• 한국경영정보학회:학술대회논문집
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• 2007.06a
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• pp.539-544
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• 2007

People tend to resist changing their software even alternatives are better then the current one. This study examines the resistance to change in the use of software from the switching costs perspective based on status quo bias theory. For this study, we select Web Browsers as software. Based on the classification of switching costs into three groups (psychological, procedural, and loss), this study identifies six types of switching costs (uncertainty, commitment, learning, setup, lost performance, and sunk costs). This study tests the effects of six switching costs on user resistance to change based on the survey of 204 web browser users. The results indicate that lost performance costs and emotional costs have significant effects on user resistance to change. This research contributes towards understanding of switching costs and the effects on user resistance to change. This study also offers suggestions to software vendors for retaining their users and to organizations for managing user resistance in switching and adopting software.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.224-224
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• 2010

Pt와 ITO 상부전극의 top-electode/NiO/Pt 구조에서 resistance switching현상을 연구하였다. 하부전극물질이 resistance switching현상에 미치는 영향은 이미 연구되었다. Ohmic 이나 low Schottky contact은 NiO 박막의 resistance switching 현상은 높은 전기장의 인가에 의해 것이 나타나는 것은 알 수 있었다. Ohmic contact에서는 유도전기장에 의한 resistance switching 현상들을 관찰할 수 있다. low Schottky barrier를 가지는 ITO/NiO/Pt 구조에서 resistances switching현상은 관찰되지 않고 Pt/ITO구조로 Ohmic 접촉은 유도전기장에 의한 resistance switching 현상이 나타나지 않음을 알 수 있었다.

• The Journal of Information Systems
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• v.28 no.3
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• pp.59-81
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• 2019

Purpose The purpose of this study is to investigate the resistance factors interfering the acceptance factors of the mobile easy remittance service focusing on the switching cost and the innovation resistance model. Design/methodology/approach This study focuses on revealing the resistance factors of the mobile easy remittance service acceptance. The resistance factor is designed consisting both consumer characteristics and service characteristics in the Innovation Resistance Model. Furthermore, the effect of resistance factors on the innovation resistance and acceptance intentions were detected by moderating the switching cost. Findings According to the empirical analysis result, this study investigated the effect of resistance factors on innovation resistance and acceptance intention for the mobile easy remittance service. The results of this study as follows; (1) The consumer's inherent innovativeness did not significantly affect the innovation resistance and acceptance intention. (2) The attitude toward existing services and complexity significantly affected innovation resistance in direct manner, thus affecting the acceptance intention in indirect manner. (3) The perceived usefulness significantly affected both the innovation resistance and the acceptance intention in direct manner. (4) The perceived risk only effected the acceptance intention. (5) The switching cost had a moderating effect on the innovation resistance and acceptance intention.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.187-187
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• 2010

In this study, we investigated the effect of electrodes on resistance switching of TaOx film. Pt, Ni, TiN, Ti and Al metal electrodes having the different oxidation degree were deposited on TaOx/Pt stack. Unipolar resistance switching behavior in Pt or Ni/TaOx/Pt MIM stacks was investigated, but bipolar resistance switching behavior in TiN, Ti or Al /TaOx/Pt MIM stacks was shown. We investigated that the voltage dependence of capacitance was decreased with higher oxidation degree of metal electrodes. Through the C-V results, we expected that linearity ($\alpha$) and quadratic ($\beta$) coefficient was reduced with an increase of interface layer between top electrode and Tantalum oxide. Transmission Electron Microscope (TEM) images depicted the thickness of interface layer formed with different oxidation degree of top electrode. Unipolar resistance switching behavior shown in lower oxidation degree of top electrode was expected to be generated by the formation of the conducting path in TaOx film. But redox reaction in interface between top electrode and Tantalum oxide may play an important role on bipolar resistance switching behavior exhibited in higher oxidation degree of top electrode. We expected that the resistance switching characteristics were determined by oxidation degree of metal electrodes.

• 전기의세계
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• v.23 no.6
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• pp.49-55
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• 1974

Amorphous semiconductor from As 30 Te 48 Ge 10 Si 12 was prepared, and studied electron microscopy, X-ray analysis and resistivity measurement. It's resistivity is 1.56*10$^{6}$ .ohm.-cm when small ampule is used for preparing sample it is found that no phase separation has occurced by electron microscopy, and that phase transition temperature is 232.deg. C by differential Thermal Analysis. The specimen showed threshold switching that the low resistance state occur at critical electric field and the resistance recover at low applied field. Critical electric field of the switching is 10$^{5}$ V/cm at room temperature. Threshold voltage secreace exponentially with increasing ambient temperature and at that each voltage resistance of the switching device increase exponentially. According to the series resistance and applied vottage current slope on the V-I curve is varied. When applied voltage is decreased after switching, the resistance of the switching device is increased. By this result the origin of the switching is the Joule's heating.

• Journal of IKEEE
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• v.17 no.3
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• pp.229-233
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• 2013

We investigated electrical conduction and resistance switching behavior of the Ag/ZnO/Ti structures for random access memory devices. These films were prepared on glass substrate by dc sputtering technique at room temperature. The resistance switching follows unipolar switching mode with small switching voltages (0.4 V - 0.6 V). Two electrical conduction mechanisms dominating the LRS and HRS are Ohmic and trap-controlled space charge limited current, respectively. These both conductions are consistent with the filamentary model. Based on the filamentary model, the switching mechanism was also interpreted.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.288-288
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• 2012

In this study, we investigated that the resistance switching characteristics of W-doped NbOx films with increasing W doping concentration. The W-doped NbOx based ReRAM devices with a TiN/W-doped NbOx/Pt/Ti/SiO2 were fabricated on Si substrates. The 50 nm thick W-doped NbOx films were deposited by reactive dc magnetron co-sputtering at $400^{\circ}C$ and oxygen partial pressure of 35%. Micro-structure of W-doped NbOx films and atomic concentration were investigated by XRD, TEM and XPS, respectively. The W-doped NbOx films showed set/reset resistance switching behavior at various W doping concentrations. The process voltage of set/reset is decreased and whereas the initial current level is increased with increasing W doping concentration in NbOx films. The change of resistance switching behavior depending on doping concentration was discussed in terms of concentration of metallic tungsten of oxygen of W-doped NbOx.

• The Transactions of the Korean Institute of Electrical Engineers A
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• v.52 no.12
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• pp.713-721
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• 2003

This paper analyzes the switching overvoltage occurred on 345kV underground power cable system as well as combined transmission system using EMTP. Cable length and closing time, preinsertion resistance have effect on switching overvoltage. Therefore, this paper analyzes the switching overvoltage occurred on conductor and sheath with change of those parameters. Specially, the cross bonding position becomes discontinuity point because of the difference between surge impedance of metal sheath and that of lead cable. Thus, the transmission and the reflection of traveling wave complexly occur at this connection point. According to these influences, voltage between sheath and earth as well as voltage between joint boxes rise. Time to crest point of switching overvoltage is longer than lightning overvoltage. Even though the voltage induced by switching surge is smaller than lightning surge, that voltage may have serious effect on the metal sheath. Therefore, this paper also analyses the reduction effect of switching overvoltage when the preinsertion resistance of circuit breaker is considered.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.171-171
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• 2010

In this work, we investigated the effect of the oxidation temperature on the unipolar and bipolar resistance switching behaviors of the oxidized TiO-x films. TiOx films on Pt electrodes were fabricated by the oxidation of Ti films at $550^{\circ}C$ for 1 to 3 hours. The unipolar and bipolar resistance switching properties were investigated with the oxidation temperature and time. Also, the crystal structure and the physical properties such as chemical bonding states of TiOx layers were characterized in addition to the resistance switching characteristics. The resistance switching behaviors of TiOx films oxidized at above $450^{\circ}C$ and below $650^{\circ}C$ was shown. So, we investigated that the resistance switching behaviors of TiOx films oxidized at $550^{\circ}C$ with the oxidation time from 1 to 3 hour. The memory windows of unipolar switching in the oxidized TiOx films were reduced with increasing the oxidation time, but those of the bipolar switching were slightly enlarged. The enlargement of rutile TiO2 peak with increasing the oxidation time and temperature was studied by X-ray diffraction. An increase of non-lattice oxygen and Ti3+ in the TiOx films with the oxidation times was investigated by X-ray photoemission spectroscopy. It was expected that the uipolar and bipolar resistive switching of the oxidized TiOx film was strongly related with the migration of non-lattice oxygen anions and schottky barrier height, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.378.1-378.1
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• 2014

In this study, we investigated that the resistance switching characteristics of Nb-doped HfO2 films with increasing Nb doping concentration. The Nb-doped HfO2 based ReRAM devices with a TiN/Nb-doped HfO2/Pt/Ti/SiO2 were fabricated on Si substrates. The Nb-doped HfO2 films were deposited by reactive dc magnetron co-sputtering at $300^{\circ}C$ and oxygen partial ratio of 60% (Ar: 16sccm, O2: 24sccm). Microstructure of Nb-doped HfO2 films and atomic concentration were investigated by XRD, TEM, and XPS, respectively. The Nb-doped HfO2 films showed set/reset resistance switching behavior at various Nb doping concentrations. The process voltage of forming/set is decreased and whereas the initial current level is increased in doped HfO2 films. However, the switching properties of Nb-doped HfO2 were changed above the specific doping concentration of Nb. The change of resistance switching behavior depending on doping concentration was discussed in terms of concentration of non-lattice oxygen and micro-structure of Nb-doped HfO2.