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http://dx.doi.org/10.3795/KSME-A.2015.39.5.467

Evaluation of Mechanical Property for Pb-free Solder/Ni Plate Joints with Artificial Aging Time  

Park, So Young (School of Mechanical System Engineering, Chonbuk Nat'l Univ.)
Yang, Sung Mo (School of Mechanical System Engineering, Chonbuk Nat'l Univ.)
Yu, Hyo Sun (School of Mechanical System Engineering, Chonbuk Nat'l Univ.)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.39, no.5, 2015 , pp. 467-471 More about this Journal
Abstract
Thus far, solders used in electronics remain lead-based. Pb-free solutions in electronic components and systems are receiving increased attention in the semiconductor and electronics industries. Pb-free materials currently in used are Sn-37Pb, Sn-4Ag and Sn-4Ag-0.5Cu/Ni plate joints. In this study, solder alloys were used at high temperatures for artificial aging processing that was performed at $150^{\circ}C$ for 0hr, 100hr, 200hr, 400hr, 600hr and 1000hr. The SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of all the specimens decreased with the increase in artificial aging time and temperature of the SP test. In addition, Pb-free solders showed higher total fracture energy compared with Sn-37Pb at high temperatures. The mechanical properties of Sn-4Ag-0.5Cu solder/Ni plate joints remained in excellent conditions in electronic parking systems at high temperatures.
Keywords
Pb-free Solder Joint; SP Test(Shear-Punch Test); Artificial Aging; Shear Strength; Total Fracture Energy;
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Times Cited By KSCI : 2  (Citation Analysis)
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