• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.39-44
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• 2008

In this paper, fully embedded 2.4GHz WLAN band pass filter (BPF) was investigated into a multi-layered organic packaging substrate using high Q spiral stacked inductors and high Dk MIM capacitors for low cost RF System on Package (SOP) applications. The proposed 2.4GHz WLAN BPF was designed by modifying chebyshev second order filter circuit topology. It was comprised of two parallel LC resonators for obtaining two transmission zeros. It was designed by using 2D circuit and 3D EM simulators for finding out optimal geometries and verifying their applicability. It exhibited an insertion loss of max -1.7dB and return loss of min -l7dB. The two transmission zeros were observed at 1.85 and 6.7GHz, respectively. In the low frequency band of $1.8GHz{\sim}1.9GHz$, the stop band suppression of min -23dB was achieved. In the high frequency band of $4.1GHz{\sim}5.4GHz$, the stop band suppression of min -l8dB was obtained. It was the first embedded and the smallest one of the filters formed into the organic packaging substrate. It has a size of $2.2{\times}1.8{\times}0.77mm^3$.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.201-204
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• 2007

In this paper, fully embedded and miniaturized diplexer device has been developed and characterized for dual-band/mode CDMA handset applications. The size of the embedded diplexer is significantly reduced by embedding high Q circular spiral inductors and high DK MIM capacitors into a low cost organic package substrate. The fabricated diplexer has insertion losses and isolations of -0.5 and -23 dB at 824-894 MHz and -0.7 and -22 dB at 1850-1990 MHz, respectively. Its size is $3.9mm{\times}3.9mm{\times}0.77mm$. The fabricated diplexer is the smallest one which is fully embedded into a low cost organic package substrate.

• Proceedings of the Zoological Society Korea Conference
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• 2000.04a
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• pp.82.1-82
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• 2000

No Abstract, See Full Text

• Journal of Plant Biotechnology
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• v.4 no.3
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• pp.103-107
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• 2002

The Good Agriculture Practice (GAP) program, being established in China, is an optimal way for the sustainable utilization of the medicinal plant and animal resources. Most frequently used Chinese materia medica will be mainly produced from the GAP bases in the future. To assure the successful operation of GAP program, standard operating procedure (SOP) should be implemented for specific plants or animals. Both GAP and SOP include the requirements in many aspects from the ecological environment of cultivation place, germplasm and varieties, seedling and transplant, fertilization, irrigation, and field care, to harvest and process, package, transport and storage. As a complex system, GAP demands strong commitment from the pharmaceutical industry, local administrative involvement, long term R&D support, and years of time of development before a satisfactory result can be achieved.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.583-584
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• 2006

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1430-1431
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• 2007

중수소와 3중수소를 융합시키는 D-T반응에서 높은 온도와 억류시간의 필요에 따른 불안정성이 발생하는데 본 연구에서는 역전자계 배위를 형성하여 안정한 배위를 형성하여 불안정성을 억제하였다.

• Proceedings of the Zoological Society Korea Conference
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• 2001.10a
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• pp.177.1-177
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• 2001

No Abstract, See Full Text

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.285-288
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• 2005

A 2.8 inch fully integrated SOP employing a high performance LTPS CMOS TFT technology has been developed for mobile display applications. The LCD module is directly interfaced with 3V 6-bit RGB source via timing control circuitry. The integrated data driver comprises a 6-bit hybrid type DAC with low power analog buffer.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.43-49
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• 2019

In this study, a new approach using graphene oxide (GO) powder-composited Sn-3.0Ag-0.5Cu(in wt.%) solder paste for improving the bending reliability of solder joints between a flexible substrate and small outline package (SOP) was suggested. The GO addition slightly affected the melting temperature, however, the change in the melting temperature was not significant. Meanwhile, we observed the addition of GO could suppress IMC growth and IMC thickness of solder joint during the reflow process. Moreover, the cyclic bending test was also performed for evaluation of reliability in solder joint and we could improve the cyclic bending reliability of solder joint by adding GO powders. For 0.2 wt.% of GO added to the solder joint, the bending lifetime was increased to 20% greater than that without GO. Pull strength and ductility of the solder joint with GO were also higher than those of the joint without GO and it was assumed that this effect by adding GO could contribute to improve cyclic bending reliability of solder joint.

• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.1652-1654
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• 2002

The defects making partial discharge(PD) in a C-GIS(Cubicle Insulated Switchgear) initiate acoustic wave which can be detected using acoustic emission sensor placed outside or inside the C-GIS enclosure. In this paper, partial discharge property for 2 locations for AE sensor and 3 locations for defects in C-GIS are presented and PD waveforms were analyzed by PRPDA(Partial Resolved Partial Discharge Analysis). As a result, using post amplifier having gain of 10,000 and band pass filter having $20kHz{\sim}300kHz$, resolution of waveforms AE sensor signal by detected was good. Noise level was about 80 mV.