• Korean Journal of Materials Research
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• v.31 no.12
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• pp.690-696
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• 2021

The purpose of this study is to develop a zirconium-based alloy with low modulus and magnetic susceptibility to prevent the stress-shielding effect and the generation of artifacts. Zr-7Cu-xSn (x = 1, 5, 10, 15 mass%) alloys are prepared by an arc melting process. Microstructure characterization is performed by microscopy and X-ray diffraction. Mechanical properties are evaluated using micro Vickers hardness and compression test. The magnetic susceptibility is evaluated using a SQUID-VSM. The average magnetic susceptibility value of the Zr-7Cu-xSn alloy is 1.176 × 10^-8 cm³g^-1. Corrosion tests of zirconium-based alloys are conducted through polarization test. The average Icorr value of the Zr-7Cu-xSn alloy is 0.1912 ㎂/cm². The elastic modulus value of 14 ~ 18 GPa of the zirconium-based alloy is very similar to the elastic modulus value of 15 ~ 30 GPa of the human bone. Consequently, the Sn added zirconium alloy, Zr-7Cu-xSn, is very interesting and attractive as a biomaterial that reduces the stress-shielding effect caused by differences of elastic modulus between human bone and metallic implants. In addition, this material has the potential to be used in metallic dental implants to effectively eliminate artifacts in MRI images due to low magnetic susceptibility.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.35-40
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• 2007

The pull strength and fracture mechanism were investigated to evaluate the reliability and compatibility of Sn-8Zn-3Bi joints, the solder paste on lead and lead-free plating under thermal shock conditions. At the Sn-8Zn-3Bi solder joint, no crack initiation was observed during thermal shock test. After 1000 cycles, the strength of the solder joint decreased not sharply but reduced gradually compared with initial conditions. The decrement of strength was affected by ${\gamma}-Cu_5Zn_8$ IMC growth which caused the IMC fracture on the fracture surface and a change in fracture mode and initial crack point. Clearly, the Sn-8Zn-3Bi solder shows good reliability properties and compatibility with lead-free plated Cu LF under thermal shock temperatures between 248K and 423K.

• Journal of Korea Foundry Society
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• v.21 no.2
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• pp.135-140
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• 2001

Microstructure of the bell made with Cu-Sn alloys was examined by optical and scanning electron microscope and that analyzed quantitatively with image analyzer. Also acoustic characteristics of the bells were measured in detail by using FFT type power spectrum analyzer. ${\alpha}-single$ phases of large grains only were observed in Cu-5%Sn alloy. However mixed structure of primary ${\alpha}-phase$ and eutectoid of ${\alpha}+{\delta}%_o$ was existed in the Cu-Sn alloys with more than 9%Sn. Also the area fraction of eutectoid phases gradually increased with an increased Sn content. From the result of acoustic test, it was found that frequency and tonal intensity decreased with the increased Sn content from 5%Sn to 11%Sn, and those were rather increased with further increase of that. The lowest frequency and tonal intensity were showed in Cu-11%Sn, and porosity decreased considerably frequency and tonal intensity of the bells.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.67-73
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• 2001

To investigate the relationships of solder joint characteristics with solder composition and A:V ratio (solder volume per pad area), Sn-37Pb and Sn-4.0Ag-0.5Cu solder balls with 330, 400, 450 and $457{\mu}{\textrm}{m}$ size were reflowed on same substrate. Sn-37Pb and Sn-4.0Ag-0.5Cu was reflowed at $220^{\circ}C$ and $240^{\circ}C$ respectively by IR-type soldering machine. As a result of reflowed solder- ball diameter(D) and height(H) measurement, D/H was decreased with solder ball size increment in range of 330~450 ${\mu}{\textrm}{m}$. But, D/H was increased in the solder joint for 457 ${\mu}{\textrm}{m}$ size, it was caused possibly by decrement of solder ball height increment compared with solder volume increment. As a result of shear and pull test, joint strength with A:V ratio was high. Joint strength of Sn-4.0Ag-0.5Cu was higher than Sn-37Pb. However, Sn-37Pb had more stable solder joint of small standard deviation. A thick and clean scallop type Ni-Cu-Sn intermetallic compound layer was formed in high A:V ratio and Sn-4.0Ag-0.5Cu solder joint interface.

• Annual Conference on Human and Language Technology
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• 1999.10d
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• pp.23-39
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• 1999

이 논문에서는 MATEC99에서의 형태소 분석기 및 품사 태거의 평가를 위한 Test Suites, 즉, 평가용 시험문제와 문제에 대한 정답을 정하기 위하여 마련한 여러가지 표준안의 도출과정상에서 발견된 문제점의 유형을 기술하고자 한다. 그리고, 각각의 문제점 유형별로 현실적 제약으로 인한 어려움을 살펴보고, 한편으로는 일부 문제에 대해서는 시간적 제약 때문에 현재의 표준안에는 반영되지 않았지만 향후 점진적인 개선을 위한 방안을 제안하고자 한다. 대부분의 문제에 완전한 해결책이 발견되지 않고 있어 관련 전문가들의 조언을 이끌어 내기 위하여 문제를 공론화하고자함에도 목적이 있다.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• Transactions of the Korean Society of Automotive Engineers
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• v.21 no.1
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• pp.145-153
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• 2013

In this study, shear punch-creep (SP-Creep) at Sn-4Ag/Cu pad the joint was tested by using environment-friendly Pb-free solder alloy Sn-4Ag of electronic components. Pb eutectic alloy (Sn-37Pb) joints limited to environmental issues with reflow time (10sec, 30sec, 100sec, 300sec) according to two types of solder alloy joints are compared and evaluated by creep strain rate, rupture time and IMC (Intermetallic Compound) behavior. As the results, reflow time increases with increasing thickness of IMC can be seen at overall 100sec later in case of two solder joints on the IMC thickness of Sn-4Ag solder joints thicker than Sn-37Pb solder joints. In addition, when considering creep evaluation factors, lead-free solder alloy Sn-4Ag has excellent creep resistance more than Pb eutectic alloy. For this reason, the two solder joints, such as in the IMC (Cu6Sn5) was formed. However, the creep resistance of Sn-4Ag solder joints was largely increased in the precipitation strengthening effect of dispersed Ag3Sn with interface more than Sn-37Pb solder joints.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.5
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• pp.467-471
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• 2015

Thus far, solders used in electronics remain lead-based. Pb-free solutions in electronic components and systems are receiving increased attention in the semiconductor and electronics industries. Pb-free materials currently in used are Sn-37Pb, Sn-4Ag and Sn-4Ag-0.5Cu/Ni plate joints. In this study, solder alloys were used at high temperatures for artificial aging processing that was performed at $150^{\circ}C$ for 0hr, 100hr, 200hr, 400hr, 600hr and 1000hr. The SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of all the specimens decreased with the increase in artificial aging time and temperature of the SP test. In addition, Pb-free solders showed higher total fracture energy compared with Sn-37Pb at high temperatures. The mechanical properties of Sn-4Ag-0.5Cu solder/Ni plate joints remained in excellent conditions in electronic parking systems at high temperatures.

• Journal of the Korean Ceramic Society
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• v.13 no.2
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• pp.24-30
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• 1976

To observe the influence of tetrahedral and octahedral preference of cations of Ni2+, Ti4+ upon the formation and the color development of the MgO-SnO2 spinel containing Ni2+ and Ti4+ ions, the gradual substitution of Ni2+ ions for Mg2+ ions and of Ti4+ ions for Sn4+ ions of the spinel in NiO-MgO-SnO2-TiO2 system was carried out. On samples prepared by calcining the oxide and basic carbonate mixtures at 130$0^{\circ}C$ for 1.5 hour, the X-ray analysis, measurement of reflectance and the test of their stability as a glaze pigment were also carried out. On samples prepared by calcining the oxide and basic carbonate mixtures at 130$0^{\circ}C$ for 1.5 hour, the X-ray analysis, measurement of reflectance and the test of their stabiality as a glaze pigment were also carried out. The results are summarized as follows. 1) As increasing the amounts of Ni2+ ions in the xNiO.(2-x)MgO.SnO2 system, spinel was not formed easily, and the mixed-spinel was formed in NiO.MgO.SnO2 of x=1 but the spinels was not formed completely in the range of x>1.5 2) The spinels was not more formed in NiO-MgO-TiO2 system than NiO-MgO-SnO2 system. Therefore, Ti4+ ions have strong octahedral preference than Sn4+ ions. The color changed the yellow region little. The mixed-spinel or non-spinel was formed easily NiO.TiO2, MgO.TiO2 of illmenite type as the gradual substitution of Ti4+ ions for Sn4+ ions. 3) The results of glaze test. The color changed from white through graish brown to brown as the gradual substitution of Ni2+ ions for Mg2+ ions in calcium-zinc glaze and calcium glaze, and from white through light yellowish beige to dull beige in tile glaze. Also, the color did not change generally as the gradual substitution of Ti4+ ions for Sn4+ ions in NiO-MgO-SnO2-TiO2 system.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.21-26
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• 2006

We developed a bonding at low temperature using fine pitch Sn and In bumps, and studied the reliability of the fine pitch In-Sn solder joints. The $30{\mu}m$ pitch Sn and In bumps were joined together at $120^{\circ}C$. A non conductive adhesive (NCA) was applied during solder joining. Thermal cycling test ($0^{\circ}C-100^{\circ}C$, 2 cycles/h) of up to 2000 cycles was carried out to evaluate the reliability of the solder joints. The bondability was evaluated by measuring the contact resistance (Rc) of the joints through the four point probe method. As the content of filler increased, the reliability improved in the solder joints during thermal cycling test because the contact resistance increased little. The filler redistributed the stress and strains from the thermal shock over the entire joint area.