specimen under the same condition, which might be due to the reverse phase transformation and increasing of carrier density. And the Seebeck coefficient of A1$_4$C$_3$ doped specimen is also larger than that of undoped specimen. The density of specimen, the amount of addition and sintering atmosphere had significant effects on the thermoelectric property.

• Korean Journal of Materials Research
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• v.14 no.1
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• pp.41-45
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• 2004

P-type $Bi_{0.5}$$Sb_{1.5}$ $Te_3$ thin films were deposited by the flash evaporation technique, and their thermoelectric properties and electronic transport parameters were investigated. The effective mean free path model was adopted to examine the thickness effect on the thermoelectric properties. Annealing effects on the carrier concentration and mobility were also studied, and their variations were analyzed in conjunction with the antisite defects. Seebeck coefficient and electrical resistivity versus inverse thickness showed a linear relationship, and the effective mean free path was found to be 3150$\AA$. No phase transformation and composition change were observed after annealing treatment, but carrier mobility increased due to grain growth. Carrier concentration decreased considerably due to reduction of the antisite defects, so that electrical conductivity decreased and Seebeck coefficient increased. When annealed at 473 K for 1 hr, Seebeck coefficient and electrical conductivity were $160\mu$V/K and 610 $W^{-1}$ $cm^{ -1}$, respectively. Therefore, the thermoelectric quality factor were also enhanced to be $16\mu$W/cm $K^2$.>.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.15 no.2
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• pp.75-78
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• 2005

Silicon boride ($SiB_6$) is very promising for use as thermoelectric materials at high temperature because of its high melting point and relatively large Seebeck coefficient. In the present work, spark plasma sintering (SPS) was applied for preparing dense $SiB_6$ ceramics, and their thermoelectric properties were investigated, together with their microstructural evaluation. The SPS process was found to be effective in densifying a $SiB_6$ ceramic, typically 99 % of the theoretical density at low temperature of $1500^{\circ}C$. In comparison with $SiB_6$ specimen prepared by hot-pressing, the SPS-processed specimen exhibited the significantly improved Seebeck coefficient, resulting in the higher power factor.

• Journal of the Korean Electrochemical Society
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• v.20 no.3
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• pp.55-59
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• 2017

In this study, thermoelectric characteristics of perovskite $La_{0.5}Ca_{0.5}MnO_3$ (LCMO) nanomaterials were investigated by theoretical simulation and experimental analysis. Thermoelectric power factors calculated by DFT simulation were gradually enhanced as increase in annealing temperature. Maximum power factor was obtained with high magnitude of $S^2{\sigma}=566{\mu}W/m{\cdot}K^2$ at 1100 K through a dominant improvement of Seebeck coefficient compared with electrical conductivity. Experimentally, the LCMO nanomaterials were hydrothermally synthesized and then treated by post thermal annealing with temperature variation. X-ray diffraction and SEM analysis illustrated that LCMO exhibited orthorhombic perovskite structures with small grain size of 16~19 nm over 873 K. The results directly confirmed that improvement of crystallinity and decrease of mean grain size given by post thermal annealing lead to enhancements of electrical conductivity and Seebeck coefficient, respectively.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.1
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• pp.62-69
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• 2004

Thermoelectric module is a device that can produce cooling in a direct manner using the electrical energy. The purpose of this study is to investigate the performance of thermoelectric module and cooling system equipped with the thermoelectric module. The performance of a thermoelectric module is estimated using two methods; theoretical analysis based on one-dimensional energy equations and experimental tests using heat source, heat sink and brass conduction extenders. For the thermoelectric cooling system, the temperatures in the chamber are recorded and then compared with those of lumped system analysis. The results show that the cooling capacity and COP of the thermoelectric module increases as the temperature difference between hot and cold surface decreases, and there is particular current at which cooling capacity reaches its maximum value. The experimental results for the thermoelectric cooling system are similar to those of lumped system analysis.