한국정보디스플레이학회:학술대회논문집
- 2005.07b
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- Pages.892-896
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- 2005
Stainless Steel Foil Substrates; Robust, Low-Cost, Flexible Active-Matrix Backplane Technology
- Hong, Yong-Taek (Research and Development, Eastman Kodak Company) ;
- Heiler, Gregory (Research and Development, Eastman Kodak Company) ;
- Cheng, I-Chun (Dept. of Electrical Engineering, Princeton University) ;
- Kattamis, Alex (Dept. of Electrical Engineering, Princeton University) ;
- Wagner, Sigurd (Dept. of Electrical Engineering, Princeton University)
- Published : 2005.07.19
Abstract
In this paper, key issues of stainless steel foil substrates for display applications have been described. We studied and analyzed technical issues on substrate passivation/planarization to control surface roughness and capacitive coupling from conductive substrates. A thick (either multiple or single) passivation/planarization layer needs to be applied on the nonelectronic-grade stainless steel substrate to provide a smooth surface and electrical insulation from the conductive substrate. Especially for large size, high-resolution display applications, low k and thick passivation/planarization layers should be used for appropriate capacitive coupling. Based on our initial study, a unit area capacitance of less than
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