• Biomolecules & Therapeutics
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• 제20권3호
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• pp.326-331
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• 2012

We recently reported that Val-SN-38, a novel valine ester prodrug of SN-38, had greatly improved the intracellular accumulation of SN-38 in MCF-7 cell line, probably through enhanced uptake via amino acid transporters. In the present study, the efficacy of Val-SN-38 was further investigated both in vitro and in vivo. It was found that the in vitro cytotoxic effect of Val-SN-38 was similar to that of SN-38. Moreover, Val-SN-38 exhibited an equal potency to that of SN-38 in survival experiments in vivo. Because these results seemed to be contrary to the previous finding, further investigation was performed to find out the underlying cause of the contradiction. As only the lactone form is known to have cytotoxic activity, the proportion of lactone in Val-SN-38 and SN-38 was determined, but no differences were found. However, it turned out that Val-SN-38 had poor stability compared with SN-38, which resulted in a decrease in beneficial efficacy for Val-SN-38. Overall, the present study showed that a valine-added prodrug approach could be advantageous provided that the stability of the compound can be ensured. We believe this is a noteworthy study that unravels the discrepancy between intracellular accumulation and efficacy of valine-added prodrug.

• 천문학회지
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• 제38권2호
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• pp.289-290
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• 2005

The 6th East Asian Meeting of Astronomy was held just at the time of 400 years after the discovery of SN (supernova) 1604 and its pre-maximum observation by the astronomers both from the East and the West in the 17th century. It has a special meaning and is interesting to look back on the historical observation of SN 1604. In this paper, we only limit to concern the Chinese observation on SN 1604.

• 한국주조공학회지
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• 제38권4호
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• pp.75-81
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• 2018

This study examined the effect of the CaMgSn ternary phase on the aging response of the Mg-Sn-Zn alloy. The results revealed that the CaMgSn ternary phase formed in rod-like or needle-like shapes in Mg-3Zn-0.3Ca-xSn (x=1.5, 3, and 5 wt%) alloys and its size decreased as the Sn content increased from 1.5 wt% to 5 wt%. The Mg-3Zn-0.3Ca-5Sn alloy with a relatively fine CaMgSn phase was subjected to solution heat treatment and an aging process. Both the Mg-5Sn-3Zn-0.3Ca and Mg-5Sn-3Zn (base alloy) alloys had similar peak hardness values throughout all aging temperatures but the time-to-peak hardness in the Mg-5Sn-3Zn-0.3Ca alloy was 24-36 hours-earlier than that in the base alloy. Precipitates in the Mg-5Sn-3Zn-0.3Ca alloy were more refined than those in the Mg-5Sn-3Zn alloy and were mostly formed on basal planes. The $Mg_2Sn$ phase formed in either plate-like or rod-like shapes in the Mg-5Sn-3Zn alloy, whereas block-shaped $Mg_2Sn$ particles also formed in the Mg-5Sn-3Zn-0.3Ca alloy.

• 대한치과교정학회지
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• 제25권4호
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• pp.425-432
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• 1995

본 연구는 안면골의 수평적 및 수직관계가 위치한 하악와의 위치와 어떤 상관관계가 있는지를 알기위해 18세 이상 성인 남녀 각 96명, 108명을 대상으로 두부방사선계측사진을 촬영하였다. 이를 ANB각도에 따라 3개의 군($0.5^{\circ}$이하, $0.5^{\circ}-4.0^{\circ}$, $4.0^{\circ}$ 이상), SM-MP각도에 따라 3개의 군($30^{\circ}$이하, $30^{\circ}-38^{\circ}$, $38^{\circ}$ 이상)으로 분류하여 분석하였다. 이 연구로부터 얻어진 결과는 다음과 같다. 1. 안면골의 수평직 부조화관계(ANB)에서 하악와의 수평적위치(X)는 Class II, Class I, Class III 순으로 전방위치 하였다. 2. 하악와의 수평적 위치(X)는 ANB, SNB와 유익성있는 상관관계를 보이고, SNA와는 유의성이 없었다. 3. 안면골의 수직적 부조화(SN-MP)에서 하악와의 수직적 위치(X)는 low angle에서 가장 크며 medium, high angle 순이었다. 4. 하악와의 수직적 위치(X)는 SN-MP가 가장 높은 상관관계를 보이고 SN-MP, SN-OP순으로 상관관계를 보였다. 5. 전두개저의 길이는 III급 부정교합에서 가장 작았다.

• Transactions on Electrical and Electronic Materials
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• 제15권3호
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• pp.155-158
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• 2014

The phase transformation of Sn-Pb-Bi solder for photovoltaic ribbon during soldering was studied using real-time synchrotron x-ray scattering. At room temperature, Sn and Pb crystal phases in the solder existed separately. By heating to $92^{\circ}C$, a new PbBi alloy crystal phase was formed, which grew further up to $160^{\circ}C$. The Sn crystal phase first started to melt at $160^{\circ}C$, and was mostly melted at $165^{\circ}C$. In contrast, the Pb and PbBi crystal phases started to melt at $165^{\circ}C$, and were mostly melted at $170^{\circ}C$. The useful result was obtained, that the solder's melting temperature decreased from $183^{\circ}C$ to $170^{\circ}C$ by addition of a small amount of Bi atoms to the eutectic Sn62-Pb38 (wt%) solder. Our study first revealed the detailed in-situ phase transformation of Sn-Pb-Bi solder during heating to the eutectic temperature. Considering the results of peel strength and hardness, adding 1 wt% of Bi atoms to the Sn62-Pb38 (wt%) solder produced an appropriate composition.

• 건축사
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• 통권643호
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• pp.38-45
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• 2022

• E2M - 전기 전자와 첨단 소재
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• 제9권1호
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• pp.38-43
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• 1996

A coprecipitation method was used for preparing Ca and Pt doped $SnO_2$ fine powder. Components of the powder were investigated by XPS and SIMS. Crystallite size and specific surface area were investigated by TEM, XRD, and BET analysis. $SnO_2$(Ca)/Pt based thick film devices were prepared by a screen printing technique for methane gas detection. Then sensing characteristics of the devices were investigated. As Ca and Pt added, the crystal growth of $SnO_2$ was suppressed during calcining and sintering, and the sensitivity of $SnO_2$(Ca)/Pt thick film to methane gas was enhanced. For the Pt doped $SnO_2$ fine particle, the thick film device shows sensitivity of about 83% to 2000 ppm methane gas at an operating temperature of >$400^{\circ}C$.

• 전기전자학회논문지
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• 제24권4호
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• pp.1117-1121
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• 2020

본 연구에서는, 원자막증착법(ALD) 공정으로 증착된 SnO2 촉매를 AlGaN/GaN 이종접합 FET에 적용하여 NO2 가스 검출이 가능한 것을 확인하였다. AlGaN/GaN-on-si 플랫폼에서 제작 된 HFET 센서로 NO2 100 ppm에 대하여 In-situ SiN이 있는 소자와 없는 소자가 각각 100 ℃, 200 ℃에서 10.1% 및 17.7%, 5.5% 및 38%의 감지성능을 확인하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 하계학술대회 논문집 C
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• pp.1410-1412
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• 2003

PTC 자기발열기판을 사용해서 저전력 방폭형 CO센서를 제작하고 그 특성을 고찰하였다. CO가스센서의 감지특성을 향상시키기 위하여 Pt가 island 형상을 갖는 다층 Pt/$SnO_2$ 박막구조를 도입하였으며, 이와 같은 구조는 Pt/$SnO_2$ 위에 다시 $SnO_2$ 및 Pt cluster 층들을 연속적으로 증착함으로서 제작되었다. 200ppm의 CO가스농도에서 측정된 다층 $Pt/SnO_2$박막 센서의 감도는 1.72($R_{air}/R_{CO}$)로, 단충 Pt/$SnO_2$ 박막 센서의 최대감도(1.23)보다 훨씬 더 높았다 이것은 Pt와 $SnO_2$사이의 계면적 증대에 기인하는 것으로 생각된다. 제작된 Pt/$SnO_2$ 가스센서의 평균 소비전력은 38.5mW이며, 측정농도범위($30{\sim}1,000ppm$)에서 매우 양호한 감지특성을 나타내었다.

• 대한금속재료학회지
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• 제46권1호
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• pp.33-38
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• 2008

The interfacial reactions and shear strength of pure Sn solder bump were investigated with different under bump metallizations (UBMs) and reflow numbers. Two different UBMs were employed in this study: Cu and Ni. Cu6Sn5 and Cu3Sn intermetallic compounds (IMCs) were formed at the bump/Cu UBM interface, whereas only a Ni3Sn4 IMC was formed at the bump/Ni UBM interface. These IMCs grew with increasing reflow number. The growth of the Cu-Sn IMCs was faster than that of the Ni-Sn IMC. These interfacial reactions greatly affected the shear properties of the bumps.