• 한국표면공학회지
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• 제33권4호
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• pp.241-250
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• 2000

Popcorn cracking phenomena frequently occur in thin plastic packages during the solder reflow process, which are definitely affected by poor adhesion of Cu-based leadframe to epoxy molding compounds (EMCs). In the present work, in order to enhance the adhesion strength, a brown-oxide treatment on the Cu-based leadframe was carried out and the adhesion strength of leadframe/EMC interface was measured in terms of fracture toughness by using sandwiched double-cantilever beam (SDCB) specimens. After the adhesion tests, fracture surfaces were analyzed by SEM, AES, EDS and AFM to make the failure path clear. Results showed that failure path was closely related to the oxidation time and the interfacial fracture toughness.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2005년도 학술발표대회 논문집
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• pp.303-305
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• 2005

Recently, various plastics are used for improvement of reliability and thermal stability of electronic goods. But, it is difficult to choose suitable balance of grade resin to each other product property. Selection of high efficiency resin is becoming inescapable circumstance according to change of reflow temperature of product and development of product following to lead free. Using a inexpensive and reasonable resin, that sustain a uniform performance of product quality. It is make a robust product and increase a company's competitive power. Hereupon, I introduce example that use ESPI methods of thermal deformation analysis of product using in our company product. I try to refer to a structural weak point detection of real time measurement of electronic parts instead of mechanical and chemical measurement of specimen type.

• Journal of Welding and Joining
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• 제20권6호
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• pp.59-59
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• 2002

Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp. : 250℃ and conveyer speed : 0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was 250℃. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn (5㎛), Cu/Ni (5㎛), and Cu/Ni/Au (5㎛/500Å) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

• 한국표면공학회지
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• 제36권5호
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• pp.386-392
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• 2003

The electroplating process for a solder bump which can be applied for a flip chip was studied. Si-wafer was used for an experimental substrate, and the substrate were coated with UBM (Under Bump Metallization) of Al(400 nm)/Cu(300 nm)Ni(400 nm)/Au(20 nm) subsequently. The compositions of the bump were Sn-Cu and eutectic Sn-Pb, and characteristics of two bumps were compared. Experimental results showed that the electroplated thickness of the solders were increased with time, and the increasing rates were TEX>$0.45 <\mu\textrm{m}$/min for the Sn-Cu and $ 0.35\mu\textrm{m}$/min for the Sn-Pb. In the case of Sn-Cu, electroplating rate increased from 0.25 to $2.7\mu\textrm{m}$/min with increasing current density from 1 to 8.5 $A/dm^2$. In the case of Sn-Pb the rate increased until the current density became $4 A/dm^2$, and after that current density the rate maintains constant value of $0.62\mu\textrm{m}$/min. The electro plated bumps were air reflowed to form spherical bumps, and their bonded shear strengths were evaluated. The shear strength reached at the reflow time of 10 sec, and the strength was of 113 gf for Sn-Cu and 120 gf for Sn-Pb.

• Journal of Welding and Joining
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• 제20권6호
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• pp.783-788
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• 2002

Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp.:$250^{\circ}C$and conveyer speed:0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was $250^{\circ}C$. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn ($5\mu\textrm{m}$), Cu/Ni ($5\mu\textrm{m}$), and Cu/Ni/Au ($5\mu\textrm{m}/500{\AA}$) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

• 센서학회지
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• 제5권5호
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• pp.21-29
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• 1996

(111), $n/n^{+}/n$ 3층 구조의 실리콘 기판을 HF 용액 내에서 양극반응시켜 선택확산된 $n^{+}$ 층에 다공질 실리콘층(Porous Silicon Layer : PSL)을 형성한 후, 이를 5% NaOH 수용액에서 식각하여 미세구조를 제조하는 다공질 실리콘 식각법을 이용한 실리콘 미세구조의 제조법으로 8개의 빔을 갖는 압저항형 실리콘 가속도센서를 제조하였다. 제조된 가속도센서의 매스 패드(mass pad)의 반경, 빔 길이, 빔 폭, 그리고 빔 두께는 각각 $700\;{\mu}m$, $50;{\mu}m$, $100\;{\mu}m$, $7\;{\mu}m$ 였다. 자동차의 응용을 위하여 50g 범위의 가속도를 측정할 수 있도록 진동질량은 2 mg으로 제조하였다. 이때, 진동질량을 부가하는 방법은 Pb/Sn/Ag 솔더 페이스트를 매스 패드에 디스펜싱한 후, 3-zone reflow 장치를 사용하여 열처리하였다. 제조된 가속도센서의 충격응답에 대한 감쇠시간은 약 30 ms로 나타났으며, 가산회로로 합한 출력의 감도는 2.9 mV/g이며, 비선형특성은 full scale 출력에서 2%이하로 측정되었다. 그리고 각 브릿지의 편차는 ${\pm}5%$ 미만으로 나타났다. 또한 측정된 타축감도는 약 4% 이하로 나타났으며, 시뮬레이션 결과로 부터 얻은 센서의 공진주파수는 2.15 KHz이었다.

• 한국재료학회지
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• 제9권3호
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• pp.288-294
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• 1999

솔더 범프를 사용하는 플립 칩 접속기술에서 범프와 칩 사이에 위치하는 금속 충들의 조합을 UBM(Under Bump Metallurgy)라고 부르며 이 UBM을 어떤 조합으로 사용하는 가에 따라 접속의 안정성이 크게 좌우된다. 본 연구에서는 UBM중에서 솔더 접착 층으로 사용되는 구리 층의 두께를 $1\mu\textrm{m}와 5\mu\textrm{m}$로 하는 한편 barrier 층으로 사용되는 금속 층을 Ti, Ni, Pd으로 변화시키면서 이들 UBM과 공정 납-주석 사이의 계면반응을 살펴보았다. 이를 위해 $100\mu\textrm{m}$ 크기의 솔더 범프를 전해도금법을 사용하여 제작하고 리플로 횟수와 시효시간에 따른 각 UBM에서의 금속간 화합물의 성장을 관찰하였다. $Cu_6Sn_5 \eta'$-상 금속간 화합물이 모든 조건에서 형성되었고 Cu층의 두께가 $5\mu\textrm{m}$로 두꺼운 경우에는 $Cu_3Sn \varepsilon$-상도 관찰되었다. Pd을 사용한 UBM 구조에서는 시효 처리시에 $Cu_6Sn_5$ 상 아래쪽에 $PdSn_4$상이 형성되었다. 또한 이들 계면에서의 금속간 화합물의 성장은 솔더 범프의 접속강도 값과 밀접한 관계를 가진다.

• 대한기계학회논문집A
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• 제26권11호
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• pp.2450-2456
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• 2002

Microlenses and microlens arrays are fabricated using a novel fabrication technology based on the exposure of a resist (usually PMMA) to deep X-rays and subsequent thermal treatment. The fabrication technology is very simple and produces microlenses and microlens arrays with good surface roughness (less than 1 nm). The molecular weight and glass transition temperature of PMMA is reduced when it is irradiated with deep X-rays. The microlenses is produced through the effects of volume change, surface tension, and reflow during thermal treatment of irradiated PMMA. The geometry of the microlens is determined by parameters such as the X-ray dose applied to the PMMA, the diameter of the microlens, along with the heating temperature, heating time, and cooling rate in the thermal treatment. Microlenses are produced with diameters ranging from 30 to 1500 ${\mu}{\textrm}{m}$. The modified LIGA process is used not only to construct hemispherical microlenses but also structures that are rectangular-shaped, star-shaped, etc.

• 마이크로전자및패키징학회지
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• 제5권1호
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• pp.7-18
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• 1998

In the flip chip interconnection on organic substrates using eutectic Pb/Sn solder bumps highly reliable Under Bump Metallurgy (UBM) is required to maintain adhesion and solder wettability. Various UBM systems such as 1$\mu$m Al/0.2$\mu$m Pd/1$\mu$m Cu, laid under eutectic Pb/Sn solder were investigated with regard to their interfacial reactions and adhesion proper-ties. The effects of numbers of solder reflow and aging time on the growth of intermetallic compounds (IMCs) and on the solder ball shear strength were investigated. Good ball shear strength was obtained with 1$\mu$m Al/0.2$\mu$m Ti/5$\mu$m Cu and 1$\mu$m Al/0.2$\mu$m ni/1$\mu$m Cu even after 4 solder reflows or 7 day aging at 15$0^{\circ}C$. In contrast 1$\mu$m Al/0.2$\mu$m Ti/1$\mu$m Cu and 1$\mu$mAl/0.2$\mu$m Pd/1$\mu$m 쳐 show poor ball shear strength. The decrease of the shear strength was mainly due to the direct contact between solder and nonwettable metal such as Ti and Al resulting in a delamination. In this case thin 1$\mu$m Cu and 0.2$\mu$m Pd diffusion barrier layer were completely consumed by Cu-Sn and pd-Sn reaction.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2009년도 하계학술발표대회 논문집
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• pp.1379-1384
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• 2009

High power light emitting diode(LEDs), a strong candidate for the next generation general illumination applications are of interest. With major advantages of power saving, increased life expectancy and faster response time over traditional incandescent bulb, the LEDs are rapidly taking over many applications such as LCD backlighting, traffic light, automotive lighting, signage, etc. The increased electrical currents used to drive the LEDs have focused more attention on the thermal management because the efficiency and reliability of the solid-state lighting devices strongly depend on successful thermal management. There exist some problems that are caused by heat generation in the LED package, such as wire breakage, yellowing of epoxy resin, lifted chip caused by reflow of thermal paste chip attach and interfacial separation between LED package and silicon resin. The goal of this study is to analyze high power LED thermal properties of using pulsating heat pipe.