• 전기학회논문지P
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• 제64권4호
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• pp.277-280
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• 2015

In this paper, we have studied the surface property and transmittance of n- and p-type thin film deposited on ITO substrate. In n-type samples, the average particle size was large and uniform as RF power was increased, and the best results were shown at the condition of the temperature of $300^{\circ}C$ and 200 W of RF power. The transmittance of the sample deposited for 20 minutes was 74.82% and the light wave was increased to 800 nm. In p-type samples, the results were 71.21% and 789 nm at the deposition condition of the RF power of 250 W and the temperature of $250^{\circ}C$.

• Journal of Advanced Marine Engineering and Technology
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• 제35권4호
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• pp.483-490
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• 2011

본 논문에서는 주기적 접지구조(PAGS)를 이용하여 실리콘 RFIC 반도체 기판상에 다단 임피던 스변환기를 제작 평가하였다. 제작된 임피던스변환기의 면적은 종래의 약 8.7 %인 0.026 $mm^2$이며, 8 ~ 49.5 GHz의 범위에서 양호한 RF특성을 보여주었다.

• Advances in concrete construction
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• 제6권3호
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• pp.285-296
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• 2018

In the present paper, the results of an experimental study of the bond between repair materials and mortar substrate subjected to hot climate is presented. Half-prisms of size $40{\times}40{\times}80mm$, serving as a substrate mortar samples (SUBM) were manufactured in the laboratory and then stored at an ambient temperature for 6 months. Five self compacting mortar mixes (SCMs) incorporating 0%, 10%, 20%, 30%, and 40% of natural pozzolana as white cement replacement were used as repair materials. Repaired composite samples (SCMs/SUBM) were cured at hot climate for different lengths of time (28 and 56-days). During the first week of curing, the composite samples were watered twice a day. The test carried out to assess the bond between SCMs and SUBM was based on three-point bending (3 PB) test. The obtained results have proved that it was feasible to produce compatible repair materals in this curing environment by using up to 30% natural pozzolana as white cement replacement.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 The 8th Asian Symposium on Precision Forging ASPF
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• pp.189-192
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• 2003

The Electro-thermal Explosion Coating (EEC) technique is a new surface treatment technology emerged in recent years. It uses an electrical discharge (with very high voltage from 5 to 30 kV or more) to produce a pulse current with large density inside the material to be deposited, the metal wire undergo the heating, melting, vaporization, ionization and explosion processes in a very short time (from tens ns to several hundreds ${\mu}s$), and the melted droplets shoot at the substrate with a very high velocity (3000 - 4500 m/s), so that the coating materials can be deposited on the surface of the substrate. Coatings with nano-size grains or ultra- fine grains can be formed because of rapid solidification (cooling rate up to $10^6-10^9\;k/s$). Surface of the substrate (about $1-5{\mu}m$ in depth) can be melted rapidly and coatings with very high bonding strength can be obtained.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.892-896
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• 2005

In this paper, key issues of stainless steel foil substrates for display applications have been described. We studied and analyzed technical issues on substrate passivation/planarization to control surface roughness and capacitive coupling from conductive substrates. A thick (either multiple or single) passivation/planarization layer needs to be applied on the nonelectronic-grade stainless steel substrate to provide a smooth surface and electrical insulation from the conductive substrate. Especially for large size, high-resolution display applications, low k and thick passivation/planarization layers should be used for appropriate capacitive coupling. Based on our initial study, a unit area capacitance of less than $2nF/cm^2$ of passivation/planarization layers is needed for 32" HD TV OLED displays.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 1999년도 추계 기술심포지움 논문집
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• pp.111-115
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• 1999

The $Li_2O-MgO-MgF_2-SiO_2$glasses with addition of $B_2O_3$ were investigated in order to make glass-ceramics for low temperature firing substrate. Glasses were made by melting at $1450^{\circ}C$ in the electronic furnace and crystallized at $750^{\circ}C$. After the crystallization, crystal phases and microstructure were observed. The crystal phases were polycrystalline of lithium boron fluorphlogopite and lithium fluorhectorite. The crystal shape was changed to grande type from needle type with the increase in $B_2O_3$ contents. Average particle size of the glass-ceramics aftar water swelling was $3.77{\mu}{\textrm}{m}$. The optimum sintering temperature and sintering shrinkage of the substrate were $900^{\circ}C$ and 13.4vol%, respectively.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.79-94
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• 2002

Root cause -Thermal expansion coefficient mismatch -Tape warpage -Initial die crack (die roughness) Guideline for failure prevention -Optimized tape/Substrate design for minimizing the warpage -Fine surface of die backside Root cause -Thermal expansion coefficient mismatch - Repetitive bending of a signal trace during TC cycle - Solder mask damage Guideline for failure prevention - Increase of trace width - Don't make signal trace passing the die edge - Proper material selection with thick substrate core Root cause -Thermal expansion coefficient mismatch -Creep deformation of solder joint(shear/normal) -Material degradation Guideline for failure Prevention -Increase of solder ball size -Proper selection of the PCB/Substrate thickness -Optimal design of the ball array -Solder mask opening type : NSMD -In some case, LGA type is better

• 한국세라믹학회지
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• 제27권2호
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• pp.249-255
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• 1990

High Tc Supperconducting thin films were fabricated by rf magnetron sputtering method. We have successfully controlled the compositions of films by adding sintered CuO pellets on YBa2Cu3O7-x single target. High Tc thin films with large grian size and good crystal habit were obtained by rapid thermal annealing process. The films deposited on SrTiO3(100) single crystal substrate indicated the existence of c-axis prefered orientation confirmed by XRD and SEM analysis. The Tc, zero's of sharp resistive transition for rapid annealed films deposited on polycrystalline YSZ substrate and on SrTiO3(100) single crystal substrate were 79K and 88K, respectively.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1950-1953
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• 1996

A $1\;{\times}\;4$ micro mirror array is designed and fabricated. In contrast to other micro mirrors which utilize torsional flexure hinges or cantilevers for restoring torque and supporting purpose, we have placed a substrate hinge structure under each mirror. Each micro mirror consists of address electrode, substrate hinge consisting of pin and staple, supporter post, and mirror plate. Electrical connection between mirror plate and ground electrode is established by substrate hinge. Mirror undergoes a rotational motion due to electrostatic force when voltage difference is applied between address electrode and mirror plate. Micro mirrors with two different types of staple shape and two different pin sizes are designed and fabricated. Each mirror is designed to have ${\pm}\;10^{\circ}$ of deflection angle and have $100\;{\times}\;110\;{\mu}m^2$ of size.

• 대한화학회지
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• 제14권2호
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• pp.161-168
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• 1970

In order to obtain the more effective evidence, supporting the hypothesis which have been previously described by former report that pepsin (EC 3.4. 4.1) forms a hydrophobic bond with the nonpolar side chain of its substrate, the inhibitory effect of carboxylic acids(from formic acid to iso-butyric acid) on the activity of pepsin to the synthetic dipeptide, N-Carbobenzoxy-L-glutamyl-L-tyrosine, was discussed. The kinetic study showed that the inhibition by carboxylic acids was competitive. The Kidecreased with increasing size of the inhibitor molecule. The $-{\Delta}F^{\circ}$increased linearly with increasing number of carbon atoms in the hydrocarbon chain of the inhibitor. It was confirmed that the hydrophobic bond between more than one side chain of amino acid residues(phenylalanine) in the binding region of the active center of pepsin and the side chain of amino acid residues in the substrate was formed as the first step of its enzymic mechanism. The inhibitory effect of carboxylic acids was due to the competition of the hydrocarbon group of the carboxylic acids with the side chain of the substrate for the hydrophobic binding site(the side chain of phenylalanine) of the pepsin.