• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.262-263
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• 2007

In this paper, fully embedded and miniaturized diplexer has been designed, fabricated, and characterized for dual-band/mode CDMA handset applications. The size of the embedded diplexer is significantly reduced by embedding high Q circular spiral inductors and high DK MIM capacitors into low cost organic package substrate. The fabricated diplexer has insertion losses and isolations of -0.5 and -23dB at 824-894MHz and -0.7 and -22dB at 1850-1990MHz, respectively. Its size is 3.9mm$\times$3.9mm$\times$ 0.77mm (height). The fabricated diplexer is the smallest one which is fully embedded into low cost organic package substrate.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.71-71
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• 2010

Copper oxide thin films were deposited on the p-type Si(100) by r.f. magnetron sputtering as a function of different substrate temperature. The deposited copper oxide thin films were investigated by atomic force microscopy (AFM), scanning electron microscopy (SEM), spectroscopic ellipsometry (SE), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS). The SEM and SE data show that the thickness of the copper oxide films was about 170 nm. AFM images show that the surface roughness of copper oxide films was increased with increasing substrate temperature. As the substrate temperature increased, monoclinic CuO (111) peak appeared and the crystal size decreased while the monoclinic CuO (-111) peak was independent on the substrate temperature. The oxidation states of Cu 2p and O 1s resulted from XPS were not affected on the substrate temperature. The contact angle measurement was also studied and indicated that the surface of copper oxide thin films deposited high temperature has more hydrophobic surface than that of deposited at low temperature.

• 반도체디스플레이기술학회지
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• 제6권1호
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• pp.1-6
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• 2007

In order to raise productivity of the OLED and realization of the OLED TV, the enlargement of the mother glass substrate is required. The large-size glass substrate has some difficulties regarding its deflection during handling operation due to its thin thickness (0.5$\sim$0.7t) which is not even enough to stand its mass itself. This paper is demonstrating a new solution of this difficult through clamping and bending boundary condition, which helps to minimize the deflection of the glass substrate. Based on the developed method, the experiments had been done for verifying the proposed method to minimize the glass-deflection. With the developed method, the new design of glass substrate handler can be proposed to allow the large OLED displays be manufactured.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.407-410
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• 2003

We will introduce our new concept deposition system for SMOLED manufacturing in this conference. This system is designed to deposit organic and metal material to downward to overcome the limit of substrate size and process tact time hurdle for OLED mass production, and is organized with organic deposition chamber, substrate pre-cleaning chamber, metal deposition chamber and encapsulation system. These entire process chambers are integrated with linear type substrate transfer system. We also compare our new SMOLED manufacturing system with conventional vacuum deposition systems, and show basic organic thin film property data, organic material deposition property data, and basic device property.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2007년도 SMT/PCB 기술세미나
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• pp.37-47
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• 2007

Factor : Structure Metal pad & SMO size Board level TC test : - Large SMO size better Board level Drop test : - Large SMO size better Factor : Structure Substrate thickness Board level TC test : - Thick substrate better Board level Drop test : - Substrate thickness is not a significant factor for drop test Factor : Material Solder alloy Board level TC test : - Not so big differences over Pb-free solder and NiAu, OSP finish Board level Drop test : - Ni/Au+SAC105, CuOSP+LF35 are better Factor : Material Pad finish Board level TC test : - NiAu/NiAu is best Board livel Drop test : - CuOSP is best Factor : Material Underfill Board level TC test - Several underfills (reworkable) are passed TCG x500 cycles Board level Drop test : - Underfill lots have better performance than non-underfill lots Factor : Process Multiple reflow Board level TC test : - Multiple reflow is not a significant actor for TC test Board level Drop test : N/A Factor : Process Peak temp Board level TC test : - Higher peak temperature is worse than STD Board level Drop test : N/A Factor : Process Stack method Board level TC test : - No big difference between pre-stack and SMT stack Board level Drop test : - Flux dipping is better than paste dipping but failure rate is more faster

• 전기학회논문지P
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• 제67권1호
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• pp.33-36
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• 2018

The purpose of this study is to improve the efficiency of anti-pollution film for PV module. The anti-pollution coating process was performed on a glass substrate, which is the same material as the glass substrate for the PV module. We coated the anti-pollution film on the glass substrate by spray coating. After coating process, annealing process was performed during 1 hour at $200^{\circ}C$, $300^{\circ}C$, and $400^{\circ}C$. And then we analyzed the surface characteristics according to the annealing temperature of the film. Annealing process can also improve the durability of the coated film. And then we analyzed the anti-pollution characteristics, particle size of anti-pollution film, light transmittance. The particle size of anti-pollution film was analyzed with FE-SEM. The light transmittance was analyzed with UV-Visible spectroscopy including integrating sphere.

• 한국전기전자재료학회논문지
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• 제21권9호
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• pp.848-852
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• 2008

Characteristics of microcrystalline-silicon thin-films deposited by plasma-enhanced chemical-vapor deposition (PECVD) method were studied. There were optimum values of RF power density and $H_2$ dilution ratio $(H_2/(SiH_4+H_2))$; maximum grain size of about 35 nm was obtained at substrate temperature of 250 $^{\circ}C$ with RF power density of 1.1 W/$cm^2$ and $H_2$ dilution ratio of 0.91. Larger grain was obtained with higher substrate temperature up to 350 $^{\circ}C$. Grain size dependence on RF power density and $H_2$ dilution ratio could be explained by etching effects of hydrogen ions and changes of species of reactive precursors on growing surface. Surface-mobility activation of reactive precursors by temperature could be a reason of grain-size dependence on the substrate temperature. Microcrystalline-silicon thin-films that could be used for flat-panel electronics such as active-matrix organic-light-emitting-diodes are expected to be fabricated successfully using these results.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 하계학술대회 논문집 C
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• pp.1573-1575
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• 2004

An alumina membrane with nano-sized pores was fabricated by anodic oxidation. The shape and structure of the pore on alumina membrane were changed according to the roughness of aluminum surface. The shape and structure of the nano-sized pre were investigated according to purity of aluminum substrate for the anodization process. The aluminum substrates with 99.5% and 99.999% purities were used. The aluminum substrate(99.5%) was anodized after the processes of pressing, mechanical polishing, chemical polishing, and electrochemical polishing. The nano-sized pores with the pore size of 50 - 100nm, the cell size of 20-50nm and the thickness of $10{\mu}m{\sim}45{\mu}m$ were obtained. Even though the electrochemical polishing was used for the aluminum substrate (99.999%), the same characteristics as the aluminum substrate (99.5%) was obtained. The alumina membrane prepared by anodization for 5 min using fixed voltage method shows the pore with irregular shape. The pore shape was changed to regular shape after pore widening process.

• 반도체디스플레이기술학회지
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• 제5권4호
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• pp.11-15
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• 2006

Expose equipment system that is used for manufacturing process of Flat Panel Display, is most important equipment in whole process. Expose equipment that is for making pattern of mask on substrate, consists of optical part, stage part and transport part. The stage is an important part that aligns mask and substrate for delivering pattern of mask to substrate exactly. In this paper, control system of expose stage that is able to use mask and substrate of diverse size, with PC controller using GUI interface instead of PLC control system. The existing PLC control system does not have the suitable structure for using mask of diverse size. GUI interface integration control system is based on PC. So it has the advantage of convenient use and active operation. We embodied PLC control system in integration control system based on PC, and verified utility possibility through the standard test course.

• 인간식물환경학회지
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• 제24권5호
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• pp.499-507
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• 2021

Background and objective: This study was carried out to develop an effective technique for raising seedlings of Veronica pyrethrina Nakai, a native plant species in the Korean Peninsula, in plug trays. Methods: To investigate the optimum plug cell size and sowing media, we sowed seed in to plug trays with 34, 21, and 10 mL cells and filled with a commercial horticultural substrate and mixtures of peatmoss and perlite in 1:1, 3:1, and 4:1 ratios. Fertilization levels were set at 0, 500, 1000 and 2000 mg·L^-1. Results: Plug cell size did not significantly influence the seedling growth of V. pyrethrina. By substrate type, the growth rate was highest in the horticultural substrate, followed by 4:1, 3:1, and 1:1. Growth by fertilization level was higher in all fertilized treatment groups than in the control group, and there was no difference among 500, 1000, and 2000 mg·L^-1. Conclusion: The results of this study proved that it is most suitable for raising seedlings of V. pyrethrina to sow the seeds in a 10 mL cell plug tray filled with horticultural substrates, and apply fertilizers with less than 500 mg·L^-1 concentration.