• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.11 no.8
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• pp.1355-1362
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• 2000

Microstrip antennas are attractive for many applications because of their compact size, low profile, and light weight. Recently, the demand for the miniaturization of the personal communication equipment has been increasing along with the proliferation of personal communication systems. Thus, the development of small antenna has been highly demanded. In this paper, a new technique to reduce the overall dimension of a microstrip antenna with a locally non-homogeneous substrate configuration is proposed. The miniaturized microstrip antenna for a repeater system in a mobile communication cellular band(824~894 MHz) is designed with the proposed technique, and commercialized with low cost, light weight, and small size. Comparison between simulations, based on Agilent Technologies HFSS software, and measurements are provided. The proposed method will be more attractive for a light-weight, small-size, and low-cost microstrip array design. This paper also presents the bandwidth improvement technique for under-coupled microstrip patch antenna with a tuning stub.

• Journal of the Korean Society of Clothing and Textiles
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• v.34 no.4
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• pp.653-662
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• 2010

This study investigates the effect of particle size on the detergency of particulate soil using an $\alpha-Fe_2O_3$ particle as the model. Monodispersed spherical $\alpha-Fe_2O_3$ particles were prepared by the hydrothermal aging of an acidic $FeCl_3$ and HCl solution. The $\xi$-potential of PET fiber was measured by the streaming potential method. The potential energy of interaction between the particle and fiber was calculated using the heterocoagulation theory for a sphere-plate model. The $\xi$-potential of PET fiber and potential energy of interaction between particles and fiber increased with a decreasing particle size in a DBS solution. However, in the nonionic surfactant solution, the $\xi$-potential signs of PET fiber and $\alpha-Fe_2O_3$ particles were (-) and (+), respectively; there was no repulsive power between the particles and substrate. The adhesion of particles to the fabric increased with increasing particle size in the anionic surfactant solution and their removal from the fabric increased with a decreasing particle size. The adhesion of particles to the fabric and their removal from the fabric was biphasic with a maximum and minimum at 0.1% concentration of the surfactant solution. In the nonionic surfactant solution the adhesion of particles to fabric and their removal from the fabric were greater than the ones in the anionic surfactant DBS solution.

• Korean Journal of Materials Research
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• v.24 no.8
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• pp.429-433
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• 2014

As the fabrication technology used in FPDs(flat-panel displays) advances, the size of these panels is increasing and the pattern size is decreasing to the um range. Accordingly, a cleaning process during the FPD fabrication process is becoming more important to prevent yield reductions. The purpose of this study is to develop a FPD cleaning system and a cleaning process using a two-phase flow. The FPD cleaning system consists of two parts, one being a cleaning part which includes a two-phase flow nozzle, and the other being a drying part which includes an air-knife and a halogen lamp. To evaluate the particle removal efficiency by means of two-phase flow cleaning, silica particles $1.5{\mu}m$ in size were contaminated onto a six-inch silicon wafer and a four-inch glass wafer. We conducted cleaning processes under various conditions, i.e., DI water and nitrogen gas at different pressures, using a two-phase-flow nozzle with a gap distance between the nozzle and the substrate. The drying efficiency was also tested using the air-knife with a change in the gap distance between the air-knife and the substrate to remove the DI water which remained on the substrate after the two-phase-flow cleaning process. We obtained high efficiency in terms of particle removal as well as good drying efficiency through the optimized conditions of the two-phase-flow cleaning and air-knife processes.

• Journal of Environmental Science International
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• v.33 no.2
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• pp.139-160
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• 2024

The community structure of benthic macroinvertebrates in the Madongho Wetland protected area and inflow river located in Goseong-gun, Gyeongsangnam-do, was investigated in 2022 and 2023. We collected and identified 3,582 individuals belonging to 7 classes, 23 orders, 51 families, and 78 species over the 2 years from six sites. Gnorimosphaeroma naktongense was the dominant species with a ratio of 20%, and Caridina denticulata denticulata was the subdominant species with a ratio of 13.32%. Predators and gathering collectors were the most abundant in the functional feeding group, while sprawlers were the most diverse and numerous in the habitual dwelling group. Diversity, richness, dominance, and evenness were calculated as the biological indices. In addition, various biological water quality indices were calculated. Most insects in the inflow rivers belonged to group I in evaluating relative resistance and resilience, showing high colony stability. The results of analyzing the correlation between salinity and substrate particle size with brackish water species showed that Gnorimosphaeroma naktongense and Hediste japonica had a significant positive correlation with salinity, while Assiminea lutea and Neomysis awatschensis had a significant positive correlation with substrate particle size. Additionally, Sinelobus kisui was found to be a new record of Korean Tanaididae in this study.

• Progress in Superconductivity
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• v.6 no.1
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• pp.64-68
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• 2004

We fabricated cube-textured Ni and Ni-W alloy substrates for coated conductors and characterized the effects of W addition on microstructure, mechanical strength, and magnetic properties of the substrate. Pure Ni and Ni-(2, 3, 5at.%)W alloys were prepared by plasma arc melting, heavily cold rolled and then annealed at various temperatures of $600-1300^{\circ}C$. The texture was evaluated by pole-figure and orientation distribution function (ODF) analysis. Mechanical properties were investigated by micro Vickers hardness and tension test. Ferromagnetism of the substrate was measured by physical property measurement system (PPMS). It was observed that Ni-W substrates had sharp cube texture, and the full-width at half-maximums (FWHMs) of in-plane texture was $^{\circ}$-5.57$4.42^{\circ}$, which is better than that of pure Ni substrate. In addition cube texture of Ni-W substrates was retained at higher temperature up to $1300^{\circ}C$. Microstructural observation showed that the Ni-W substrates had fine grain size and higher mechanical properties than the pure Ni substrate. These improvements are probably due to strengthening mechanisms such as solid solution hardening and/or grain size strengthening. PPMS analysis showed that addition of W effectively reduced saturation magnetization in applied magnetic field and Curie temperature.

• Korean Journal of Materials Research
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• v.21 no.1
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• pp.21-27
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• 2011

A nano-porous structure of tin oxide was prepared using an anodic oxidation process and the sample's electrochemical properties were evaluated for application as an anode in a rechargeable lithium battery. Microscopic images of the as-anodized sample indicated that it has a nano-porous structure with an average pore size of several tens of nanometers and a pore wall size of about 10 nanometers; the structural/compositional analyses proved that it is amorphous stannous oxide (SnO). The powder form of the as-anodized specimen was satisfactorily lithiated and delithiated as the anode in a lithium battery. Furthermore, it showed high initial reversible capacity and superior rate performance when compared to previous fabrication attempts. Its excellent electrode performance is probably due to the effective alleviation of strain arising from a cycling-induced large volume change and the short diffusion length of lithium through the nano-structured sample. To further enhance the rate performance, the attempt was made to create porous tin oxide film on copper substrate by anodizing the electrodeposited tin. Nevertheless, the full anodization of tin film on a copper substrate led to the mechanical disintegration of the anodic tin oxide, due most likely to the vigorous gas evolution and the surface oxidation of copper substrate. The adhesion of anodic tin oxide to the substrate, together with the initial reversibility and cycling stability, needs to be further improved for its application to high-power electrode materials in lithium batteries.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.4
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• pp.357-365
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• 2013

The 4 by 4 series slot sub-array antenna is proposed using substrate integrated waveguide(SIW) technology for 35 GHz of Ka band application. The proposed antenna is realized with multi-layered structure for compact size and easy integration features. 4 by 4 radiating slots are arrayed on top PCB with equal spacing and the feeding SIWs are arranged on middle and bottom PCBs for uniform power distribution. The multi-layered antenna is realized using RT/Duroid 5880 that has dielectric constant of 2.2 and the total antenna size is $750.76mm^2$. The individual parts such as radiators and feeding networks are simulated using full-wave simulator CST MWS. Furthermore, the total sub-array antenna also fabricated and measured the electrical performances such as impedance bandwidth under the criteria of -10 dB(490 MHz), maximum gain(18.02 dBi), sidelobe level(SLL)(-11.0 dB), and cross polarization discrimination (XPD)(-20.16 dB).

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• Transactions on Electrical and Electronic Materials
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• v.16 no.1
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• pp.10-15
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• 2015

A thin-film transmission line (TFTL) employing a microstrip line/coplanar waveguide (ML/CPW) was fabricated on a silicon substrate for application to a miniaturized on-chip RF component, and the RF characteristics of the device with the proposed structure were investigated. The TFTL employing a ML/CPW composite structure exhibited a shorter wavelength than that of a conventional coplanar waveguide and that of a thin-film microstrip line. When the TFTL with the proposed structure was fabricated to have a length of ${\lambda}/8$, it showed a loss of less than 1.12 dB at up to 30 GHz. The improvement in the periodic capacitance of the TFTL caused for the propagation constant, ${\beta}$, and the effective permittivity, ${\varepsilon}_{eff}$, to have values higher than those of a device with only a conventional coplanar waveguide and a thin film microstrip line. The TFTL with the proposed structure showed a ${\beta}$ of 0.53~2.96 rad/mm and an ${\varepsilon}_{eff}$ of 22.3~25.3 when operating from 5 to 30 GHz. A highly miniaturized impedance transformer was fabricated on a silicon substrate using the proposed TFTL for application to a low-impedance transformation for broadband. The size of the impedance transformer was 0.01 mm2, which is only 1.04% of the size of a transformer fabricated using a conventional coplanar waveguide on a silicon substrate. The impedance transformer showed excellent RF performance for broadband.

• Journal of the Korean Ceramic Society
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• v.36 no.1
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• pp.21-29
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• 1999

The effects of density and pore size distribution of substrate in preparing SiC conversiton layer on graphite substrate were investigated. The chemical reaction for formation of SiC conversion layer was occurred at substrate surface or below surface through SiC gas infiltration. It was supposed that the pore size distribution required for the sufficient SiO gas infiltration and the continuous chemical reaction during conversion process was in the range of 1.0∼10.0$\mu\textrm{m}$. In the stress analysis of SiC layer with finite element method (FEM), the residual stress distribution due to thermal mismatch was shown. However, the compressive stress was measured in SiC layer by X-ray diffraction, it was presumed that the residual stress distribution of SiC layer was mainly influenced by the constraining effect of interlayer between SiC layer and graphite substrate, and the densification behaviro and the grain growth in SiC conversion layer.