• Title/Summary/Keyword: SOC (system on chip)

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A Study on the Hardware Complexity Reduction of Hilbert transformer by MAG algorithm (MAG 알고리즘에 의한 힐버트 변환기의 하드웨어 복잡도 감소에 관한 연구)

  • Kim, Young-Woong;Lee, Young-Seock
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.12 no.1
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    • pp.364-370
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    • 2011
  • The Hilbert transform performs a role to transform band pass signals into low pass signals in wireless communication systems. The operation of Hilbert transform is based on a convolution process which is required adding and multiplying calculations. When the Hilbert transform is designed and hardware-implemented at gate level, the adding and multiplying operation requires a high power consumption and a occupation of wide area on a chip. So the results of adding and multiplying operation cause to degrade the performance of implemented system. In this paper, the new Hilbert transformer is proposed, which has a low hardware complexity by application of MAG(Minimum Adder Graph) algorithm. The proposed Hilbert transformer was simulated in ISE environment of Xilinx and showed the reduction of hardware complexity comparing with the number of gate in the conventional Hilbert transformer.

The Integer Number Divider Using Improved Reciprocal Algorithm (개선된 역수 알고리즘을 사용한 정수 나눗셈기)

  • Song, Hong-Bok;Park, Chang-Soo;Cho, Gyeong-Yeon
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.12 no.7
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    • pp.1218-1226
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    • 2008
  • With the development of semiconductor integrated technology and with the increasing use of multimedia functions in computer, more functions have been implemented as hardware. Nowadays, most microprocessors beyond 32 bits generally implement an integer multiplier as hardware. However, as for a divider, only specific microprocessor implements traditional SRT algorithm as hardware due to complexity of implementation and slow speed. This paper suggested an algorithm that uses a multiplier, 'w bit $\times$ w bit = 2w bit', to process $\frac{N}{D}$ integer division. That is, the reciprocal number D is first calculated, and then multiply dividend N to process integer division. In this paper, when the divisor D is '$D=0.d{\times}2^L$, 0.5 < 0.d < 1.0', approximate value of ' $\frac{1}{D}$', '$1.g{\times}2^{-L}$', which satisfies ' $0.d{\times}1.g=1+e$, $e<2^{-w}$', is defined as over reciprocal number and then an algorithm for over reciprocal number is suggested. This algorithm multiplies over reciprocal number '$01.g{\times}2^{-L}$' by dividend N to process $\frac{N}{D}$ integer division. The algorithm suggested in this paper doesn't require additional revision, because it can calculate correct reciprocal number. In addition, this algorithm uses only multiplier, so additional hardware for division is not required to implement microprocessor. Also, it shows faster speed than the conventional SRT algorithm and performs operation by word unit, accordingly it is more suitable to make compiler than the existing division algorithm. In conclusion, results from this study could be used widely for implementation SOC(System on Chip) and etc. which has been restricted to microprocessor and size of the hardware.

Implant Isolation Characteristics for 1.25 Gbps Monolithic Integrated Bi-Directional Optoelectronic SoC (1.25 Gbps 단일집적 양방향 광전 SoC를 위한 임플란트 절연 특성 분석)

  • Kim, Sung-Il;Kang, Kwang-Yong;Lee, Hai-Young
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.44 no.8
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    • pp.52-59
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    • 2007
  • In this paper, we analyzed and measured implant isolation characteristics for a 1.25 Gbps monolithic integrated hi-directional (M-BiDi) optoelectronic system-on-a-chip, which is a key component to constitute gigabit passive optical networks (PONs) for a fiber-to-the-home (FTTH). Also, we derived an equivalent circuit of the implant structure under various DC bias conditions. The 1.25 Gbps M-BiDi transmit-receive SoC consists of a laser diode with a monitor photodiode as a transmitter and a digital photodiode as a digital data receiver on the same InP wafer According to IEEE 802.3ah and ITU-T G.983.3 standards, a receiver sensitivity of the digital receiver has to satisfy under -24 dBm @ BER=10-12. Therefore, the electrical crosstalk levels have to maintain less than -86 dB from DC to 3 GHz. From analysed and measured results of the implant structure, the M-BiDi SoC with the implant area of 20 mm width and more than 200 mm distance between the laser diode and monitor photodiode, and between the monitor photodiode and digital photodiode, satisfies the electrical crosstalk level. These implant characteristics can be used for the design and fabrication of an optoelectronic SoC design, and expended to a mixed-mode SoC field.