• 제목/요약/키워드: Residual Al

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Design optimization for analysis of surface integrity and chip morphology in hard turning

  • Dash, Lalatendu;Padhan, Smita;Das, Sudhansu Ranjan
    • Structural Engineering and Mechanics
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    • v.76 no.5
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    • pp.561-578
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    • 2020
  • The present work addresses the surface integrity and chip morphology in finish hard turning of AISI D3 steel under nanofluid assisted minimum quantity lubrication (NFMQL) condition. The surface integrity aspects include microhardness, residual stress, white layer formation, machined surface morphology, and surface roughness. This experimental investigation aims to explore the feasibility of low-cost multilayer (TiCN/Al2O3/TiN) coated carbide tool in hard machining applications and to assess the propitious role of minimum quantity lubrication using graphene nanoparticles enriched eco-friendly radiator coolant based nano-cutting fluid for machinability improvement of hardened steel. Combined approach of central composite design (CCD) - analysis of variance (ANOVA), desirability function analysis, and response surface methodology (RSM) have been subsequently employed for experimental investigation, predictive modelling and optimization of surface roughness. With a motivational philosophy of "Go Green-Think Green-Act Green", the work also deals with economic analysis, and sustainability assessment under environmental-friendly NFMQL condition. Results showed that machining with nanofluid-MQL provided an effective cooling-lubrication strategy, safer and cleaner production, environmental friendliness and assisted to improve sustainability.

A Study on the Thermo-Mechanical Coupling Analysis to Working Condition of LAM (LAM 가공조건에 따른 열-구조 연성해석)

  • Park, Jeong-Ho;Park, Sung-Ho;Kim, Gwi-Nam
    • Journal of the Korean Society of Industry Convergence
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    • v.25 no.6_3
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    • pp.1127-1133
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    • 2022
  • Recently, the use of aircraft structures using Ti alloy (Ti-6Al-4V), a lightweight high-strength alloy material, is rapidly increasing due to the weight reduction of aircraft. However, high-strength materials such as Ti alloys require high energy for cutting and are classified as difficult-to-cut materials. Also, research on Laser Assisted Machining (hereinafter referred to as LAM), a cutting processing technology that utilizes improved machinability, is being actively researched. Therefore, in this paper, in order to confirm the proper temperature distribution using a laser, the finite element method is used to determine the temperature distribution according to the calorific value condition to derive the appropriate condition, and the thermal load generated at this time is used as a structural analysis. It is intended to be used as basic data for LAM processing conditions by measuring the amount of residual stress and thermal deformation caused by heat.

Buckling behavior of intermediate filaments based on Euler Bernoulli and Timoshenko beam theories

  • Muhammad Taj;Muzamal Hussain;Mohamed A. Khadimallah;Muhammad Safeer;S.R. Mahmoud;Zafer Iqbal;Mohamed R. Ali;Aqib Majeed;Abdelouahed Tounsi;Manzoor Ahmad
    • Advances in concrete construction
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    • v.15 no.3
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    • pp.171-178
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    • 2023
  • Cytoskeleton components play key role in maintaining cell structure and in giving shape to the cell. These components include microtubules, microfilaments and intermediate filaments. Among these filaments intermediate filaments are the most rigid and bear large compressive force. Actually, these filaments are surrounded by other filaments like microtubules and microfilaments. This network of filaments makes a layer as a surface on intermediate filaments that have great impact on buckling behavior of intermediate filaments. In the present article, buckling behavior of intermediate filaments is studied by taking into account the effects of surface by using Euler Bernoulli and Timoshenko beam theories. It is found that effects of surface greatly affect the critical buckling force of intermediate filaments. Further, it is observed that the critical buckling force is inversely proportional to the length of filament. Such types of observations are helpful for further analysis of nanofibrous in their actual environments within the cell.

Increased Available Phosphate by Shell Meal Fertilizer Application in Upland Soil (밭 토양에서 패화석비료 시용에 따른 유효인산의 증대)

  • Lee, Chang-Hoon;Lee, Ju-Young;Ha, Byung-Hyun;Kim, Pil-Joo
    • Korean Journal of Soil Science and Fertilizer
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    • v.38 no.1
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    • pp.52-57
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    • 2005
  • Previous studies showed that shell meal fertilizer from the oyster farming industry could be a potential inorganic soil amendment to increase Chinese cabbage productivity and to restore the soil nutrient balance in upland soil (Lee et al., 2004). Herein, shell meal fertilizer was applied at rates of 0, 4, 8, 12, and $16Mg\;ha^{-1}$ to upland soil (Pyeontaeg series, Fine silty, Typic Endoaquepts) for Chinese cabbage cultivation. We found available phosphate increased significantly with shell meal fertilizer application, due to high content of phosphate ($1.5g\;P_2O_5\;kg^{-1}$) in the applied shell meal fertilizer. In addition, high pH of shell meal fertilizer contributed to increase available phosphate content by neutralization of acidic soil. Total and residual P contents increased significantly with increasing shell meal fertilizer application, but we could not find any tendency in organic and inorganic P fraction. Of extractable P fraction, water-soluble phosphorus (W-P) and calcium-bound P (Ca-P) contents increased significantly with increasing application level. By contrast, aluminum and iron-bound P (Al-P and Fe-P) decreased slightly with shell meal application. The present experiment indicated that shell meal fertilizer had a positive benefit on increasing available phosphate content in arable soil. And so the increased available phosphate by shell meal fertilizer may decrease phosphate application level and then reduce phosphorus loss in arable soil.

Improvement of the Adhesion Properties between Aluminum and a Parylene-C Film by Using the Duoplasmatron Ion Source (Duoplasmatron Ion Source를 이용한 Parylene과 Al의 접착력 향상에 관한 연구)

  • Choi, Sung-Chang
    • Journal of the Korean Vacuum Society
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    • v.21 no.2
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    • pp.78-85
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    • 2012
  • In order to improve the adhesion between poly-monochloro-para-xylylene (Parylene-C) film and Aluminum thin film, the surface of Parylene-C film was irradiated by ${O_2}^+$ and $Ar^+$ ion beam generated by duoplamatron ion source. The ion dose of $Ar^+$ and ${O_2}^+$ was changed from $5{\times}10^{14}$ to $1{\times}10^{17}/cm^2$ and the ion beam energy was 1 kV. Contact angles of water on Parylene-C modified by $Ar^+$ and ${O_2}^+$ ion irradiation decreased from $78^{\circ}$ to around $17^{\circ}$, and $9^{\circ}$, respectively. X-ray photoelectron spectroscopy analysis shows that the hydrophilic groups were formed on the surface of Parylene-C by chemical reaction between the unstable chains induced by the ion irradiation and oxygen ions or residual oxygen gas. The hydrophilic groups were identified as C-O bond, C=O bond and (C=O)-O bond. The cross cut tape test which was applied to characterize the adhesion between Al thin film and Parylene-C film modified by ${O_2}^+$ ions irradiation shows that the adhesion strength was improved as increasing ion dose.

Plasma Etching Characteristics of Sapphire Substrate using $BCl_3$-based Inductively Coupled Plasma ($BCl_3$ 계열 유도결합 플라즈마를 이용한 사파이어 기판의 식각 특성)

  • Kim, Dong-Pyo;Woo, Jong-Chang;Um, Doo-Seng;Yang, Xue;Kim, Chang-Il
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.363-363
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    • 2008
  • The development of dry etching process for sapphire wafer with plasma has been key issues for the opto-electric devices. The challenges are increasing control and obtaining low plasma induced-damage because an unwanted scattering of radiation is caused by the spatial disorder of pattern and variation of surface roughness. The plasma-induced damages during plasma etching process can be classified as impurity contamination of residual etch products or bonding disruption in lattice due to charged particle bombardment. Therefor, fine pattern technology with low damaged etching process and high etch rate are urgently needed. Until now, there are a lot of reports on the etching of sapphire wafer with using $Cl_2$/Ar, $BCl_3$/Ar, HBr/Ar and so on [1]. However, the etch behavior of sapphire wafer have investigated with variation of only one parameter while other parameters are fixed. In this study, we investigated the effect of pressure and other parameters on the etch rate and the selectivity. We selected $BCl_3$ as an etch ant because $BCl_3$ plasmas are widely used in etching process of oxide materials. In plasma, the $BCl_3$ molecule can be dissociated into B radical, $B^+$ ion, Cl radical and $Cl^+$ ion. However, the $BCl_3$ molecule can be dissociated into B radical or $B^+$ ion easier than Cl radical or $Cl^+$ ion. First, we evaluated the etch behaviors of sapphire wafer in $BCl_3$/additive gases (Ar, $N_2,Cl_2$) gases. The behavior of etch rate of sapphire substrate was monitored as a function of additive gas ratio to $BCl_3$ based plasma, total flow rate, r.f. power, d.c. bias under different pressures of 5 mTorr, 10 mTorr, 20 mTorr and 30 mTorr. The etch rates of sapphire wafer, $SiO_2$ and PR were measured with using alpha step surface profiler. In order to understand the changes of radicals, volume density of Cl, B radical and BCl molecule were investigated with optical emission spectroscopy (OES). The chemical states of $Al_2O_3$ thin films were studied with energy dispersive X-ray (EDX) and depth profile anlysis of auger electron spectroscopy (AES). The enhancement of sapphire substrate can be explained by the reactive ion etching mechanism with the competition of the formation of volatile $AlCl_3$, $Al_2Cl_6$ or $BOCl_3$ and the sputter effect by energetic ions.

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Fabrication of Microwire Arrays for Enhanced Light Trapping Efficiency Using Deep Reactive Ion Etching

  • Hwang, In-Chan;Seo, Gwan-Yong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.454-454
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    • 2014
  • Silicon microwire array is one of the promising platforms as a means for developing highly efficient solar cells thanks to the enhanced light trapping efficiency. Among the various fabrication methods of microstructures, deep reactive ion etching (DRIE) process has been extensively used in fabrication of high aspect ratio microwire arrays. In this presentation, we show precisely controlled Si microwire arrays by tuning the DRIE process conditions. A periodic microdisk arrays were patterned on 4-inch Si wafer (p-type, $1{\sim}10{\Omega}cm$) using photolithography. After developing the pattern, 150-nm-thick Al was deposited and lifted-off to leave Al microdisk arrays on the starting Si wafer. Periodic Al microdisk arrays (diameter of $2{\mu}m$ and periodic distance of $2{\mu}m$) were used as an etch mask. A DRIE process (Tegal 200) is used for anisotropic deep silicon etching at room temperature. During the process, $SF_6$ and $C_4F_8$ gases were used for the etching and surface passivation, respectively. The length and shape of microwire arrays were controlled by etching time and $SF_6/C_4F_8$ ratio. By adjusting $SF_6/C_4F_8$ gas ratio, the shape of Si microwire can be controlled, resulting in the formation of tapered or vertical microwires. After DRIE process, the residual polymer and etching damage on the surface of the microwires were removed using piranha solution ($H_2SO_4:H_2O_2=4:1$) followed by thermal oxidation ($900^{\circ}C$, 40 min). The oxide layer formed through the thermal oxidation was etched by diluted hydrofluoric acid (1 wt% HF). The surface morphology of a Si microwire arrays was characterized by field-emission scanning electron microscopy (FE-SEM, Hitachi S-4800). Optical reflection measurements were performed over 300~1100 nm wavelengths using a UV-Vis/NIR spectrophotometer (Cary 5000, Agilent) in which a 60 mm integrating sphere (Labsphere) is equipped to account for total light (diffuse and specular) reflected from the samples. The total reflection by the microwire arrays sample was reduced from 20 % to 10 % of the incident light over the visible region when the length of the microwire was increased from $10{\mu}m$ to $30{\mu}m$.

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Mechanical and Oxygen Permeation Properties of Layered Double Hydroxide/Ethylene Vinyl Acetate Nanocomposite Membranes (Mg-Al Layered Double Hydroxide/Ethylene Vinyl Acetate 나노복합막의 기계적 특성과 기체투과 특성에 관한 연구)

  • Hwang, Ji-Young;Lee, Sang-Hyup;Lee, Jong-Suk;Hong, Se-Ryung;Lee, Hyun-Kyung
    • Membrane Journal
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    • v.23 no.2
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    • pp.151-158
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    • 2013
  • The effect of layered double hydroxides (LDH) on the gas separation properties of ethylene vinyl acetate copolymer was investigated. Mg-Al LDH/EVA nanocomposite membranes were prepared from solution intercalation using organically modified LDH (DS-LDH). Dodecyl sulfate (DS)-LDH was obtained by the intercalation of DS anion in the interlayer. The nanocomposite structure has been elucidated by X-ray diffraction (XRD), Fourier transform infrared (FT-IR) spectroscopy and scanning electron microscopy (SEM). XRD pattern clearly shows that the DS-LDH layers are disorderly well dispersed in the EVA matrix. The maximum tensile strength and elongation of the LDH/EVA nanocomposite membrane were found with the LDH content 3 wt%. The thermal properties of nanocompostie membrane were enhanced by the incorporation of LDH in EVA matrix. Gas permeation of LDH/EVA nanocomposite membranes with LDH contents of 1, 3, 5 wt% was studied for $O_2$ and $CO_2$ single gases. The presence of 3 wt% LDH decreased $O_2$ permeability by up to 53% compared to the EVA membrane. In spite of barrier property of nanocomposite membrane, however, the gas permeability for $CO_2$ was increased due to its strong affinity with the residual OH groups on the LDH.

Oxidation Behavior at the Interface between E-beam Coated $ZrO_{2}$-7wt.%$Y_{2}O}_{3}$and Plasma Sprayed CoNiCrAlY (전자빔 코팅 및 플라즈마 용사에 의한 안정화지르코니아/CoNiCrAlY 계면의 산화거동)

  • Choi, Won-Seop;Kim, Young-Do;Jeon, Hyeong-Tag;Kim, Hyon-Tae;Yoon, Kook-Han;Hong, Kyung-Tae;Park, Jong-Ku;Park, Won-Sik
    • Korean Journal of Materials Research
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    • v.8 no.6
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    • pp.538-544
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    • 1998
  • The spallation of a thermal barrier coating layer depends on the formation of brittle spinels. thermal expansion mismatch between ceramic and metal. the phase transformation of a ceramic layer and residual stress of coating layer. In this work. the formation mechanism of oxide scale formed by oxidation treatment at 90$0^{\circ}C$ was investigated in order to verify oxidation behavior at the interface between E-beam coated $Zr0_2$-7wt.% $Y_20_3$ and plasma sprayed CoNiCrAIY. Some elements distributed in the bond coating layer were selectively oxidized after oxidation. At the initial time of oxidation. AI-depletion zone and $\alpha$-$Al_O_3$,O, were formed at the bond coating layer by the AI-outward diffusion. After layer grew until critical thickness. spinels. $Cr_20$, and $C0_2CrO_4$ by outward diffusion of Co. Cr, Ni were formed. It was found that the formation of spinels may be related to the spallation of $Zr0_2$-7wt.% $Y_20_3$ during isothermal oxidation.

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A Study on Improvement of Recycling Process of Waste Fluorescent Lamps (폐형광등 재활용 공정의 개선 연구)

  • Lee, Gee Hun;Lee, Dong Hoon;Song, Young Jun;Kim, Chang Kwon
    • Resources Recycling
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    • v.29 no.3
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    • pp.61-74
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    • 2020
  • This study was conducted to improve the recycling process of waste fluorescent lamp, and investigate the possibility of using the waste fluorescent lamp glass as a raw material for glass beads, the leaching method of rare earth from the waste phosphor powder, and the possibility of solvent extraction of rare earth from the rare earth leaching solution. The waste phosphor contained 28.9% yttrium oxide, 3.46% cerium oxide, 1.95% europium oxide, 1.76% terbium oxide, and 1.43% lanthanum oxide. As a result of the trial production of glass beads using waste fluorescent lamp glass, it was judged that the production yield and quality were excellent, so that waste fluorescent lamp glass could be used as a raw material for glass beads. The soda roasted waste phosphor was leached in water and thereby the aqueous solution was blown with CO2 to drop the pH to about 7, Then, Al, Si and residual N2CO3 were dissolved, and NaAlCO3(OH)2 and SiO2 were precipitated in the aqueous solution. In the solvent extraction of cyanex272-hydrochloric acid, cyanex272-sulfuric acid, D2EHPA-hydrochloric acid, D2EHPA-sulfuric acid, Ionquest290-hydrochloric acid, Ionquest290-sulfuric acid, p507-hydrochloric acid using xylene as a diluent, the extraction yield of Y, Eu, Ce, La, and Tb are close to 100%. However, in this conditions, the difference in extraction yield for each element, that is, selectivity is 16% or less.