• Tribology and Lubricants
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• 제32권2호
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• pp.50-55
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• 2016

Recently, a double-side machining process has been adopted in fabricating a sapphire glass to enhance the manufacturability. Double-side lap grinding (DLG) is one of the emerging processes that can reduce process steps in the fabrication of sapphire glasses. The DLG process uses two-body abrasion with fixed abrasives including pallet. This process is designed to have a low pressure and high rotational speed in order to obtain the required material removal rate. Thus, the temperature is distributed on the DLG platen during the process. This distribution affects the shape of the substrate after the DLG process. The coolant that is supplied into the cooling channel carved in the base platen can help to control the temperature distribution of the DLG platen. This paper presents the results of computational fluid dynamics with regard to the heat transfer in a DLG platen, which can be used for fabricating a sapphire glass. The simulation conditions were 200 rpm of rotational speed, 50℃ of frictional temperature on the pallet, and 20℃ of coolant temperature. The five cases of the coolant flow rate (20~36 l/min) were simulated with a tetrahedral mesh and prism mesh. The simulation results show that the capacity of the generated cooling system can be used for newly developed DLG machines. Moreover, the simulation results may provide a process parameter influencing the uniformity of the sapphire glass in the DLG process.

• 한국결정학회지
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• 제1권2호
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• pp.99-104
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• 1990

본 연구에서는 고밀도 광원 활용에 의한 유기금속화합물의 광분해 반응을 이용하여 AmBv 형광 전재료의 Hetero-epitaxy를 고찰하였다. 실제로 ArF Excimer laser(파장 193nm)에 의 하여 III족원으로 trlmethylgallium과 V족원으로 Ammonia의 2분자간 광분해 반응을 이용, (001)면 Sapphire 기판상에 증착시켰다. 생성되는 성막상태는 주사식 전자현미경, X-ray 회절 및 전자선 회절법 (RED)에 의하여 평가하였다. Laser광려기 유무에 따라 결정병합 상태 및 결정형태에 현저한 차이를 관찰할 수 있었으며, 특히 결정격자의 방위성에 큰 영향을 주고 있음이 주목되었다. 광원 조사방법은 수직조사에 의한 기판면 여기보다는 수평조사에 의 한 기상 반응물 여기가 더 효과적 이였다. Laser 광여기에 의한 성막층의 격자형성은 다음 과 같은 2가지 Model중 하나로 설명 할 수 있었다. (001)면 Sapphire//wurzite형 GaN의 (001) 면 또는 (001)면 Sapphire//wurzite형 GaN인의 (001) 면 -t Twinned Zincblende형의 GaN(111)면

• 한국진공학회지
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• 제7권4호
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• pp.320-327
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• 1998

원격 플라즈마 화학기상증착법(Remote Plasma Enhanced-Ultrahigh Vacuum Chemical Vapor Deposition)에 의해 활성화된 질소 원자를 사용하여 사파이어 기판의 표면 을 저온에서 질화처리한 후 표면의 화학적 조성을 조사하였다. 질화처리에 의해 주로 표면 에 형성된 물질은 AIN임을 X-선 광전자 분광방법(X-ray photoelectron spectroscopy:XPS) 을 사용하여 확인하였다. 또한 플라즈마의 RF 출력, 반응 온도 및 시간에 따라서 기판의 Al 과 반응한 질소의 상대적인 양과, 표면 형태를 XPS와 AFM(atomic force microscopy)을 사 용하여 조사하였다. 플라즈마에 의해서 질소는 RF출력에 따라 증가한 후 일정하게 됨을 관 찰하였다. 그러나 질화 처리 온도와 시간의 증가에 따른 AIN의 상대적인 양은 비교적 무관 함을 관찰하였다. 또한 Ar스퍼터링을 통한 XPS의 depth profile을 관찰한 결과 질화층은 깊 이에 따라 3개의 다른 층으로 이루어져 있음을 확인하였다.

• Tribology and Lubricants
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• 제35권5호
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• pp.274-285
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• 2019

Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.489.2-489.2
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• 2014

The planar type flexible piezoelectric energy harvesters (PEH) based on PbZr0.52Ti0.48O3 (PZT) thin films on the flexible substrates are demonstrated to convert mechanical energy to electrical energy. The planar type energy harvesters have been realized, which have an electrode pair on the PZT thin films. The PZT thin films were deposited on double side polished sapphire substrates using conventional RF-magnetron sputtering. The PZT thin films on the sapphire substrates were transferred by PDMS stamp with laser lift-off (LLO) process. KrF excimer laser (wavelength: 248nm) were used for the LLO process. The PDMS stamp was attached to the top of the PZT thin films and the excimer laser induced onto back side of the sapphire substrate to detach the thin films. The detached thin films on the PDMS stamp transferred to adhesive layer coated on the flexible polyimide substrate. Structural properties of the PZT thin films were characterized using X-ray diffraction (XRD) and scanning electron microscopy (SEM). To measure piezoelectric power generation characteristics, Au/Cr inter digital electrode (IDE) was formed on the PZT thin films using the e-beam evaporation. The ferroelectric and piezoelectric properties were measured by a ferroelectric test system (Precision Premier-II) and piezoelectric force microscopy (PFM), respectively. The output signals of the flexible PEHs were evaluated by electrometer (6517A, Keithley). In the result, the transferred PZT thin films showed the ferroelectric and piezoelectric characteristics without electrical degradation and the fabricated flexible PEHs generated an AC-type output power electrical energy during periodically bending and releasing motion. We expect that the flexible PEHs based on laser transferred PZT thin film is able to be applied on self-powered electronic devices in wireless sensor networks technologies. Also, it has a lot of potential for high performance flexible piezoelectric energy harvester.

• 대한화학회지
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• 제39권1호
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• pp.1-6
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• 1995

단결정 적층막을 제조하기 위해 사용되는 사파이어 기판에 대하여 황산과 인산의 혼합용액 화학적 에칭을 조사하였다. 여러가지 배향면의 사파이어에 대한 에칭정도는 황산과 인산의 3:1 조성과 $315{\pm}2^{\circ}C$에서 에칭시간에 의존하였다. 280~320$^{\circ}C$ 범위에서 30분간씩 산에칭시킨 후에 에칭속도(R)를 구하였고, log R에 대한 $1/T$ semilog plot로부터 활성화에너지$(E_a)$를 구하였으며, 그것은 $({\bar1}012) > (10{\bar1}0) > (11{\bar2}0) > (0001)$면 순서로 감소하였다. 한편 (0001), $({\bar1}012),\;(10{\bar1}0)$과 $(11{\bar2}0)$면의 표층 두께를 각각 64.6, 46.5, 16.2와 5.1 ${\mu}m$ 에칭시킨 후의 기판 표면을 SEM으로 관찰하였다.

• 한국진공학회지
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• 제14권4호
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• pp.222-228
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• 2005

2단계 성장법으로 c-plane 사파이어 단결정 기판 위에 metalorganic chemical vapor deposition(MOCVD)법으로 undoped GaN 에피층을 성장시켰다. 고온 성장시 성장 온도 변화가 undoped GaN 에피층의 표면형상과 거칠기, 구조적 결정성, 광학적 성질, 전기적 성질에 미치는 영향을 연구하였다. 수평형 MOCVD 장치를 이용해 압력 300 Torr 저압에서 성장시켰으며, 저온 핵생성층 성장조건은 $500^{\circ}C$로 고정시키고, 2단계 성장 온도를 $850\~1050^{\circ}C$범위로 변화시켰다. 형성된 undoped GaN 에피층을 원자력현미경, 고분해능 X-선회절장치, 광발광측정, 홀 효과 측정 장치 등을 이용하여 분석, 고찰하였다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 하계종합학술대회 논문집(2)
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• pp.501-504
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• 2004

High quality GaN layer was obtained on 0001 sapphire substrate using ammonia($NH_3$) as a nitrogen source by gas source molecular beam epitaxy. As a result, RHEED is used to investigate the relaxation processes which take place during the growth of GaN. In-situ RHEED(reflection high electron energy diffraction) appeared streaky-like pattern. The full Width at half maximum of the x-ray diffraction(FWHM) rocking curve measured from plane of GaN has exhibited as narrow as 8arcmin and surface roughness was 7.83nm. Photoluminescence measurement of GaN was investigated at room temperature, where the intensity of the band edge emission is much stronger than that of deep level emission. The GaN epitaxy layer according to various growth condition was investigated.

• 센서학회지
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• 제11권6호
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• pp.371-377
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• 2002

$Y_2O_3:Eu^{3+}$ and Li-doped $Y_2O_3:Eu^{3+}$ thin films have been grown on sapphire substrates using a pulsed laser deposition technique. The thin film phosphors were deposited at a substrate temperature of $600^{\circ}C$ under the oxygen pressure of 100, 200 and 300 mTorr. The films grown under different deposition conditions have been characterized using microstructural and luminescent measurements. The crystallinity and photoluminescence (PL) of the films are highly dependent on the oxygen pressure. The PL brightness data obtained from $Y_2O_3:Eu^{3+}$ films grown under optimized conditions have indicated that sapphire is one of the most promising substrate for the growth of high quality $Y_2O_3:Eu^{3+}$ thin film red phosphor. In particular, the incorporation of $Li^{+}$ ions into $Y_2O_3$ lattice could induce a remarkable increase of PL. The highest emission intensity was observed with LiF-doped $Y_{1.84}Li_{0.08}Eu_{0.08}O_3(Y_2O_3LiEu)$, whose brightness was increased by a factor of 2.7 in comparison with that of $Y_2O_3:Eu^{3+}$ films. This phosphor may promise for application to the flat panel displays.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 디스플레이 광소자분야
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• pp.140-142
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• 2003

ZnO thin films are demanded for device applications, so ZnO buffer layer was used to improve for good properties of ZnO thin film. In this study, the structural, electrical and optical properties of ZnO thin films deposited with various buffer thickness was investigated by X-ray diffraction (XRD), Hall measurements, Photoluminescence(PL). ZnO buffer layer and ZnO thin films on sapphire($Al_{2}O_{3}$) substrate have been deposited $200^{\circ}C$ and $400^{\circ}C$ respectively by pulsed laser deposition. It is observed the variety of lattice constant of ZnO thin film by (101) peak position shift with various buffer thickness. It is founded that ZnO thin film with buffer thickness of 20 nm was larger resistivity of 200 factor and UV/visible of 2.5 factor than that of ZnO thin films without buffer layer. ZnO thin films with buffer thickness of 20 nm have shown the most properties.