• Bulletin of the Korean Chemical Society
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• v.34 no.4
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• pp.1055-1060
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• 2013

The adsorption structures of threonine on the Ge(100) surface were investigated using core-level photoemission spectroscopy (CLPES) in conjunction with density functional theory (DFT) calculations. CLPES measurements were performed to identify the experimentally preferred adsorption structure. The preferred structure indicated the relative reactivities of the carboxyl and hydroxymethyl groups as electron donors to the Ge(100) surface during adsorption. The core-level C 1s, N 1s, and O 1s CLPES spectra indicated that the carboxyl oxygen competed more strongly with the hydroxymethyl oxygen during the adsorption reaction. Three among six possible adsorption structures were identified as energetically favorable using DFT calculation methods that considered the inter- and intra-bonding configurations upon adsorption onto the Ge(100) surface. These structures were O-H dissociated N dative inter bonding, O-H dissociated N dative intra bonding, O-H dissociation bonding. One of the adsorption structures: O-H dissociated N dative inter bonding was predicted to be stable in light of the transition state energies. We thus confirmed that the most favorable adsorption structure is the O-H dissociated N dative-inter bonding structure using CLPES and DFT calculation.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.121-121
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• 2011

Graphene formed by chemical vapor deposition was exposed to the various plasmas of Ar, O2, N2, and H2 to examine its effects on the bonding properties of graphene to metal. Upon the Ar plasma exposure of patterned graphene, the subsequently deposited metal electrodes remained intact, enabling successful fabrication of field effect transistor (FET) arrays. The effects of enhancing adhesion between graphene and metals were more evident from O2 plasmas than Ar, N2, and H2 plasmas, suggesting that chemical reaction of O radicals induces hydrophilic property of graphene more effectively than chemical reaction of H and N radicals and physical bombardment of Ar ions. From the electrical measurements (drain current vs. gate voltage) of field effect transistors before and after Ar plasma exposure, it was confirmed that the plasma treatment is very effective in controlling bonding properties of graphene to metals accurately without requiring buffer layers.

• Advances in materials Research
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• v.6 no.3
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• pp.245-255
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• 2017

High energy ball milling is employed to produce iron matrix- multiwall carbon nanotube (MWCNT) reinforced composite. The damage caused to MWCNT due to harsh ball milling condition and its influence on interfacial bonding is studied. Different amount of MWCNT is used to find the optimal percentage of MWCNT for avoidance of the formation of chemical reaction product at the matrix - reinforcement interface. Effect of process control agent is assessed by the use of different materials for the purpose. It is observed that ethanol as a process control agent (PCA) causes degradation of MWCNT reinforcements after milling for two hours whereas solid stearic acid used as process control agent, allows satisfactory conservation of MWCNT structure. It is further noted that at a high MWCNT content (~ 2wt.%), high energy ball milling leads to reaction of iron and carbon and forms iron carbide (cementite) at the iron-MWCNT interface. At low percentage of MWCNT, dissolution of carbon in iron takes place and the amount of reinforcement in iron matrix composite becomes negligibly small. However, under the present ball milling condition (ball to metal ratio~ 6:1 and 200 rpm vial speed) iron-1wt.% MWCNT composite of good interfacial bonding can retain the tubular structure of reinforcing MWCNT.

• Journal of the Korean Ceramic Society
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• v.30 no.1
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• pp.34-40
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• 1993

ORMOSIL was synthesized with inorganic precursor, TEOS and organic precursor, PDMS, and the variation of composite properties according to the concentration of HCl, solvent content and reaction time were studied. As the concentration of HCl increased, condensation reaction was well proceeded and more regularly distributed network was observed. Increase in reactivity was found with the amount of solvent, and composite had a tendency of forming more porous microstructure as reaction time was increased, which had no influence on the bonding degree.

• ETRI Journal
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• v.36 no.3
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• pp.343-351
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• 2014

For the fine-pitch application of flip-chip bonding with semiconductor packaging, fluxing and hybrid underfills were developed. A micro-encapsulated catalyst was adopted to control the chemical reaction at room and processing temperatures. From the experiments with a differential scanning calorimetry and viscometer, the chemical reaction and viscosity changes were quantitatively characterized, and the optimum type and amount of micro-encapsulated catalyst were determined to obtain the best pot life from a commercial viewpoint. It is expected that fluxing and hybrid underfills will be applied to fine-pitch flip-chip bonding processes and be highly reliable.

• Journal of the Korean Ceramic Society
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• v.48 no.1
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• pp.52-56
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• 2011

Silicon carbide (SiC) is a candidate material for heat exchangers for VHTR (Very High Temperature Gas Cooled Reactor) due to its refractory nature and high thermal conductivity. This research has focused on demonstration of physical properties and mock-up fabrication for the future heat exchange applications. It was found that the SiC-based components can be applied for process heat exchanger (PHE) and intermediate heat exchanger (IHX), which are operated at $400{\sim}1000^{\circ}C$, based on our examination for the following aspects: optimum fabrication technologies (design, machining and bonding) for compact design, thermal conductivity, corrosion resistance in sulfuric acid environment at high temperature, and simulation results on heat transferring and thermal stress distribution of heat exchanger mock-up.

• Analytical Science and Technology
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• v.5 no.3
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• pp.309-317
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• 1992

Inorganic/organic composite was synthesized by using sol-gel process, and the bonding characteristics of composite was investigated with glass transition temperature(Tg), measured by DMTA(Dynamic Mechanical Thermal Analyzer). It was found from shift of Tg to higher temperature that composite reaction was proceeded better with the amount of HCl and water. But Tg was not varied with reaction time.

• Journal of the Korean Home Economics Association
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• v.25 no.1
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• pp.35-42
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• 1987

Since the 1930's, a rapid development of resin processing has contributed to making our clothing life convenient and rich. Wrinkle considered as the largest defect of cellulose fiber is generated from fixation of molecules which are divided by compression or crookedness. It can be protected by building a bridge between the molecules the joint combination of the inside of the fiber. The formaldehyde reactive resin which is used in processing resin is a chemical compound with more than 2 N-methylol or N-alkoxymethylol group and a chemical compound with N-methylol shows the property of W.W and D.P through the very complex bridge-bonding reaction under the OH group of cellulose and acid catalyst. However, if the processing is excessively carried out, resin-processed textile emits the formaldehyde when the bridge bonding agent reacts to amine type under the acid condition or the formaldehyde remains in the condition of non-reaction or the resin combinates by itself, or the methylol group of non-reactive resin is hydrolyzed due to the insufficient themomagnetic treatment.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1130-1131
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• 2006

We found that the """interface reaction between Ni-based alloy bond, diamond, and steel core is very critical in bond strength of diamond tool. None element from metal bond diffuses into the steel core but the Fe element of steel core was easily diffused into the bond. This diffusion depth of Fe has a great effect on the bonding strength. The Cr in steel core accelerated the Fe diffusion and improved the bond strength, on the other hand, carbon decreased the strength. Ni-based alloy bond including Cr was chemically bonded with diamond by forming Cr carbide. However, the Cr and Fe in STS304 were largely interdiffused, the strength was very low. The Cr passivity layer formed at surface of STS304 made worse strength at commissure in brazing process.

• Journal of the Korean Ceramic Society
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• v.25 no.6
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• pp.609-614
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• 1988

This study was carried out to investigate the effects of B4C or Y2O3 additives on the tendency of sintering, $\beta$-SiC synthesis and mineral phase changes by reaction bonding of SiC at 145$0^{\circ}C$. At the sintering temperature of 145$0^{\circ}C$, the additives such as B4C or Y2O3 did not improved porosity and bending strength. Added more than 1.5% of Y2O3, 0.5-0.3% of B4C, the formation of $\beta$-SiC was increased. At higher temperature above 145$0^{\circ}C$, it seems that the bodies added B4C, contained 3C form of SiC were denser than that of Y2O3 added. Because the transition of 3Clongrightarrow4Hlongrightarrow6H promoted sintering.