• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2005년도 제25회 추계학술대회논문집
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• pp.479-483
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• 2005

BBU(Base Bleed Unit)는 155mm 탄에 부착되어 비행 중에 형성되는 탄저부 항력(Base drag)을 감소시켜 사거리를 연장시키는 무기 체계로 국내에서는 2000년 이후 양산화 되었다. 본 연구는 항력감소제용 저연소속도 추진제의 원료 조성 변화를 통한 공정 Lead time 단축으로 생산성을 향상시키는데 목적이 있으며 개발 과정은 추진제 및 연소방지제의 조성시험을 통한 기본적인 특성 확인을 거친 후 Spin Test 와 실제 발사시험을 통해서 최종 성능을 확인하는 순서로 진행하였다.

• 대한산업공학회지
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• 제32권4호
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• pp.298-313
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• 2006

Six sigma is focused on quality improvement through variation reduction, while lean is on process flow improvement and lead time reduction by waste elimination. However, lean cannot bring a process under statistical control and six sigma alone cannot dramatically improve process speed. Lean six sigma was developed to achieve faster rate of improvement in customer satisfaction, cost, quality, process speed, and invested capital. In this paper we present the importance of using value stream mapping and suggest a guideline on how to integrate lean and six sigma by is proposed.

• 한국전기전자재료학회논문지
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• 제16권5호
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• pp.385-389
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• 2003

There are four main components of the CMP process: polishing pad, slurry, elastic supporter, and pad conditioner. The polishing pad is an essential component to the reproducibility of polishing uniformity in CMP process. However, the polishing pad in recently using metal CMP raised the several points of high cost caused by the increase of cycle time and the many usage of slurry. It is necessary to develop the novel polishing pad which would lead the cost reduction by the higher pad life-cycle, minimized cycle time and lower slurry usage. The characteristics of polishing pad were studied on the effects of different sets of the Polishing pad, which can be applied to metal chemical mechanical polishing process for global planarization of multilevel interconnection structure. The main purpose of this experiment is cost reduction by the increase of pad life-time, the decrease of cycle time and the lower usage of slurry through the specific hard porous structured pad design. It is confirmed that the novel polishing pad made the slurry usage decrease to 60% as well as the pad life-time increase twice with the 25% improvement of removal rate. The polishing time could be decreased and it also helped the cycle time to diminish. It can be expected that this results will help both the process throughput and the device yield to be improved.

• 산업경영시스템학회지
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• 제44권2호
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• pp.140-152
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• 2021

During the shift from gasoline vehicles to electric ones, auto parts manufacturing companies have realized the importance of improvement in the manufacturing process that does not require any layout changes nor extra investments, while maintaining their current production rate. Due to these reasons, for the auto part manufacturing company, I-company, this study has developed the simulation model of the PUSH system to conduct a process analysis in terms of production rate, WIP level, and logistics work's utilization rate. In addition, this study compares the PUSH system with other three manufacturing systems -KANBAN, DBR, and CONWIP- to compare the performance of these production systems, while satisfying the company's target production rate. With respect to lead-time, the simulation results show that the improvement of 77.90% for the KANBAN system, 40.39% for the CONWIP system, and 69.81% for the DBR system compared to the PUSH system. In addition, with respect to WIP level, the experimental results demonstrate that the improvement of 77.91% for the KANBAN system, 40.41% for the CONWIP system, and 69.82% for the DBR system compared to the PUSH system. Since the KANBAN system has the largest impacts on the reduction of the lead-time and WIP level compared to other production systems, this study recommends the KANBAN system as the proper manufacturing system of the target company. This study also shows that the proper size of moving units is four and the priority allocation of bottleneck process methods improves the target company's WIP and lead-time. Based on the results of this study, the adoption of the KANBAN system will significantly improve the production process of the target company in terms of lead-time and WIP level.

• 열처리공학회지
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• 제17권4호
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• pp.211-215
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• 2004

Conventional spheroidization process of cold heading quality steels requires long heat treatment time, and reduction of the heat treatment time is important for improving productivity in the industry. Recently, hot deformation method has been proposed as a means of increasing spherodization kinetics. In this study, the influences of hot deformation on the spherodization behavior of cold heading quality steels were investigated. Hot deformation at the temperature range of $700^{\circ}C$ significantly enhances the spheroidization kinetics. Hot deformation can lead to a substantial reduction of spherodization process time as low as 1~5 hrs.

• 산업경영시스템학회지
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• 제16권28호
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• pp.203-209
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• 1993

In Factory Automation environments such as FMS, the formation of machine-part based on GT should be considered. The purpose of this study is to develop a economic heuristic algorithm which considers various elements such as unit processing time, subcontract cost, and functional operation cost, machine processing capacity etc. When this proposed approach is applied to the real situation expected benefits are as follows: the reduction of production lead time work in process, labor force, tooling, rework and scrap, setup time, order time delivery, and paper work, etc.

• 한국표면공학회지
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• 제51권3호
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• pp.179-184
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• 2018

In this study, Ni and tungsten carbide (WC) nanoparticles are simultaneously synthesized with the mesoporous carbon nanoparticles (CNP) using a solution plasma processing (SPP) in the benzene. The Ni and WC nanoparticles were formed through the sputtering effect of electrodes during discharge, and mean time CNP were formed through reduction reaction. TEM observation showed that loaded Ni and WC nanoparticles were evenly dispersed on the CNP. The results of electrochemical analysis demonstrated that an introduction of Ni nanoparticles promoted to improve catalytic activity for oxygen reduction reaction (ORR). Moreover, Ni-WC/CNP lead to fast electron transfer process compared to that of WC/CNP. Therefore, the inexpensive Ni-WC/CNP might be a promising as catalytic material for cathodes in fuel cell applications.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.251.1-251.1
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• 2013

Combination of oxidative vacuum annealing and oxygen plasma treatment can serve as a simple and efficient method of line-width modification of imprinted nanopatterns. Since the vacuum annealing and oxygen plasma could lead mass loss of polymeric materials, either one of the process can yield a narrowed patterns. However, the vacuum annealing process usually demands quite high temperatures (${\geq}300^{\circ}C$) and extended annealing time to get appreciable line-width reduction. Although the plasma treatment may be considered as an effective low temperature rapid process for the line-width reduction, it is also suffering for the lowered controllability on application to very fine patterns. We have found that the vacuum annealing temperature can be lowered by introducing the oxygen in the vacuum process and that the combination of oxygen plasma treatment with the vacuum annealing could yield the best result in the line-with reduction of the imprinted polymeric nanopatterns. Well-defined line width reduction by more than 50% was successfully demonstrated at relatively low temperatures. Furthermore, it was verified that this process was applicable to the nanopatterns of different shapes and materials.

• 한국정밀공학회지
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• 제21권12호
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• pp.21-28
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• 2004

In modem manufacturing industries such as the airplane and automobile, aluminum alloys which are remarkable in durability have been utilized effectively. High-speed machining technology for surface roughness quality of workpiece has been applied in these fields. Higher cutting speed and feedrates lead to a reduction of machining time and increase of surface quality. Furthermore, the reduction of time required for polishing or lapping of machined surfaces improves the production rate. Traditional milling process for high speed cutting can be machined with end mill tool. However, such processes are generally cost-expensive and have low material removal rate. Thus, in this paper, face milling cutter which gives high MRR has developed face milling cutter body for the high speed machining of light alloy to overcome the problems. Also vibration experiment to detect natural frequency in free state and frequency characteristics during machining are performed to escape resonance.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.