Studies on Cu Dual-damascene Processes for Fabrication of Sub-0.2${\mu}m$ Multi-level Interconnects
(Sub-0.2${\mu}m$ 다층 금속배선 제작을 위한 Cu Dual-dmascene공정 연구)
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- Journal of the Korean Institute of Telematics and Electronics D
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- v.36D no.12
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- pp.37-42
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- 1999