• 한국자동차공학회논문집
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• 제22권3호
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• pp.90-96
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• 2014

The conventional SnPb solders were widely used for several decades in the electronic packing system due to the superior mechanical properties such as low melting point, better wettavility and good mechanical fatigue. However, in recent years, owing to adverse effect on the human health and environment, conventional SnPb solders have been replaced by Lead-free solders. In this research, the shear punch(SP) test of Sn-4Ag-(Cu)/Ni pad was performed. Pb-free solder alloys which are the environmentally friendly of the electronic components were performed at $150^{\circ}C$ for 100hr~1000hr to artificial aging processing. In order to evaluate the mechanical properties of solder joints, the SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of almost the whole specimens was decreased with the increase in aging time and temperature of SP test. The mechanical properties of Sn-4Ag-0.5Cu solder were most excellent in all Pb-free solder which were produced by the SP test at $30^{\circ}C$.

• 대한기계학회논문집A
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• 제30권1호
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• pp.8-17
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• 2006

When subjected to severe shear deformation by ECAP, microstructure of Al2024 becomes extremely refined. To measure the strength of that, small punch(SP) testing method was adopted as a substitute for the conventional uniaxial tensile testing because the size of material processed by ECAP were limited to ${\psi}12\;mm$ in transverse direction. SP tests were performed with specimens in longitudinal and transverse directions of Al2024 ECAP metal. For comparing the strength values with those assessed by SP tests, uniaxial tensile tests were also conducted with specimens in longitudinal direction. Failure surfaces of the tested SP specimens showed that failure mode was shear deformation and Al 2024 ECAP metal has an anisotropy in strength. Thus, conventional equations proposed for assessing the strength characteristics were improper to assess those of Al2024 ECAP metal. In this paper a way of assessing the strength of Al 2024 ECAP metal was proposed and was proven to be effective.

• 한국자동차공학회논문집
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• 제21권1호
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• pp.145-153
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• 2013

In this study, shear punch-creep (SP-Creep) at Sn-4Ag/Cu pad the joint was tested by using environment-friendly Pb-free solder alloy Sn-4Ag of electronic components. Pb eutectic alloy (Sn-37Pb) joints limited to environmental issues with reflow time (10sec, 30sec, 100sec, 300sec) according to two types of solder alloy joints are compared and evaluated by creep strain rate, rupture time and IMC (Intermetallic Compound) behavior. As the results, reflow time increases with increasing thickness of IMC can be seen at overall 100sec later in case of two solder joints on the IMC thickness of Sn-4Ag solder joints thicker than Sn-37Pb solder joints. In addition, when considering creep evaluation factors, lead-free solder alloy Sn-4Ag has excellent creep resistance more than Pb eutectic alloy. For this reason, the two solder joints, such as in the IMC (Cu6Sn5) was formed. However, the creep resistance of Sn-4Ag solder joints was largely increased in the precipitation strengthening effect of dispersed Ag3Sn with interface more than Sn-37Pb solder joints.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.283-286
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• 2005

When subjected to severe shear deformation by ECAP, microstructure of Al2024 becomes nanocrystalline grained texture material. To measure the strength of that, small punch (SP) testing method was adopted as a substitute for the conventional uniaxial tensile testing because the size of material processed by ECAP were limited to $\varphi12mm$ in transverse direction. SP tests were performed with specimens in longitudinal and transverse directions of Al 2024 ECAP metal. For comparing the strength values with those assessed by SP tests, uniaxial tensile tests were also conducted with specimens in longitudinal direction. Failure surfaces of the tested SP specimens showed that failure mode was shear deformation and Al 2024 ECAP metal has an anisotropy in strength. Thus, conventional equations proposed for assessing the strength characteristics were improper to assess those of Al2024 ECAP metal. In this paper a way of assessing the strength of Al 2024 ECAP metal was proposed and was proven to be effective.

• 한국자동차공학회논문집
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• 제21권3호
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• pp.134-141
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• 2013

Reflow soldering process is essential in electronic package. Reflow process for a long time results from the decrease of reliability because IMC is formed excessively. Solder alloys of Sn-37Pb and Sn-Ag with different kinds of Cu contents (0, 0.5 and 1 wt.%) as compared with Ni and Cu plate joints are investigated according to varying reflow time. The interfaces of solder joints are observed to analyze IMC (intermetallic compound) growth rate by scanning electron microscope (SEM). Shear test is also performed by using SP (Share-Punch) tester. The test results are compared with the solder joints of two different plates (Ni and Cu plate). $Cu_6Sn_5$ IMCs are formed on Cu plate interfaces after reflows in all samples. Ni3Sn4 and $(Cu,Ni)_6Sn_5$ IMCs are also formed on Ni plate interfaces. The IMC layer forms are affected by reflow time and contents of solder alloy. These results show that mechanical strength of solder joints strongly depends on thickness and shape of IMC.

• 대한기계학회논문집A
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• 제39권5호
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• pp.467-471
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• 2015

최근까지, 전자제품에 사용되는 솔더는 납성분이 남아 있으며, 전자부품 및 시스템의 무연 (Pb-free) 솔더에 대한 관심은 반도체 및 전자산업에서 증가하고 있다. 본 논문에서 사용된 솔더접합부는 Sn-37Pb, Sn-4Ag 및 Sn-4Ag-0.5Cu/Ni 기판 이다. 인공시효처리는 $150^{\circ}C$에서 각각 0hr, 100hr, 200hr, 400hr, 600hr 그리고 1000hr 동안 수행되었으며, SP 시험을 이용해 $30^{\circ}C$와 $50^{\circ}C$에서 접합강도를 평가했다. 전단강도는 인공시효시간과 온도가 증가함에 따라 전반적으로 감소하였다. 무연솔더는 Sn-37Pb 보다 총파괴 에너지가 높았으며, Sn-4Ag-0.5Cu/Ni 접합부는 고온에서 기계적 물성치가 가장 우수하였다.