• Title/Summary/Keyword: Scan based testing

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A Simulation Tool for Ultrasonic Inspection

  • Krishnamurthy, Adarsh;Mohan, K.V.;Karthikeyan, Soumya;Krishnamurthy, C.V.;Balasubramaniam, Krishnan
    • Journal of the Korean Society for Nondestructive Testing
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    • v.26 no.3
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    • pp.153-161
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    • 2006
  • A simulation program SIMULTSONIC is under development at CNDE to help determine and/or help optimize ultrasonic probe locations for inspection of complex components. SIMULTSONIC provides a ray-trace based assessment for immersion and contact modes of inspection. The code written in Visual C++ operating in Microsoft Windows environment provides an interactive user interface. In this paper, a description of the various features of SIMULTSONIC is given followed by examples illustrating the capability of SIMULTSONIC to deal with inspection of canonical objects such as pipes. In particular, the use of SIMULTSONIC in the inspection of very thin-walled pipes (with 450 urn wall thickness) is described. Ray trace based assessment was done using SIMULTSONIC to determine the standoff distance and the angle of oblique incidence for an immersion mode focused transducer. A 3-cycle Hanning window pulse was chosen for simulations. Experiments were carried out to validate the simulations. The A-scans and the associated B-Scan images obtained through simulations show good correlation with experimental results, both with the arrival time of the signal as well as with the signal amplitudes.

Using Field Programmable Gate Array Hardware for the Performance Improvement of Ultrasonic Wave Propagation Imaging System

  • Shan, Jaffry Syed;Abbas, Syed Haider;Kang, Donghoon;Lee, Jungryul
    • Journal of the Korean Society for Nondestructive Testing
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    • v.35 no.6
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    • pp.389-397
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    • 2015
  • Recently, wave propagation imaging based on laser scanning-generated elastic waves has been intensively used for nondestructive inspection. However, the proficiency of the conventional software based system reduces when the scan area is large since the processing time increases significantly due to unavoidable processor multitasking, where computing resources are shared with multiple processes. Hence, the field programmable gate array (FPGA) was introduced for a wave propagation imaging method in order to obtain extreme processing time reduction. An FPGA board was used for the design, implementing post-processing ultrasonic wave propagation imaging (UWPI). The results were compared with the conventional system and considerable improvement was observed, with at least 78% (scanning of $100{\times}100mm^2$ with 0.5 mm interval) to 87.5% (scanning of $200{\times}200mm^2$ with 0.5 mm interval) less processing time, strengthening the claim for the research. This new concept to implement FPGA technology into the UPI system will act as a break-through technology for full-scale automatic inspection.

FEM Model-Based Investigation of Ultrasonic TOFD for Notch Inspection

  • Tang, Ziqiao;Yuan, Maodan;Wu, Hu;Zhang, Jianhai;Kim, Hak-Joon;Song, Sung-Jin;Kang, Sung-Sik
    • Journal of the Korean Society for Nondestructive Testing
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    • v.34 no.1
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    • pp.1-9
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    • 2014
  • A two-dimensional numerical model based on the finite element method was built to simulate the wave propagation phenomena that occur during the ultrasonic time of flight diffraction (TOFD) process. First, longitudinal-wave TOFD was simulated, and the numerical results agreed well with the theoretical results. Shear-wave TOFD was also investigated because shear waves have higher intensity and resolution. The shear wave propagation was studied using three models with different boundary conditions, and the tip-diffracted shear-to-longitudinal wave was extracted from the A-scan signal difference between the cracked and non-cracked specimens. This signal showed very good agreement between the geometrical and numerical arrival times. The results of this study not only provide better understanding of the diffraction phenomena in TOFD, but also prove the potential of shear-wave TOFD for practical application.

A Study on the Fracture Behavior of Composite Laminated T-Joints Using AE (AE를 이용한 복합재료 T 조인트부의 파괴거동에 관한 연구)

  • Kim, J.H.;Ahn, B.W.;Sa, J.W.;Park, B.J.
    • Journal of the Korean Society for Nondestructive Testing
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    • v.19 no.4
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    • pp.277-287
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    • 1999
  • Quasi-static tests such as monotonic tension and loading/unloading tension were performed to investigate the bond characteristics and the failure processes for the T-joint specimens made from fiber/epoxy composite material. Two types of specimens, each consists of two components, e. g. skin and frame. were manufactured by co-curing and secondary bonding. During the monotonic tension test, AE instrument was used to predict AE signal at the initial and middle stage of the damage propagation. The damage initiation and progression were monitored optically using m (Charge Coupled Device) camera. And the internal crack front profile was examined using ultrasonic C-scan. The results indicate that the loads representing the abrupt increase of the AE signal are within the error range of 5 percent comparing to the loads shown in the load-time curve. Also it is shown that the initiation of crack occurred in the noodle region for both co-cured and secondarily bonded specimen. The final failure occurred in the noodle region for the co-cured specimen. but at the skin/frame termination point for the secondarily bonded specimen. Based on the results, it was found that two kinds of specimen show different failure modes depending on the manufacturing methods.

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A New Test Algorithm for Effective Interconnect Testing Among SoC IPs (SoC IP 간의 효과적인 연결 테스트를 위한 알고리듬 개발)

  • 김용준;강성호
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.40 no.1
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    • pp.61-71
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    • 2003
  • Interconnect test for highly integrated environments like SoC, becomes more important as the complexity of a circuit increases. This importance is from two facts, test time and complete diagnosis. Since the interconnect test between IPs is based on the scan technology such as IEEE1149.1 and IEEE P1500, it takes long test time to apply test vectors serially through a long scan chain. Complete diagnosis is another important issue because a defect on interconnects are shown as a defect on a chip. But generally, interconnect test algorithms that need the short test time can not do complete diagnosis and algorithms that perform complete diagnosis need long test time. A new interconnect test algorithm is developed. The new algorithm can provide a complete diagnosis for all faults with shorter test length compared to the previous algorithms.

Nondestructive Imaging of an Object Using the Compact Continuous-Wave Sub-Terahertz Imaging System (소형 CW Sub-THz 이미징 시스템을 이용한 물체의 비파괴 이미징)

  • Jang, Jin-Seok;Kwon, Il-Bub;Yoon, Dong-Jin;Seo, Dae-Cheol
    • Journal of the Korean Society for Nondestructive Testing
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    • v.30 no.4
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    • pp.352-358
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    • 2010
  • This paper presented compact CW sub-THz imaging system using the terahertz transmitter(Tx) that generating 0.34 THz electromagnetic wave on based electronic device. Using 0.34 THz electromagnetic wave generated by Tx, we transmitted to sample by point by point scan method and measured transmitting terahertz wave magnitude and phase information respectively with terahertz receiver(Rx) based on sub harmonic mixer. This paper measured and compared images of several samples to obtain better imaging results by changing time delay and step distance of scanning stage which affect image resolution. Also, through the imaging measurement of various samples, we were able to assure possibility of application of terahertz wave.

Detection of Second-Layer Corrosion in Aging Aircraft

  • Kim, Noh-Yu;Yang, Seun-Yong
    • Journal of the Korean Society for Nondestructive Testing
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    • v.29 no.6
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    • pp.591-602
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    • 2009
  • The Compton backscatter technique has been applied to lap-joint in aircraft structure in order to determine mass loss due to exfoliative corrosion of the aluminum alloy sheet skin. The mass loss of each layer has been estimated from Compton backscatter A-scan including the aluminum sheet, the corrosion layer, and the sealant. A Compton backscattering imaging system has been also developed to obtain a cross-sectional profile of corroded lap-splices of aging aircraft using a specially designed slit-type camera. The camera is to focus on a small scattering volume inside the material from which the backscattered photons are collected by a collimated scintillator detector for interpretation of material characteristics. The cross section of the layered structure is scanned by moving the scattering volume through the thickness direction of the specimen. The theoretical model of the Compton scattering based on Boltzmann transport theory is presented for quantitative characterization of exfoliative corrosion through deconvolution procedure using a nonlinear least-square error minimization method. It produces practical information such as location and width of planar corrosion in layered structures of aircraft, which generally cannot be detected by conventional NDE techniques such as the ultrasonic method.

The Scanning Laser Source Technique for Detection of Surface-Breaking and Subsurface Defect

  • Sohn, Young-Hoon;Krishnaswamy, Sridhar
    • Journal of the Korean Society for Nondestructive Testing
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    • v.27 no.3
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    • pp.246-254
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    • 2007
  • The scanning laser source (SLS) technique is a promising new laser ultrasonic tool for the detection of small surface-breaking defects. The SLS approach is based on monitoring the changes in laser-generated ultrasound as a laser source is scanned over a defect. Changes in amplitude and frequency content are observed for ultrasound generated by the laser over uniform and defective areas. The SLS technique uses a point or a short line-focused high-power laser beam which is swept across the test specimen surface and passes over surface-breaking or subsurface flaws. The ultrasonic signal that arrives at the Rayleigh wave speed is monitored as the SLS is scanned. It is found that the amplitude and frequency of the measured ultrasonic signal have specific variations when the laser source approaches, passes over and moves behind the defect. In this paper, the setup for SLS experiments with full B-scan capability is described and SLS signatures from small surface-breaking and subsurface flaws are discussed using a point or short line focused laser source.

Ultrasonic Test Criterion for the Explosively Welded Fe-Naval Brass Bonding Quality (초음파법에 의한 폭발접합 이종금속 접합품질 판정레벨 설정에 관한 연구)

  • 장영권;백영남
    • Journal of Welding and Joining
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    • v.19 no.1
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    • pp.40-48
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    • 2001
  • An ultrasonic test method, as a nondestructive test is applied to ensure the clad interface quality assessment. According to the reference codes and standards, not only korea Industrial Standard(KS) but also American Society for Testing and Materials (ASTM) Standard, ultrasonic examination procedures use the pulse-echo, A-scan, back reflection signal drop method and/or side drilled reference hole used to establish the acceptance criteria of clad material test. But the variety of bonding materials and sizes makes it difficult to produce the reference blocks, or thus the criteria. In order to overcome these practical difficulties, new ultrasonic testing criterion is suggested. In this new method, the theoretical interface reflection signal amplitude level is calculated and suggested as an acceptance criteria with the back reflection signal set to 100% FSH(Full Screen Height) which is based on acoustic impedance mismatch at the clad interface for the explosive clad ultrasonic inspection. Applicability of suggested criterion, for the explosive clad Fe-Naval Brass with different bonding quality is confirmed to the pre-existed KS and ASTM specifications and verified by using SEM (Seanning Electron Microscope) micrograph. The results obtained by the suggested method is more conservative than the results according to the KS B 0234 and ASTM A 578 specifications The suggested method could be applicable to any other combination of explosive clad ultrasonic inspection.

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Kinematics Analysis of a 5-Axis Ultrasonic Inspection Equipment (5축 초음파 검사장비의 기구학 해석)

  • Han, Myung-Chul;Sung, Chang-Min
    • Journal of the Korean Society for Precision Engineering
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    • v.32 no.1
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    • pp.89-96
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    • 2015
  • In this paper, it is studied that kinematic analysis of a 5-axis ultrasonic inspection equipment. The equipment is comprised of three straight axes and two rotary axes. With features of ultrasonic, the transmitter and receiver of the equipment are vertical to a test surface, operating at regular intervals. To perform this well, the motions of every link should be found on the based of kinematic analysis of the equipment. We chose starting point for testing and defined relations among all links through transformation of coordinates. For double curvature-shaped test object, we generated test paths. To follow these, we found motions of all links using inverse kinematics. By using Matlab/Simulink, simulator was developed, so that we could find out desired trajectories of main axes for a scan.