• 대한기계학회논문집A
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• 제28권1호
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• pp.85-91
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• 2004

The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by chemical and mechanical polishing process. The sapphire crystalline wafers were characterized by double crystal X-ray diffraction. The sample quality of sapphire crystalline wafer at surfaces has a full width at half maximum of 89 arcsec. The surfaces of sapphire wafer were mechanically affected by residual stress during the polishing process. The wave pattern of optical interference of sapphire wafer implies higher abrasion rate in the edge of the wafer than its center from the Newton's ring.

• 한국광학회지
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• 제11권5호
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• pp.365-370
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• 2000

편광특성을 이용하여 일직선 위에서 네 번 통과하는 Ti:sapphire 레이저 증폭기를 구성하였다. 증폭기를 펌핑하는 Q-스위칭된 Nd:YAG 레이저의 제2차 고조파 에너지가 188mJ일 때 450mW의 연속 발진 Ti:sapphire 레이저가 34mJ의 에너지, 25ns의 반치폭을 갖는 펄스로 증폭되었다. 한편 Ti:sapphire 결정의 방향을 조절하는 간단한 방법으로 자발방출에 의한 증폭을 최소화할 수 있었다.

• 한국세라믹학회지
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• 제39권10호
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• pp.907-911
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• 2002

Using the two-dimensional Wulff plot, the equilibrium shape of a sapphire crystal was investigated as a function of surface energy anisotropy. Depending on the relative values of surface energy for various facet planes, the projected shape of equilibrium sapphire was determined to be rectangle, parallelogram, hexagon or octagon. The results are compared with the experimentally observed shapes of internal cavities of submicron range in sapphire single crystals.

• 열처리공학회지
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• 제30권5호
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• pp.222-226
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• 2017

Recently sapphire wafer has expected as smart phone cover material, however, brittle nature of sapphire needed edge grinding processes to prevent early initiation of cracks. Electro-deposited multi-layered groove tools with $35{\mu}m$ diamond particles were studied for sapphire wafer grinding. Solid particle flow behaviors in agitated electrolyte was studied using PIV(Particle Image Velocimetry), and uniform particle distribution in Ni bond were obtained when agitating impeller was located lower part of electrolyte. Hardness values of $400{\pm}50Hv$ were maintained for retention of diamond particles in electro-deposited bond layer. Sapphire wafer edge grinding test was carried out and multi-layered $160{\mu}m$ thick diamond tool showed much greater grinding capabilities up to 2000 sapphire wafers than single-layered $50{\mu}m$ thick diamond electro-deposited tools of 420 wafers. The reason why 3 times thicker multi-layered tools than single-layered tools showed 5 times longer tool lives in grinding processes was attributed to self-dressed new diamond particles in multi-layered tools, and multi-layered diamond tools could be promising for sapphire grinding.

• 한국광학회지
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• 제6권1호
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• pp.16-20
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• 1995

본 논문은 Nd:YAG 레이저의 제2고조파로 펄스 펌핑된 파장가변형 Ti:sapphire 레이저의 협대역 특성을 연구하였다. Ti:sapphire 레이저는 rod의 양단에서 펌핑하여 균일한 여기 분포를 갖도록 하였고, 공진기의 격자를 선형적으로 제어하여 705-835nm의 넓은 범위에서 연속적인 파장 선택을 실현하였다. 이때 회절격자 제어계의 분해각은 0.27"/pulse이다. 중심파장 790nm때 출력 에너지는 $380{\mu}J$, 레이저 출력이 최대 출력의 50% 이상되는 파장 범위는 730-825nm, 스펙트럼 선폭은 $0.13cm_{-1}$, 빔 발산각은 1.2mrad을 각각 얻었다.

• 한국정밀공학회지
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• 제22권2호
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• pp.46-52
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• 2005

The sapphire wafer was polished by the implementation of the surface machining technology based on nano-tribology, The removal process has been performed by grinding, lapping and chemical-mechanical polishing. For the chemical mechanical polishing process, the chemical reaction between the slurry and sapphire wafer was investigated in terms of the change of Zeta-potential between two materials. The Zeta-potential was -4.98 mV without the slurry in deionized water and was -37.05 mV for the slurry solution. By including the slurry into the deionized water the Zeta-potential -29.73 mV, indicating that the surface atoms of sapphire become more repulsive to be easy to separate. The average roughness of the polished surface of sapphire wafer was ranged to 1∼4$\AA$.

• Journal of Electrical Engineering and Technology
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• 제13권2호
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• pp.886-891
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• 2018

Colloid silica using as abrasive for polishing sapphire has been extensively studied, which mechanism has also been deeply discussed. However, by the requirement of application enlargement and cost reduction, some new problems appear such as silica service life time, particle diameter mixing, etc. In this paper, several influences of colloid silica usage on sapphire CMP are examined. Results show particle diameter and concentration, pH value, service life time, particle diameter mixing heavily influence removal rate. Further analysis discloses there are two main effect aspects which are quantity of hydroxyl group, contact area for abrasive density stacking between abrasive and sapphire. Based on the discussions, a dynamic process of sapphire polishing is proposed.

• 한국재료학회지
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• 제14권5호
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• pp.363-367
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• 2004

Recently ZnO epitaxial layers have been widely studied as a semiconductor material for optoelectronic devices. Sapphire and silicon are commonly selected as substrate materials for ZnO epitaxial growth. In this communication, we report the effect of the ECR plasma pretreatment of sapphire and silicon substrates on the nucleation in the ZnO ALE (atomic layer epitaxy). It was found that ECR plasma pretreatment reduces the incubation period of the ZnO nucleation. Oxygen ECR plasma enhances ZnO nucleation most effectively since it increases the hydroxyl group density at the substrate surface. The nucleation enhancing effect of the oxygen ECR plasma treatment is stronger on the sapphire substrate than on the silicon substrate since the saturation density of the hydroxyl group is lower at the sapphire surface than that at the silicon surface.

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2004년도 추계총회 및 연구발표회 초록집
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• pp.97.1-97.1
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• 2004

• 한국세라믹학회지
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• 제40권6호
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• pp.539-546
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• 2003

GaN/사파이어 박막구조는 높은 SAW속도로 인해 고주파 소자로 이용될 가능성이 있다. 일반적으로, GaN 박막은 사파이어의 c, a, 그리고 r-면에 성장한다. 본 연구에서는 사파이어의 기판과 GaN 박막사이의 결정학적 관계에 따라 GaN/사파이어 구조의 파동 방정식을 계산하였다. 각각의 면에서, GaN의 kH와 사파이어의 기판방향에 따라 전단속도가 변화하였다. 그 결과 r-면의 경우 전기기계결합계수가 우수했다. 즉, 재료의 탄성상수와 전기기계결합계수는 기판의 cut 방향과 방향성에 좌우된다. 또한, GaN/r-면 사파이어는 전기기계결합계수가 우수하므로 고주파수 대역 SAW 소자 응용에 보다 더 좋을 것이다.