• Polymer(Korea)
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• v.34 no.1
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• pp.52-57
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• 2010

The low viscous epoxy resin(bisphenol F) with carboxylic acid as the reductants was introduced for high performance and reliability in the ACA with a low melting point alloy filler system. The curing characteristics of the epoxy resin and temperature dependant viscosity characteristic of epoxy resin at the melting temperature of LMPA were investigated by dynamic mode of differential scanning calorimetry (DSC) and rheometer, respectively. Based on these thermo-rheological characteristics of epoxy resin and LMPA, the optimum process system was designed. In order to remove the oxide layer on the surface of LMPA particle, three different types of carboxyl acid-based reductant were added to the epoxy resin. The wetting angles were about $18^{\circ}$ for carboxypropyldisilioxane, and $20.3^{\circ}$ for the carboxy-2-methylethylsiloxane, respectively.

• Journal of Adhesion and Interface
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• v.3 no.1
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• pp.20-23
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• 2002

The wetting properties of an uncured epoxy resin on both clean and oiled, galvanised steel have been studied. Since the polymer is very viscous at ambient temperature, and also with an aim to simulate industrial conditions, the spreading of drops of resin during a heating cycle (temperature increase at $10^{\circ}C/min$) was recorded and analysed. On clean steel, a contact angle, ${\theta}$, vs time, t, plot shows sigmoidal behaviour, whereas on the oiled substrate, spreading almost ceases in an intermediate stage. This strange behaviour is attributed to significant oil absorption by the polymer.

• The Korean Journal of Rheology
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• v.11 no.1
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• pp.34-43
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• 1999

Flow-induced voids during resin impregnation and poor fiber wetting have known to be highly detrimental to the performance of composite parts manufactured by resin transfer molding(RTM) process. In this study, in order to overcome these serious problems encountered in RTM, the effects of surface modification by using silane coupling agent as a surface modifier on the flow characteristics, the wetting between resin and fiber, and void content were investigated. For the experiments of microscopic flow visualization and curing in a beam mold, glass fiber mats having plain weaving structure and epoxy resin were used. Modifying the fiber surface was found to result in a significant decrease of dynamic contact angle between resin and fiber and increase of wicking rate. Therefore, it was confirmed that the surface modification employed in this study could improve the wettability of reinforcing fibers as well as micro flow behavior. In addition, It was revealed that high temperature and low penetration rate of the resin are more favorable processing conditions to reduce the dynamic contact angle. However, surface modified fiber mat was found to have lower permeability than the unmodified one, which may be explained in terms of the decrease of contact time between resin and fiber owing to improvement of wetting. It was also exhibited that surface modification had a significant influence on void formation in RTM process, resulting in a decrease of overall void content due to the improvement of wetting in cured composite parts.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.35-41
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• 2015

In this study, in order to improve the reliability of ACF interconnections, solder ACF joints were investigated interms of solder joint morphology and solder wetting areas, and evaluated the electrical properties of Flex-on-Board (FOB) interconncections. Solder ACF joints with the ultrasonic bonding method showed excellent solder wetting by broken solder oxide layers on solder surfaces compared with solder joints with remaining solder oxide layer bonded by the conventional thermo-compression (TC) bonding method. When higher target temperature was used, Sn58Bi solder joints showed concave shape due to lower degree of cure of resin at solder MP by higher heating rate. ACFs with epoxy resins and SAC305 solders showed lower degree of resin cure at solder MP due to the slow curing rate resulting in concave shaped solder joints. In terms of solder wetting area, solder ACFs with $25-32{\mu}m$ diameters and 30-40 wt% showed highest wetted solder areas. Solder ACF joints with the concave shape and the highest wetting area showed lower contact resistances and higher reliability in PCT results than conventional ACF joints. These results indicate that solder morphologies and wetting areas of solder ACF joints can be controlled by adjustment of bonding conditions and material properties of solder and polymer resin to improve reliability of ACF joints.

• Restorative Dentistry and Endodontics
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• v.20 no.1
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• pp.97-112
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• 1995

The purpose of this study was to evaluate the effect of wetting condition made by drying time on bonding of resin cement to dentin. Freshly extracted bovine teeth were grinded to expose flat dentin surfaces. After the exposed dentin surfaces were treated with pretreatment agents and water rinse, each wetting condition of dentin surfaces was made according to drying times and methods including slight blow bry for I-second by air syringe, blow dry for 20-second by air syringe, and 12-hour dry in desiccator respectively. and then, previously made composite resin specimens were bonded onto each conditioned dentin surface of the specimen using Panavia-21(Kuraray Co.), Bistite(Tokuso Co.), and Choice(use with All bond-2, Bisco Inc.) resin cement according as manufacturer's instruction. Bonded specimens were stored in $37^{\circ}C$ distilled water for 24 hours, then the tensile bond strength was measured, cohesive failure rate was calculated, and fractured dentin surfaces and acrylic rod sides were examined under scanning electron microscope. The result were as follows ; In the group of bonding with Panavia-21 resin cement, higher tensile bond strength was seen in 12-hour dry group than in I-second and 20-second dry group(p<0.01). In the group of bonding with Bistite resin cement, higher tensile bond strength was seen in 1-second dry group than in 20-second and 12-hour dry group(p<0.01). In the group of bonding with Choice resin cement, no significant differences of bond strength under given drying time were seen. Cohesive failure rates derived from the groups of bonding with Panavia-21 and Choice resin cement were increased with the increase of tensile bond strength in each drying time. On SEM examination of fractured surface, adhesive failure mode with fractured resin tags was mostly seen in wet condition with I-second drying time in the group of bonding with Panavia-21 resin cement, mixed failure mode with shortened and fractured resin tag was seen in the group of bonding with Bistite resin cement, and regardless of drying time, and cohesive-adhesive mixed failure mode with fracture of 'Hollow' typed resin tags was mainly seen in the group of bonding with Choice resin cement.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.11a
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• pp.249-252
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• 2000

To overcome problems of excavation technology far repairing or replacing underground buried pipes which are worn out or damaged, various trenchless repair-reinforcement technologies have been invented. But these trenchless technologies also have many problems in the aspect of economy and convenience of operation. In this research, the repair-reinforcement process using RTM (Resin Transfer Molding) which can solve problems of present trenchless technologies was developed. The resin wetting and void removal during RTM process to form large composite structures inside of buried pipes were experimentally investigated. From the experiment, it was found that the new technology had advantage over conventional methods by employing appropriate process parameters and void removal vents.

• Macromolecular Research
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• v.10 no.4
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• pp.194-203
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• 2002

In resin infusion process(RIP), the fiber and the resin are in contact with each other for an impregnation step and often results in flow-induced defects such as poor fiber wetting and void formation. Resin flow characteristics in transverse direction and process modeling for woven fabric were studied, and the process modeling was applied to the manufacturing of hybrid composite materials. This study also considered the compressibility of woven fabrics in a series of compression force, and it was fitted well to an elastic model equation. Void formation was varied with the processing conditions in the stage of manufacturing composites using RIP. It was concluded from this study that proper combination of pressure build-up and dynamic heating condition makes important factor for flow-induced composite processing.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.175-177
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• 2006

Electrically Conductive Adhesives(ECAs) with solderable particles have been developed as an alternative to Pb-free solders. Our previous study proved that good wettability of solder particle is a prerequisite for the establishment of conduction paths. In this paper, two types of ECAs were formulated and the wetting characteristic low-melting-point Sn-In solder on Cu and Ni/Au pads was investigated. It was found that Sn-In solder in the developed resin material with reduction capability shows good wettability, especially on Cu pad.

• Composites Research
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• v.30 no.3
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• pp.169-174
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• 2017

Demand of glass fiber reinforced composites (GFRC) increased with developing aircraft and defense industries using resin transfer molding (RTM) process to produce complex product. In this research, wetting, interfacial, and mechanical properties were evaluated with different Cross-linking Density by Molecular Weight of Hardener. Epoxy resin as matrices was used bisphenol-A type and amine-type hardeners with different molecular weight. Specimens were manufactured via RTM and wetting property of resin and glass fiber (GF) mat was evaluated to viscosity of epoxy and injection time of epoxy matrix. Mechanical property of GFRC was determined via flexural strength whereas interfacial properties were determined by interlaminar shear strength (ILSS) and interfacial shear strength (IFSS). The difference in mechanical property depends upon the fiber weight fraction (wt %) of GFRC by RTM as well as the different Molecular Weight of Hardener.

• ETRI Journal
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• v.32 no.2
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• pp.342-344
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• 2010

A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and low-melting-point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by out-gassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 ${\mu}m$ and 150 ${\mu}m$.