• Transactions of the Korean Society of Mechanical Engineers B
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• v.21 no.1
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• pp.57-67
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• 1997

The solidification process of Al 4.5%Cu alloy is numerically studied in the presence of contact resistance between mold and cast. Natural convection is considered in the liquid and mushy regions. The porosity approach is applied to the mushy zone modeling and linear variation of the solid fraction on the temperature is assumed. Results show that the mushy region is wider in the case with a contact resistance compared to the perfect contact condition. The temperature of the cast with a temporal variation in the contact heat transfer coefficient changes very rapidly in the early stage of the casting process compared to that with constant contact heat transfer coefficient.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.2
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• pp.348-355
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• 1992

Casting structures and properties are determined by the solidification speed in the metal mold. The heat transfer characteristics of the interface between the mold and the casting is one of the major factors that control the solidification speed. According to Sully's research, the thermal resistance exists due to the air-gap formation at the mold-casting interface during the freezing process and the interface heat transfer coefficient is used to describe the degree of it. In this study, one-dimensional Stefan problem with air-gap resistance in the cylindrical geometry is considered and heat transfer characteristics is numerically examined. The temperature distribution and solidification speed are obtained by using the modified variable time step method. And the effects of the major parameters such as mold geometry, thermal conductivity, heat transfer coefficient and initial temperature of casting on the thermal characteristics are investigated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.1022-1025
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• 2001

This paper presents the characteristics of TaN thin-film as high-temperature strain gauges, which were deposited on Si substrate by DC reactive magnetron sputtering in an argon-nitrogen atmosphere(Ar-(4∼20%)N$_2$). The electrical and mechanical characteristics of these films investigated with the thickness range 1650∼1870${\AA}$ and room temperature resistivities in the range 178.3 ${\mu}$$\Omega$cm to 3175.7 ${\mu}$$\Omega$cm. The TaN thin-film strain gauge deposited in Ar-(20%)N$_2$atmosphere is obtained a temperature coefficient of resistance(TCR), 0∼-1357 ppm/$^{\circ}C$ in the temperature range 25∼275$^{\circ}C$ and a high temporal stability with a longitudinal gauge factor, 2.92∼3.47. Because of their high resistivity, low TCR and linear gauge factor, these cermet thin-film may allow high-temperature strain gauges miniaturization.

• Tribology and Lubricants
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• v.30 no.3
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• pp.146-155
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• 2014

In this study, we conduct fretting corrosion tests on tin-plated brass coupons to investigate the effect of temperature on fretting corrosion for various span amplitudes. We prepare a coupled fretting corrosion specimens using a tin-plated brass coupon with a thickness of $10{\mu}m$. One specimen is a flat coupon and the other specimen is a coupon with a protuberance in 1 mm radius, which is produced using 2 mm diameter steel ball. We conduct fretting corrosion tests at $25^{\circ}C$, $50^{\circ}C$, $75^{\circ}C$, $100^{\circ}C$ by rubbing the coupled coupons together at the contact between the flat and protuberance coupons. We measure electric resistance of the contact during the fretting corrosion test period. There is increase in resistance with fretting cycles. It is found that rate of increase in electric resistance becomes faster with increase in testing temperature. Magnitude of friction coefficient increases with fretting span amplitudes. And, change in friction coefficient becomes desensitized to the increment in span amplitude. Assuming that failure cycle is the cycle with an electric resistance of $0.01{\Omega}$, we find that failure lifetime ($N_f$) decreases with increase in testing temperature. Furthermore, based on the assumption that the damage rate of the connector is inversely related to the failure cycle, we calculate the activation energy for fretting damage to be 13.6 kJ/mole by using the Arrhenius equation. We propose a method to predict failure cycle at different temperatures for span amplitudes below $30{\mu}m$. Friction coefficients generally increase with increase in span amplitude and decrease in testing temperature.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.7
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• pp.546-551
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• 1998

$Mn{1-X}Fe{2+X}O_4, Mg_{1-X}Fe_{2+X}O_4$ (x=0.0, 0.025, 0.1, 0.2) for negative temperature coefficient (NTC) thermistor was prepared by calcination at $800^{\circ}C$ and sintering at form 1100 to $1250^{\circ}C$ with $50^{\circ}C$ intervals. The best linear property was obtained in the Mn-based sample sintered at $1200^{\circ}C$ with x=0.0 composition. Temperature coefficient of resistance, $\alpha$, was $-5.6%/^{\circ}C$ in the Mn-based sample, $-5.2%/^{\circ}C$ in the MM-based sample, and $-1.6%/^{\circ}C$ in the Mg-based sample. thermistor parameter, B, was in the range of 2665~7780 K. The results show the possibility that Mn-Ni-Co based thermistor could be substituted by the composition used in this study.

• Journal of the Korean Ceramic Society
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• v.40 no.10
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• pp.921-924
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• 2003

A current-voltage relation for Positive Temperature Coefficient of Resistance (PTCR) ceramic was derived and compared with the experimental data. The new current-voltage relation was developed based on Heywangs double Schottky barrier model and a bias distribution across the grain boundary. The voltage limitation V < 4${\Phi}$$\sub$b/ suggested by Heywang is no longer necessary in the new expression for the voltage dependence of the resistance. The pulsed voltages were applied to the PTCR ceramic specimen in order to avoid possible temperature variation during the measurement.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.4
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• pp.328-335
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• 2001

In this work, we made the precision thin film resistors of NiCr alloy (74wt%Ni-f18wt%Cr-4wt%Al-4wt%Cu) using DC/RF magnetron sputtering method and studied the sheet resistance and TCR(Temperature Coefficient of Resistance) etc... of the Ni-Cr-Al-Cu alloy thin film according to the change by annealing treatment to 400$\^{C}$ in air and nitrogen atmosphere and the change(power, pressure, substrate temperature) of sputtering process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.4
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• pp.352-356
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• 2007

The Ni/Cr/Al/Cu (51/41/4/4 wt%) thin films were deposited by using DC magnetron sputtering method for the application of the resistors having low TCR (temperature coefficients of resistance) and high resistivity from the former printed-results[3]. The TCR values measured on the as-deposited thin film resistors were less than ${\pm}10\;ppm/^{\circ}C$ and $-6{\sim}+1\;ppm/^{\circ}C$ after annealing and packaging process. The TCR values were $-3{\sim}1\;ppm/^{\circ}C$ (ratio of variation : about 0.02 %) and $-30{\sim}20\;ppm/^{\circ}C$ (ratio of variation : about $0.5{\sim}1\;%$) for the thermal cycling and PCT (pressure cooker test), respectively. It was confirmed that the reliability properties of the thin film resistor were good for electronic components.

• International Journal of Highway Engineering
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• v.15 no.6
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• pp.25-32
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• 2013

PURPOSES : The purpose of this study is to provide the method of how to measure the coefficient of thermal expansion of concrete using temperature compensation principle of electrical resistance strain gauge. METHODS : The gauge factor compensation method and thermal output(temperature-induced apparent strain) correction method of self-temperature compensation gauge were investigated. From the literature review, coefficient of thermal expansion measurement method based on the thermal output differential comparison between reference material(invar) and unknown material(concrete) was suggested. RESULTS : Thermal output is caused by two reasons; first the electrical resistivity of the grid conductor is changed by temperature variation and the second contribution is due to the differential thermal expansion between gauge and the test material. Invar was selected as a reference material and it's coefficient of thermal expansion was measured as $2.12{\times}10^{-6}m/m/^{\circ}C$. by KS M ISO 11359-2. The reliability of the suggested measurement method was evaluated by the thermal output measurement of invar and mild steel. Finally coefficient of thermal expansion of concrete material for pavement was successfully measured as $15.45{\times}10^{-6}m/m/^{\circ}C$. CONCLUSIONS : The coefficient of thermal expansion measurement method using thermal output differential between invar and unknown concrete material was evaluated by theoretical and experimental aspects. Based on the test results, the proposed method is considered to be reasonable to apply for coefficient of thermal expansion measurement.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.361-361
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• 2007

A lot of efforts have been paid to develop infrared imaging systems in last decades. Bolometer has a wide range of applications from military to commercial, such as military night vision, medical imaging system and so on. Bolometer is a resistive sensor that detects temperature changes through resistance change. To improve detecting ability, bolometer should have a good resistive film which has high temperature coefficient of resistance (TCR) value. Colossal magnetoresistance (CMR) $L_{1-x}A_xMnO_3$ (where L and A are trivalent rare-earth ions and divalent alkaline earth ions, respectively.) are received attention to apply bolometer resistive film because it has a high TCR property which was discovered in the metal to semiconductor phase transition temperature region. In this work, CMR films were deposited on various substrates in relative low substrate temperature by RF magnetron sputtering. The influence of deposition parameters such as substrate temperature, gas partial pressure, and so on have been studied. The structural and TCR properties of the films were also investigated for applying to microbolometer.