• Biomolecules & Therapeutics
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• v.20 no.3
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• pp.326-331
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• 2012

We recently reported that Val-SN-38, a novel valine ester prodrug of SN-38, had greatly improved the intracellular accumulation of SN-38 in MCF-7 cell line, probably through enhanced uptake via amino acid transporters. In the present study, the efficacy of Val-SN-38 was further investigated both in vitro and in vivo. It was found that the in vitro cytotoxic effect of Val-SN-38 was similar to that of SN-38. Moreover, Val-SN-38 exhibited an equal potency to that of SN-38 in survival experiments in vivo. Because these results seemed to be contrary to the previous finding, further investigation was performed to find out the underlying cause of the contradiction. As only the lactone form is known to have cytotoxic activity, the proportion of lactone in Val-SN-38 and SN-38 was determined, but no differences were found. However, it turned out that Val-SN-38 had poor stability compared with SN-38, which resulted in a decrease in beneficial efficacy for Val-SN-38. Overall, the present study showed that a valine-added prodrug approach could be advantageous provided that the stability of the compound can be ensured. We believe this is a noteworthy study that unravels the discrepancy between intracellular accumulation and efficacy of valine-added prodrug.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.2
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• pp.186-190
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• 2023

We studied the various characteristics of Sn-In (wt%) Pb-free solders for photovoltaic ribbon application. The solders near the eutectic composition of Sn₄₈In₅₂ (wt%) existed in InSn₄ and In₃Sn alloy phases, and in In crystal phase, but not in Sn crystal phase. In addition, the InSn₄ phase (γ-alloy) existed separately from the In₃Sn (β-alloy) and the In phase confirmed by an SEM-EDS-mapping. The melting temperature of the eutectic solder of Sn₄₈In₅₂ (wt%) was 119.2℃, and when the Sn content decreased in reference to the eutectic composition, it slightly increased to 121.4℃, but when the Sn content increased, it remained almost constant at 119.1℃. The peel strength of the ribbon plated with the Sn₄₂In₅₈ (wt%) solder was 38.7 N/mm², and it tended to increase when the Sn content increased. The peel strength of the eutectic Sn₄₈In₅₂ (wt%) solder was 53.6 N/mm², and that of the Sn₅₁In₄₉ (wt%) solder was 61.6 N/mm² that was the highest.

• Journal of the Korean Ceramic Society
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• v.30 no.9
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• pp.740-746
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• 1993

TiO2-SnO2 fine powders prepared by coprecipitation from TiCl4-SnCl4 aqueous solution, and their crystal structures were studied. All the TiO2-SnO2 fine powders calcined at 180~$700^{\circ}C$ showed the complete solid solution between TiO2(rutile structure) and SnO2(rutile structure). This crystal structure of TiO2-SnO2 powders is thought to be originated mainly from the heterogeneous nucleation of Ti-hydroxde on the Sn-hydroxide with coherent structure.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.28 no.3
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• pp.130-134
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• 2018

In the past few years, various solder compositions have been a representative material to electronic packages and surface mount technology industries as a replacement of Pb-base solder alloy. Therefore, extensive studies on process and/or reliability related with the low Ag composition have been reported because of recent rapid rise in Ag price. In this study, Sn-3.0Ag-0.5Cu, Sn-0.7Cu and Sn-0.3Ag-0.5Cu solder bar samples were fabricated by melting of Sn, Ag and Cu metal powders. Crystal structure and element concentration were analyzed by XRD, XRF, optical microscope, FE-SEM and EDS. The fabricated solder samples were composed of ${\beta}-Sn$, ${\varepsilon}-Ag_3Sn$ and ${\eta}-Cu_6Sn_5$ phases.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.67-73
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• 2001

To investigate the relationships of solder joint characteristics with solder composition and A:V ratio (solder volume per pad area), Sn-37Pb and Sn-4.0Ag-0.5Cu solder balls with 330, 400, 450 and $457{\mu}{\textrm}{m}$ size were reflowed on same substrate. Sn-37Pb and Sn-4.0Ag-0.5Cu was reflowed at $220^{\circ}C$ and $240^{\circ}C$ respectively by IR-type soldering machine. As a result of reflowed solder- ball diameter(D) and height(H) measurement, D/H was decreased with solder ball size increment in range of 330~450 ${\mu}{\textrm}{m}$. But, D/H was increased in the solder joint for 457 ${\mu}{\textrm}{m}$ size, it was caused possibly by decrement of solder ball height increment compared with solder volume increment. As a result of shear and pull test, joint strength with A:V ratio was high. Joint strength of Sn-4.0Ag-0.5Cu was higher than Sn-37Pb. However, Sn-37Pb had more stable solder joint of small standard deviation. A thick and clean scallop type Ni-Cu-Sn intermetallic compound layer was formed in high A:V ratio and Sn-4.0Ag-0.5Cu solder joint interface.

• Korean Journal of Materials Research
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• v.15 no.3
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• pp.195-201
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• 2005

The $SnS_2,\;SnS_2:Cd$, and $SnS_2:Sb$ single crystals were grown by the chemical transport reaction method. The indirect optical energy band gap was found to be 2.348, 2.345, and 2.343 eV for the $SnS_2,\;SnS_2:Cd$, and $SnS_2:Sb$ single crystals, at 6 K respectively. The direct optical energy band gap was found to be 2.511, 2.505, and 2.503 eV f3r the $SnS_2,\;SnS_2:Cd$, and $SnS_2:Sb$ single crystals, at 6 K respectively The temperature dependence of the optical energy band gap was well fitted by the Varshni equation. Two photoluminescence emission peaks with the peak energy of 2.214 and 1.792 eV for $SnS_2$, 2.214 and 1.837 eV for $SnS_2:Cd$, and 2.214 and 1.818 eV the $SnS_2:Sb$ were observed. The emission peaks were described as originating from the donor-acceptor pair recombinations.

• Journal of Korea Foundry Society
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• v.34 no.2
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• pp.49-53
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• 2014

In commercial Zr-Nb-Cu-Ni-Al amorphous alloys, expensive element, Zr, was substituted to Sn which was cheaper one, and then, glass forming ability, compressive strength and hardness of them were estimated. Even though the Sn was added up to 1.5%, resulting phase was not changed to the crystalline form. It was confirmed by X-ray diffraction and thermal analyses. In the X-ray profiles, there were no peaks for crystalline phases and typical halo pattern for amorphous phase was appeared at the diffraction angle of $35^{\circ}{\sim}45^{\circ}$. Thermal analyses also showed that the Sn modified alloys were corresponded to the amorphous standards where ${\delta}T$(= Tx - Tg) and Trg(= Tg/Tm) affecting to the amorphous forming ability were more than 50K and 0.60 respectively. Compressive strengths were 1.77 GPa, 1.63 GPa, 1.65 GPa and 1.77 GPa for 0%Sn, 0.5%Sn, 1.0%Sn and 1.5%Sn respectively. Hardnesses of the Sn modified alloys were decreased from 752 Hv to 702 Hv in 1.0%Sn and recovered to 746 Hv in 1.5%Sn.

• Proceedings of the Korean Nuclear Society Conference
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• 1998.05b
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• pp.237-242
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• 1998

Zr합금의 수소화 반응속도에 미치는 합금원소의 영향을 평가하기 위하여 Zr과 Zr-0.8Sn-XNb계열(X=0.2, 0.4, 0.8, 1.0) 및 Zr-0.4Nb-YSn계열(Y=0.5, 0.8, 1.5, 2.0)의 3원계 합금으로 electro-microbalance가 장착된 TGA (thermo-gravimetric apparatus)장치를 이용하여 40$0^{\circ}C$에서 1기압 수소와의 반응에 따른 무게증가를 in-situ로 측정하였다 Sn 첨가량이 증가함에 따라 1.5% 까지는 수소반응에 따른 무게증가율이 낮게 나타났으나 Sn을 2.0% 함유한 Zr-0.4Nb-2.0Sn합금의 경우 가장 높게 나타났다. 이는 Sn의 함량이 증가할수록 수소침투에 대한 저항성이 증가함을 의미하지만 Sn이 고용도 이상 함유되면 Sn을 함유한 다량의 석출물이 대량수소침투의 site로 작용하여 수소침투가 가속화된 것으로 평가된다. Nb의 경우 첨가량을 증가시킬수록 무게증가는 크게 나타났는데 이는 Nb이 수소흡수성이 크기 때문이며 Zr-0.8Sn-0.2Nb 및 Zr-0.8Sn-0.4Nb 합금보다 Zr-0.8Sn-0.8Nb 및 Zr-0.8Sn-1.0Nb 합금의 경우 TEM을 이용한 금속간 석출물(intermetallic precipitates) 분석에서 이러한 석출물들의 평균크기 및 개수가 크게 평가되었고, 또한 Zr-0.8Sn-0.2Nb, Zr-0.8Sn-0.4Nb 합금에서는 관찰이 되지 않는 $\beta$-Zr 석출물이 관찰되었다 이러한 사실로부터 Nb의 큰 수소흡수성에 부가적으로 이러한 석출물들이 수소침투를 가속화 하는 데에 기여하는 것으로 여겨진다.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.235-237
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• 2007

In this paper, fabrication of Sn-3.0Ag-0.5Cu solder bumping having accurate composition and behavior of intermetallic compounds(IMCs) growth at interface between Sn-Ag-Cu bumps and Cu substrate were studied. The ternary alloy of the Sn-3.0Ag-0.5Cu solder was made by two binary(Sn-Cu, Sn-Ag) electroplating on Cu pad. For the manufacturing of the micro-bumps, photo-lithography and reflow process were carried out. After reflow process, the micro-bumps were aged at $150^{\circ}C$ during 1 hr to 500 hrs to observe behavior of IMCs growth at interface. As a different of Cu contents(0.5 or 2wt%) at Sn-Cu layer, behavior of IMCs was estimated. The interface were observed by FE-SEM and TEM for estimating of their each IMCs volume ratio and crystallographic-structure, respectively. From the results, it was found that the thickness of $Cu_3Sn$ layer formed at Sn-2.0Cu was thinner than the thickness of that layer be formed Sn-0.5Cu. After aging treatment $Cu_3Sn$ was formed at Sn-0.5Cu layer far thinner.

• Korean Journal of Materials Research
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• v.13 no.2
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• pp.133-136
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• 2003

Sn-2.5Cu alloy layers were deposited on the Alloy 42 lead-frame substrates by the electroplating method, and their microstructures, adhesion strength, and electrical resistivity were measured to evaluate the applicability of Sn-Cu alloy as a surface finishing material of electronic parts. The Sn-2.5Cu layers were electroplated in the granular form, and composed of pure Sn and Cu$_{6}$Sn$_{5}$ intermetallic compound. Surfaces of the electroplated Sn-2.5Cu layers were rather rough and also the thickness variance was large. The adhesion strength of the Sn-2.5Cu electroplated layers was highly comparable to that of the electroplated Cu alloy layer and the electrical conductivity was about 10 times higher than the pure Sn. After the 20$0^{\circ}C$ 30 min. annealing of the electroplated Sn-2.5Cu layers, the surface roughness was reduced, and adhesion strength and conductivity were improved. These results showed the Sn-Cu alloys can be used as an excellent surface finishing material.ial.