• Korean Journal of Materials Research
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• v.33 no.12
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• pp.537-549
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• 2023

The sintering shrinkage behaviors of low temperature cofired ceramics (LTCC) and resistors were compared using commercial LTCC and thick-film resistor pastes, and factors influencing the camber of cofired resistor/LTCC bi-layers were also investigated. The onset of sintering shrinkage of the resistor occurred earlier than that of LTCC in all resistors, but the end of sintering shrinkage of the resistor occurred earlier or later than that of LTCC depending on the composition of the resistor. The sintering shrinkage end temperature and the sintering shrinkage temperature interval of the resistor increased as the RuO₂/glass volume ratio of the resistor increased. The camber of cofired resistor/LTCC bi-layers was obtained using three different methods, all of which showed nearly identical trends. The camber of cofired resistor/LTCC bi-layers was not affected by either the difference in linear shrinkage strain after sintering between LTCC and resistors or the similarity of sintering shrinkage temperature ranges of LTCC and resistors. However, it was strongly affected by the RuO₂/glass volume ratio of the resistor. The content of Ag and Pd had no effect on the sintering shrinkage end temperature or sintering shrinkage temperature interval of the resistor, or on the camber of cofired resistor/LTCC bi-layers.

• Journal of IKEEE
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• v.20 no.1
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• pp.119-122
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• 2016

In this paper, we propose LDO regulator to operate using Pseude resistor instead of widely used Feedback resistor in conventional LDO regulator. Proposed Feedback network using Pseudo resistor has smaller area than the conventional feedback resistor and plays the role of an conventional LDO regulator. Thus, it has been proposed to compensate for the disadvantages of LDO regulator with noise. Although proposed LDO regulator compared with conventional LDO regulator has similar performance, this LDO regulator provide higher efficiency by reducing the overshoot and decreasing the area. This circuit was designed to using a Dongbu Hitek 0.18um CMOS process.

• Journal of the Semiconductor & Display Technology
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• v.18 no.2
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• pp.67-72
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• 2019

This paper proposes a new method for the recognition of resistor color band using a color segmentation in a HSI color model. The proposed method firstly segments a resistor in a chromatic color as a ROI from a background. Secondly, the color bands of the resistor are segmented by vertical projection profile using both the intensity and the saturation differentiation and finally, it recognizes the colors of the segmented color bands using hue, saturation and intensity values. The final results are the value of the resistor and the names of the recognized color. The proposed method is implemented using C language in Raspberry Pi system with a camera module for a real-time image processing. Experiments were conducted by using various resistor images. The results show that the proposed method is successful for the recognition of resistor color band.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.2
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• pp.107-111
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• 2018

In this study, we designed the temperature coefficient of resistance (TCR) and heat radiation properties of shunt fixed resistors by adjusting the atomic composition of a metal alloy resistor, and fabricated a resistor that satisfied the designed properties. Resistors with similar atomic composition of copper and nickel showed low TCR and excellent shunt fixed resistor properties such as short-time overload, rated load, humidity load, and high temperature load. Finally, we expect that improved sensor accuracy will be obtained in current-distribution-type shunt fixed resistor for IoT sensors by designing the atomic composition of the metal alloy resistor proposed in this work.

• Journal of the Korean Ceramic Society
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• v.51 no.4
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• pp.344-349
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• 2014

$RuO_2$-based high frequency thick-film resistor paste was printed at the speed of 10, 100, 300 mm/sec on the AlN substrate, and then sintered at between 750 and $900^{\circ}C$. The sintered thick films were characterized in terms of printing and sintering conditions. With increasing printing speed, the thickness and roughness of sintered film increased. The resistance of the thick film resistor was reduced by increasing the printing speed from 10 to 100 mm/sec, but did not significantly change at 300 mm/sec speed. With increasing sintering temperature, the surface roughness and thickness of sintered resistor film decreased. The reduction rate was large in case of fast printed resistor. The resistance of the resistor increased up to $800^{\circ}C$ with sintering temperature, but again decreased at the higher sintering temperature.

• Proceedings of the KIEE Conference
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• 2002.11c
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• pp.253-256
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• 2002

A programmable CMOS negative resistor has been designed and fabricated in a 0.5um double poly double metal technology. The proposed CMOS negative resistor consists of a positive feedback OTA and a bump circuit with Gaussian-like I-V curve. Measurements of the fabricated chip confirm that the proposed CMOS resistor shows various negative resistance according to control voltage.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.764-767
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• 2003

Nowadays, the study on the ceramic components and modules using LTCC is being peformed and on the passives included in modules is being done also. Especillay frequency dependent components like capacitor and inductor are studied by many groups, but the behavior of embedded resistor in MCM-C module are not studied vigorously. The characteristics of embedded resistor in modules is different from that of resistor alone. In our research, behavior of embedded resistor is examined in the variation of position and geometrical parameters.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.599-602
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• 2004

Nowadays, the study on the ceramic components and modules using LTCC is being peformed and on the passives included in modules is being done also. Especillay frequency dependent components like capacitor and inductor are studied by many groups, but the behavior of embedded resistor in MCM-C module are not studied vigorously. The characteristics of embedded resistor in modules is different from that of resistor alone. In our research, behavior of embedded resistor is examined in the variation of position and geometrical parameters.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.2
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• pp.126-129
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• 2021

We fabricated plate typed shunt resistors composed of carbon nanotube (CNT) and metal alloy for measuring DC current. CNT plates were prepared from dispersed CNT/Urethane solution by squeezing method. Cu/Ni alloys were prepared from composition-designed alloy wires for adjusting the temperature coefficient of resistance (TCR) by pressing them. As well, we fabricated a hybrid resistor by squeezing the CNT/Urethane solution on the metal alloy plate directly. In order to confirm the composition ratio of the Cu/Ni alloy, we used an energy-dispersed X-ray spectroscopy (EDX). Cross-section and surface morphology were analyzed by using a scanning electron microscopy (SEM). Finally, we measured the initial resistance of 2.35 Ω at 25℃ for the CNT paper resistor, 7.56 mΩ for the alloy resistor, and 7.38 mΩ for the hybrid resistor. The TCR was also measured to be -778.72 ppm/℃ at the temperature range between 25℃ to 125℃ for the CNT paper resistor, 824.06 ppm/℃ for the alloy resistor, and 17.61 ppm/℃ for the hybrid resistor. Some of the hybrid resistors showed a near-zero TCR of 1.38, -2.77, 2.66, and 5.49 ppm/℃, which might be the world best-value ever reported. Consequently, we could expect an error-free measurement of the DC current using this resistor.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.4
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• pp.72-77
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• 2008

This paper investgated on fabrication process and tolerance of resistance body with a uniform thickness formed by the process of cavity type on organic substrate for application of embedded resistor. To improve the tolerance of resistance value according to a position of PCB cause by conventional screen printing, we introduced the process of cavity type from organic substrate. A resistor with a desired shape and volume was precisely formed by the process of cavity using a resistor paste and screen printing. This method can increase PCB's productivity by shortening its production time because process conditions of a screen prining device can be set quickly without any affection on its position accuracy.