• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.494-495
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• 2007

As a pocket size electronic device have developed and electronic parts is increased, it need dual face soldering using SMT(Surface Mount Technology) and it can be getting high density soldering. Inductor is one of their electronic parts using SMT and inductor was developed to make electromagnetic energy. In this study, it is analyzed temperature properties of surface mount type Inductor due to current injection which is satisfied the demand of utmost small size and the substance of high density simultaneously.

• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.53-58
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• 2009

A SMT mounter is a kind of equipment that mounts SMD parts quickly on the printed circuit board. By using linear motors, it is controlled with high speed and precision, which is similar to semi-conductor and display process equipment. It is necessarily used in an assembly process of an electronic device. Mobile devices such as a mobile phone and PDA are required to reduce mount areas due to the demands for high performance and small size. Hence, super small sized and complex mobile devices have been developed. To improve the productivity of the corresponding equipment, designs with large sized, high speed, and multidisciplinary functions have been consistently performed. Meanwhile, a design trend of large size and light-weight on SMT mounter causes a low natural frequency of systems and vibration problems at the high speed operation. In this paper, the dynamic characteristics of the SMD mounter system were investigated through a modal test and transmissibility test, and verified by finite element method. Also, various design improvement was performed to avoid the resonance phenomena.

• Journal of the Korea Convergence Society
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• v.10 no.9
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• pp.17-22
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• 2019

Gentry, an SMT equipment, is a device that absorbs electronic components from the feeder and mounts them correctly on the PCB. At this time, the gantry stops in front of the camera to check whether the parts are correctly adsorbed. In this paper, we propose a method to shorten the moving time by moving the gantry without stopping in front of the camera. This method shows that the moving time is shorter than that of the conventional method by finding a path that can be moved in the fastest time among the various moving paths. The proposed method (moving-motion) reduces the gantry travel time by 20% compared to the conventional method (stop-motion).

• KIPS Transactions on Software and Data Engineering
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• v.6 no.5
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• pp.223-228
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• 2017

SMT is an device that picks up electronic components and does precise placing onto PCBs. In order to do this, it stops in front of a camera installed in the middle to go over vision inspection. And after that it is move for placing. There are 16 different types of routes in this process. This paper compared to the moving time of three methods in the (sLa-Camera-pLa)type. The first method is stopping in front of the camera for vision inspection and placing components onto PCBs(stop-motion). The second method is moving in front of the camera for vision inspection without stopping(fly1-motion). The third method is inspecting the components when the speed of the X axis, the Y axis is the best and is placing components onto PCBs(fly2-motion). This paper shows the moving time of three methods is same. Therefore we proved that the stop-motion method can be placing in the fastest time without changing structure of the device in the (sLa-Camera-pLa)type.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.52 no.12
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• pp.671-678
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• 2003

This paper proposes an expert system to generate automatically the test table of test system which can highly enhance the quality and productivity of product by inspecting quickly and accurately the defect device on the electronic circuit board tested. The expert system identifies accurately the tested components and the circuit patterns by tracing automatically the connectivity of circuit from electronic circuit database. And it generates automatically the test table to detect accurately the missing components, the misplaced components, and the wrong components for analog components such as resistance, coil, condenser, diode, and transistor, based on the experience knowledge of veteran expert. It is implemented in C computer language for the purpose of the implementation of the inference engine using the dynamic memory allocation technique, the interface with the electronic circuit database and the hardware direct control. And, the validity of the builded expert system is proved by simulating for a typical electronic board model.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.151-156
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• 2007

In this paper, the creep characteristics of lead and lead-free solder joint were investigated using the QFP(Quad Flat Package) creep test. Two kind of solder pastes(Sn-3Ag-0.5Cu, Sn-0.2Sb-0.4Ag-37.4Pb) were applied to the QFP solder joints and each specimen was checked the external and internal failures(i.e., wetting failure, void, pin hole, poor-heel fillet) by digital microscope and X-ray inspection. The creep test was conducted at the temperatures of $100^{\circ}C$ and $130^{\circ}C$ under the load of 15$\sim$20% of average pull strength in solder joints. The creep characteristics of each solder joints were compared using the creep strain-time curve and creep strain rate-stress curves. Through the comparison, the Sn-3Ag-0.5Cu solder joints have higher creep resistance than that of Sn-0.3Sb-0.4Ag-37.4Pb. Also, the grain boundary sliding in the fracture surface and the necking of solder joint were observed by FE-SEM.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.11a
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• pp.61-64
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• 2000

We fabricated and characterized Low Noise Amplifier (LNA) using MCM-C (Multi-Chip-Module-Cofired) technology for 2.14 GHz IMT-2000 mobile terminal application. First, We designed LNA circuits and simulated it's high frequency characteristics using circuits simulator. For the simulation, we adopted high frequency libraries of all the devices used in LNA samples. By the simulation, Gain was 17 dB and Noise Figure was 1.4 dB. We used multilayer process of LTCC (Low Temperature Co-fired Ceramics) substrate and conductor, resistor pattern for the MCM-C LNA fabrication. We made 2 buried inductors, 2 buried capacitors and 3 buried resistors. The number of the total layers was 6. On the top layer, we patterned microstrip line and pads for the SMT device. We measured the high frequency characteristics, and the results were 14.7 dB Gain and 1.5 dB Noise Figure.

• Journal of Internet Computing and Services
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• v.25 no.1
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• pp.99-107
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• 2024

Along with economic growth and industrial development, there is an increasing demand for various electronic components and device production of semiconductor, SMT component, and electrical battery products. However, these products may contain foreign substances coming from manufacturing process such as iron, aluminum, plastic and so on, which could lead to serious problems or malfunctioning of the product, and fire on the electric vehicle. To solve these problems, it is necessary to determine whether there are foreign materials inside the product, and may tests have been done by means of non-destructive testing methodology such as ultrasound ot X-ray. Nevertheless, there are technical challenges and limitation in acquiring X-ray images and determining the presence of foreign materials. In particular Small-sized or low-density foreign materials may not be visible even when X-ray equipment is used, and noise can also make it difficult to detect foreign objects. Moreover, in order to meet the manufacturing speed requirement, the x-ray acquisition time should be reduced, which can result in the very low signal- to-noise ratio(SNR) lowering the foreign material detection accuracy. Therefore, in this paper, we propose a five-step approach to overcome the limitations of low resolution, which make it challenging to detect foreign substances. Firstly, global contrast of X-ray images are increased through histogram stretching methodology. Second, to strengthen the high frequency signal and local contrast, we applied local contrast enhancement technique. Third, to improve the edge clearness, Unsharp masking is applied to enhance edges, making objects more visible. Forth, the super-resolution method of the Residual Dense Block (RDB) is used for noise reduction and image enhancement. Last, the Yolov5 algorithm is employed to train and detect foreign objects after learning. Using the proposed method in this study, experimental results show an improvement of more than 10% in performance metrics such as precision compared to low-density images.