• 제목/요약/키워드: SI Analysis

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Si (001) 기판에서 $N_2$처리에 의해 형성된 에피택셜 C49-$TiSi_2$상의 열적 거동과 결정학적 특성에 관한 연구 (Thermal Behavior and Crystallographic Characteristics of an Epitaxial C49-$TiSi_2$ Phase Formed in the Si (001) Substrate by $N_2$Treatment)

  • 양준모;이완규;박태수;이태권;김중정;김원;김호정;박주철;이순영
    • 한국재료학회지
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    • 제11권2호
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    • pp.88-93
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    • 2001
  • $N_2$처리에 의해 Si (001) 기판에 형성된 C49상의 구조를 갖는 에피택셜 $TiSi_2$상의 열적 거동과 결정학적 특성을 X선 회절법 (XRD)과 고분해능 투과전자현미경법 (HRTEM)으로 조사하였다. 에피택결 $C49-TiSi_2$상은 $1000^{\circ}C$ 정도의 고온에서도 안정상인 C54상으로 상변태하지 않고 형태적으로도 고온 특성이 우수하다는 것이 밝혀졌다. HRTEM 결과로부터 에피택결 $TiSi_2$상과 Si 사이의 결정학적 방위관계는 (060) [001]TiSi$_2$//(002) [110]Si임을 알 수 있었고 계면에서의 격자 변형에너지는 misfit 전위의 형성에 의하여 해소되는 것을 확인할 수 있었다. 또한 HRTEM상의 해석과 원자 모델링을 통하여 Si에서 에피택셜 C49-TiSi$_2$상의 형성기구와 C49상의 (020) 면에 존재하는 적층결함을 고찰하였다.

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The Frequency Characteristics of Elastic Wave by Crack Propagation of SiC/SiC Composites

  • Kim, J.W.;Nam, K.W.
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2012년도 추계학술대회 논문집
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    • pp.110-114
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    • 2012
  • We studied on the nondestructive evaluation of the elastic wave signal of SiC ceramics and SiC/SiC composite ceramics under monotonic tensile loading. The elastic wave signal of cross and unidirectional SiC/SiC composite ceramics were obtained by pencil lead method and bending test. It was applied for the time-frequency method which used by the discrete wavelet analysis algorithm. The time-frequency analysis provides time variation of each frequency component involved in a waveform, which makes it possible to evaluate the contribution of SiC fiber frequency. The results were compared with the characteristic of frequency group from SiC slurry and fiber. Based on the results, if it is possible to shift up and design as a higher frequency group, we will can make the superior material better than those of exiting SiC/SiC composites.

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회로해석 및 PCB 전자장 분석을 위한 웹 기반 자동화 프로세스에 관한 연구 (A Study on Automation Process Based on WEB for Circuit and PCB EM Analysis)

  • 이장훈;장석환;정성일;이승요
    • 전기학회논문지
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    • 제63권12호
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    • pp.1716-1721
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    • 2014
  • In this paper, a study on automation method for the circuit/EM (Electro-Magnetic) simulation is carried out to analyze effectively the SI/PI (Signal Integrity/Power Integrity) issues which occur on circuits and/or PCBs (Printed Circuit Boards). For the automation of the circuit/EM simulation, algorithms performing each process of the SI/PI analysis automatically (such as ports setup, circuit definition and SI/PI evaluation) are developed; thereby automation system for the SI/PI analysis is constructed with the algorithms. The automation of the circuit/EM simulation is accomplished in the environment of the C/S (Client/Server) architecture in order to reduce resources such as high cost computers demanded for the SI/PI analysis. The automation method for the SI/PI analyses proposed in this paper reduces effort, time, and cost spent on the environment setup for simulation and the SI/PI analysis process. In addition, the proposed method includes automation of the documenting process, which organizes, records and displays the SI/PI analysis results automatically for users.

SiC 휘스커 보강 Al6061 복합재료의 통계학적 피로균열진전 수명예측 (Statistical Life Prediction of Fatigue Crack Growth for SiC Whisker Reinforced Aluminium Composite)

  • 권재도;안정주;김상태
    • 대한기계학회논문집
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    • 제19권2호
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    • pp.475-485
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    • 1995
  • In this study, statistical analysis of fatigue data which had obtained from respective 24 fatigue crack, was examined for SiC whisker reinforced aluminium 6061 composite alloy (SiC$_{w}$/A16061) and aluminium 6061 alloy. SiC volume fraction in composite alloy is 25%. The analysis results stress intensity factor range and 0.1 mm fatigue crack initiation life for SiC$_{w}$/A16061 composite & A16061 matrix are the log-normal distribution. And regression analysis by linear model, exponential model and multiplicative model were performed to find out the relationship between fatigue crack growth rate(da/dN) and stress intensity for find out the relationship between fatigue crack growth rate(da/dN) and stress intensity factor range(.DELTA.K) in the SiC$_{w}$/A16061 composite and examine the applicability of Paris' equation to SiC$_{w}$A16061 composite. Also computer simulation was performed for fatigue life prediction of SiC$_{w}$/A16061 composite using the statistical results of this study.udy.

SI 프로젝트 계약 및 수행 개선 이슈 분석 (An Analysis on Contract and Business Issues of SI Projects)

  • 김현수
    • 한국IT서비스학회지
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    • 제2권1호
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    • pp.35-49
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    • 2003
  • SI(System Integration) Projects need more efficient project processes. Having efficient contracting laws and regulations is one of the critical success factors for SI industry growth. Former researches developed a framework for efficient contracting laws and regulations for SI industry based on the characteristics of SI business and SI industry. However, the effectiveness of the proposed framework has not been analyzed. This paper tests the validity and effectiveness of the proposed framework. Emprical analysis has been performed to show consensus of each interested parties. Developers and outsourcers have some conflicts in several critical issues of SI project processes. However, comprehensive analysis shows overall consensus among interested parties.

근적외선 분광법을 이용한 고순도 SiCI4 중의 미량 불순물 SiHCI3의 분석 (Analysis of Trace Trichlorosilane in High Purity Silicon Tetrachloride by Near-IR Spectroscopy)

  • 박찬조;이석근
    • 분석과학
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    • 제15권1호
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    • pp.87-90
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    • 2002
  • The content of $SiHCl_3$ as a trace impurity in $SiCl_4$ was analyzed by Near IR spectrophotometer with optical fiber. The strong absorption bands of $5345{\sim}5116cm^{-1}$ and $4848{\sim}4349cm^{-1}$ were used for analysis of $SiHCl_3$, and the detection limit of impurity $SiCl_3$ was appeared to be 0.005 % in the spectrum. The quantitative analysis by Near IR spectrophotometry showed the analytical possibility of trace impurity in $SiCl_4$ without sample pre-treatment not only in the laboratory but also in the field.

CVD법을 이용한 SiC/C경사기능재료 증착공정의 열역학적 해석 (Thermodynamic analysis of the deposition process of SiC/C functionally gradient materials by CVD technique)

  • 박진호;이준호;신희섭;김유택
    • 한국결정성장학회지
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    • 제12권2호
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    • pp.101-109
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    • 2002
  • Hot-wall CVD법으로 SiC/C 경사기능재료를 증착시키는 공정을 열역학적으로 해석하였다. Si-C-H-Cl계에 대한 열역학적 계산을 통해 공정변수(증착온도, 반응기 압력 원료 기체의 C/[Si+C]비와 H/[Si+C]비)가 증착층의 조성과 증착 수율에 미치는 영향을 조사하였고, 이를 통해 SiC/C 경사기능재료 증착에 있어서의 CVD 상평형도와 최적 공정 조건의 범위를 예측할 수 있었다.

기계적 합금화과정에서의 in situ 열분석에 의한 Ti-25.0~37.5at%Si 분말의 합성거동 (Synthesis Behavior of Ti-25.0~37.5at%Si Powders by In situ Thermal Analysis during Mechanical Alloying)

  • 변창섭;현창용;김동관
    • 한국재료학회지
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    • 제14권5호
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    • pp.305-309
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    • 2004
  • Mechanical alloying (MA) of Ti-25.0~37.5at%Si powders was carried out in a high-energy ball mill, and in situ thermal analysis was also made during MA. In order to classify the synthesis behavior of the powders with respect to at%Si, the synthesis behavior during MA was investigated by in situ thermal analysis and X-ray diffraction (XRD). In situ thermal analysis curves and XRD patterns of Ti-25.0~26.1at%Si powders showed that there were no peaks during MA, indicating $Ti_{5}$ $Si_3$ was synthesised by a slow reaction of solid state diffusion. Those of Ti-27.1~37.5at%Si powders, however, showed that there were exothermic peaks during MA, indicating $_Ti{5}$ $Si_3$ and$ Ti_3$Si phase formation by a rapid exothermic reaction of self-propagating high-temperature synthesis (SHS). For Ti-27.1~37.5at%Si powders, the critical milling times for SHS decreased from 38.1 to 18.5 min and the temperature rise, ΔT (= peak temperature - onset temperature) increased form $19.5^{\circ}C$ to $26.7^{\circ}C$ as at%Si increased. The critical composition of Si for SHS reaction was found to be 27.1at% and the critical value of the negative heat of formation of Ti-27.1at%Si to be -1.32 kJ/g.

기계적 합금화과정에서의 in situ 열분석에 의한 Ti-50.0~66.7at%Si 분말의 합성거동 (Synthesis Behavior of Ti-50.0 ~ 66.7at%Si Powders by In situ Thermal Analysis during Mechanical Alloying)

  • 변창섭;이상호;이원희;현창용;김동관
    • 한국재료학회지
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    • 제14권5호
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    • pp.310-314
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    • 2004
  • Mechanical alloying (MA) of Ti-50.0~66.7at%Si powders was carried out in a high-energy ball mill, and in situ thermal analysis was also made during MA. In order to classify the synthesis behavior of the powders with respect to at%Si, the synthesis behavior during MA was investigated by in situ thermal analysis and X-ray diffraction (XRD). In situ thermal analysis curves and XRD patterns of Ti-50.0~59.6at%Si powders showed that there were exothermic peaks during MA, indicating TiSi, $TiS_2$, and $Ti_{5}$ $Si_4$ phase formation by a rapid exothermic reaction of self-propagating high-temperature synthesis (SHS). Those of Ti-59.8~66.7 at%Si powders, however, showed that there were no peaks during MA, indicating any Ti silicide was not synthesised until MA 240 min. For Ti-50.0~59.6at%Si powders, the critical milling times for SHS increased from 34.5 min to 89.5 min and the temperature rise, $\Delta$T (=peak temperature-onset temperature) decreased form $26.2^{\circ}C$ to $17.1^{\circ}C$ as at%Si increased. The critical composition of Si for SHS reaction was found to be 59.6at% and the critical value of the negative heat of formation of Ti-59.6at%Si to be -1.48 kJ/g.

SIMS를 이용한 SiO2/PSG/SiO2/Al-1%Si 및 SiO2/TEOS/SiO2/Al-1%Si 적층 박막내의 Na 게터링 분석 (Analysis of the Na Gettering in SiO2/PSG/SiO2/Al-1%Si and SiO2/TEOS/SiO2/Al-1%Si Multilevel Thin Films using SIMS)

  • 김진영
    • 한국표면공학회지
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    • 제51권2호
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    • pp.110-115
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    • 2018
  • The Na low temperature gettering in $SiO_2/PSG/SiO_2/Al-1%Si$ and $SiO_2/TEOS/SiO_2/Al-1%Si$ multilevel thin films was investigated using dynamic SIMS(secondary ion mass spectrometry) analysis. DC magnetron sputter, APCVD and PECVD techniques were utilized for the deposition of Al-1%Si thin films, $SiO_2/PSG/SiO_2$ and $SiO_2/TEOS/SiO_2$ passivations, respectively. Heat treatment was carried out at $300^{\circ}C$ for 5 h in air. SIMS depth profiling was used to determine the distribution of Na, Al, Si and other elements throughout the $SiO_2/PSG/SiO_2/Al-1%Si$ and $SiO_2/TEOS/SiO_2/Al-1%Si$ multilevel thin films. XPS was used to analyze chemical states of Si and O elements in $SiO_2$ passivation layers. Na peaks were observed throughout the $PSG/SiO_2$ and $TEOS/SiO_2$ passivation layers on the Al-1%Si thin films and especially at the interfaces. Na low temperature gettering in $SiO_2/PSG/SiO_2/Al-1%Si$ and $SiO_2/TEOS/SiO_2/Al-1%Si$ multilevel thin films is considered to be caused by a segregation type of gettering.