• Journal of the Korean Ceramic Society
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• v.37 no.1
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• pp.21-25
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• 2000

Gas pressure sintered silicon nitride based composites with 5 wt% $\beta$-Si3N4 whiskers were prepared, and the variations depending on sintering additives and sintering temperature were studied. Sintering additives were 6 wt% Y2O3-1 wt% MgO(6Y1M), 6 wt%Y2O3-1 wt% Al2O3(6Y1A), 6 wt% Y2O3-1 wt% SiO2(6Y1S), and whiskers were unidirectionally oriented by a modified tape casting technique. Samples were fully densified by gas pressure sintering at 2148 K and 2273 K. As the sintering temperature increased, the size of large elongated grains was increased. Three point flexural strength of 6Y1M and 6Y1M samples was higher than that of 6Y1S sample, and the strength decreased as the sintering temperature increased. The indentation crack length became shorter for the sample sintered at higher temperature, and the difference between the cracks length parallel to and normal to the direction of whisker alignment was decreased. In case of cracks 45$^{\circ}$off the whisker alignment direction, the crack length anisotropy disappeared.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.361-361
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• 2010

The separated quasi-one-dimensional ($7{\times}7$) and ($5{\times}5$) phases on vicinal Si(557) surfaces were successfully realized by changing the crystallographic orientation and thermal treatment conditions. A small change in the crystallographic orientation of the Si(557) surface stabilized the quasi-one-dimensional ($5{\times}5$) phase of a (111) facet on vicinal Si(557) surfaces and made it coexist with a quasi-one-dimensional ($7{\times}7$) phase after an optimal thermal treatment, whereas only the quasi-one-dimensional ($7{\times}7$) phase was stable on the Si(557) surface. Interestingly, this causes the (111) terraces with different widths (L) to prefer only one of the $5{\times}5$ (L=12) and $7{\times}7$ (L=9) phases resulting in long-range order of both phases along the step edge direction, which was observed by scanning tunneling microscopy (STM) and was supported by first principle calculations. In contrast, the quasi-one-dimensional ($5{\times}5$ and ($7{\times}7$) phases were arranged randomly across the step edge direction. The change of surface morphology of vicinal Si(557) surfaces will be discussed with STM images and theoretical calculations by changing crystallographic cutting angles and thermal treatment conditions.

• The Journal of Korean Society for Radiation Therapy
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• v.25 no.2
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• pp.159-165
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• 2013

Purpose: Abdominal compressor is used to control breathing in stereotactic body radiotherapy for lung tumors frequently. We evaluated the dynamic variation aspect of internal tumor volume by breathing. Materials and Methods: We reviewed 20 lung cancer patients (7 upper lung patients, 4 middle lung patients, 9 lower lung patients) who received stereotactic body radiotherapy using abdominal compressor between April 2012 to April 2013. Coordinate shift values were obtained by using four-dimensional cone-beam CT (4D-CBCT) to investigate treatment set-up error and moving tumor position error. To investigate how much difference of each part, we compared 95% confidence interval, maximum values and minimum values of three-dimensional vector value and analyzed conformity degree through the Pearson square correlation coefficient. Results: 95% confidence interval of three-dimensional vector value of each part is 1.8~2.9 mm in upper lobe, 2.3~5.4 mm in middle lobe and 2.2~4.0 mm in lower lobe. Conformity degree was the result that respectively is LR direction 0.75, SI direction 0.68 and AP direction 0.63 in upper lobe, LR direction 0.82, SI direction 0.51 and AP direction 0.92 in middle lobe and LR direction 0.63, SI direction 0.50 and AP direction 0.34 in lower lobe. Conclusion: We showed difference by each site in lung tumor due to respiration by using abdominal compressor. Therefore, we must correct treatment set-up error as well as moving tumor position error by breathing. It is also considered to be useful that it is the use of 4D-CBCT when correcting the error due to various dynamic variation.

• Journal of the Korean Ceramic Society
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• v.32 no.4
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• pp.419-428
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• 1995

Polycrystalline silicon carbide (SiC) thick films were depostied by low pressure chemical vapor deposition (LPCVD) using CH3SiCl3 (MTS) and H2 gaseous mixture onto isotropic graphite substrate. Effects of deposition variables on the SiC film were investigated. Deposition rate had been found to be surface-reaction controlled below reactor temperature of 120$0^{\circ}C$ and mass-transport controlled over 125$0^{\circ}C$. Apparent activation energy value decreased below 120$0^{\circ}C$ and deposition rate decreased above 125$0^{\circ}C$ by depletion effect of the reactant gas in the direction of flow in a horizontal hot wall reactor. Microstructure of the as-deposited SiC films was strongly influenced by deposition temperature and position. Microstructural change occurred greater in the mass transport controlled region than surface reaction controlled region. The as-deposited SiC layers in this experiment showed stoichiometric composition and there were no polytype except for $\beta$-SiC. The preferred orientation plane of the polycrystalline SiC layers was (220) plane at a high reactant gas concentration in the mass transfer controlled region. As depletion effect of reactant concentration was increased, SiC films preferentially grow as (111) plane.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.1050-1053
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• 2001

There is great interest in developing magnetoresistance(MR) sensor, using ferromagnetic, electrically non-magnetic conducting and antiferromagnetic films, especially for the use in weak magnetic fields. Here, we report single and Wheatstone-bridge type of MR sensors made in Si(001)/HiO(300$\AA$)/NiFe bilayers. Angular dependence of MR profiles was measured in Si(001)/NiO(300$\AA$)/NiFe(450$\AA$) films as a function of an angle between current and applied field direction, also, linearity was determined. AMR characteristics of single MR sensors was well explained with single domain model. Good linearity in 45$^{\circ}$Wheatstone-bridge type of MR sensors consisting of 4 single MR sensors made in Si(001)/NiO(300$\AA$)/NiFe(450$\AA$) was shown in the range of about $\pm$50 Oe.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.6
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• pp.441-445
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• 2013

ZnO nanowires on the a-, c- and m-plane oriented 4H-SiC substrates were grown by using a high temperature tube furnace. Ti/Au electrodes were deposited on ZnO nanowires and a-, c- and m-plane 4H-SiC substrates, respectively. The shape and density of the ZnO nanowires were investigated by field emission scanning electron microscope. It was found that the growth direction of nanowires depends strongly on growth parameters such as growth temperature and pressure. In this work, The sensitivity of nanowires formed a-, c- and m-plane oriented 4H-SiC gas sensor was measured at $300^{\circ}C$ with CO gas concentration of 80%. The nanowires grown on a-plane oriented 4H-SiC show improved sensing performance than those on c- and m-plane oriented 4H-SiC due to the increased density of nanowire on a-plane 4H-SiC.

• Journal of Korea Foundry Society
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• v.16 no.2
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• pp.132-140
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• 1996

Both cast and extruded composites of SiC whisker reinforced 6061 Al alloy matrix were fabricated by high pressure infiltration of the alloy melt into the SiC preform and subsequent hot extrusion of the composite ingots. The micro structures, age hardening behavior and mechanical properties have been examined on the both cast and extruded composites of SiCw/6061. The cast composites of SiCw/6061 were obtained in which SiC whiskers were randomly oriented. Hot extrusion of these cast composites lead to alignment of the whisker in the direction of extrusion. Strengthening effect of whisker in the extruded composites is lower than that of the cast composites. The cast composites of SiCw/6061 showed higher thensile strength and lower elongation than extruded composites of SiCw/6061 at all testing temperatures. Lower tensile strength and higher elongation of the extruded composites were attributable to fine grain structures in which grain boundary sliding occruued preferentially at elevated temperatures.

• Journal of the Korean Vacuum Society
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• v.4 no.S2
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• pp.64-68
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• 1995

Silicon films were deposited at $430^{\circ}C$ by remote plasma chemical vapor deposition(RPECVD) with a gas mixture of $Si_2H_6/SiF_4/H_2$. The silicon films deposited without and with $SiF_4$ were characterized using atomic force microscopy(AFM), transmission electron microscopy(TEM) and X-ray diffraction(XRD). Both silicon films have the same rugged surface morphology, but, the silicon film deposited with $SiF_4$ exhibits more rugged. The silicon film deposited without $SiF_4$ is amorphous, whereas the silicon film deposited with $SiF_4$ is polycrystalline with very small needle-like grains which are perpendicular to the substrate and uniformly distributed in the thickness of the film. The silicon film deposited with $SiF_4$ was found to have a preferred orientation along the growth direction with the<110> of the film parallel to the <111> of the substrate. The effect of $SiF_4$ during RPECVD was discussed.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.1
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• pp.84-88
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• 1999

The behavior of oxygen precipitation was investigated in radial direction using Si wafers with different vacancy-related defects generation area. The behavior of oxygen precipitation in radial direction is strongly dependent on the size of vacancy rich area which is related with crystal growth condition. Oxygen precipitation rate is more enhanced in vacancy rich area than that of interstitial rich area. And anomalous oxygen precipitation is generated in the marginal bands of vacancy and interstial area. In V/I boundary, however, oxygen precipitation is suppressed to nearly perfect.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1301-1304
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• 2007

We have investigated degradation of short channel n-type poly-Si TFTs with LDD under high gate and drain voltage stress due to self-heating. We have found that the threshold voltage of short channel TFT is shifted to negative direction on the selfheating stress, whereas the threshold voltage of long channel is moved to positive direction.