• Bulletin of the Korean Chemical Society
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• 제33권5호
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• pp.1551-1555
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• 2012

Second-order rate constants ($k_N$) have been measured spectrophotometrically for the reactions of benzyl 2-pyridyl carbonate $\mathbf{7}$ and $t$-butyl 2-pyridyl carbonate $\mathbf{8}$ with a series of alicyclic secondary amines in $H_2O$ at $25.0^{\circ}C$. Substrate $\mathbf{8}$ is less reactive than $\mathbf{7}$. Steric hindrance exerted by the bulky $t$-Bu group of $\mathbf{8}$ has been suggested to be responsible for the decreased reactivity. The Br${\o}$nsted-type plots for the reactions of $\mathbf{7}$ and $\mathbf{8}$ are linear with ${\beta}_{nuc}=0.49$ and 0.44, respectively, which is typical for reactions reported previously to proceed through a concerted mechanism. Aminolyses of $\mathbf{7}$ and $\mathbf{8}$ were expected to proceed through a zwitterionic tetrahedral intermediate $T^{\pm}$, which would be stabilized through an intramolecular H-bonding interaction. However, the kinetic results suggest that the reactions proceed through a concerted mechanism. The H-bonding interaction in $T^{\pm}$ has been suggested to accelerate the rate of leaving-group expulsion from $T^{\pm}$. Another factor that might accelerate expulsion of the leaving group is the "push" provided by the RO group in $T^{\pm}$ through resonance interactions. Thus, it has been concluded that the enhanced nucleofugality through the H-bonding interaction and the "push" provided by the RO group forces the reactions to proceed through a concerted mechanism.

• Journal of Welding and Joining
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• 제33권5호
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• pp.41-46
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• 2015

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

• Child Studies in Asia-Pacific Contexts
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• 제3권1호
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• pp.1-12
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• 2013

Research with parents of children with Asperger Syndrome was conducted to assess whether the level of positive parental attachment correlated positively with positive parenting behaviors and negatively with negative parenting behaviors. Participants were recruited from internet. The Parental Bonding Inventory measured parents' perception of their bonding or attachment with three aspects of their own parents: warmth, control, and care. In the Parenting Behavior Inventory, parents reported recent interaction/reaction behaviors with their child, and results focused on two aspects of parenting, supportive/engaged and hostile/coercive behaviors: each identified as problematic to parenting and attributable to a variety of specific parenting behaviors. Analysis of demographic variables for correlations with positive parenting behaviors and negative parenting behaviors were carried out by Pearson correlations. Two separate standard multiple regressions, one for positive parenting behaviors and one for negative parenting behaviors, were conducted. Findings support the hypothesis that positive early attachment experience of parents has a significant impact upon their own positive parenting skills with their child with Asperger Syndrome. However, multiple regression of negative parenting behavior found no significant negative contribution by parental attachment. Demographic variables proved to be important.

• 대한환경공학회지
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• 제38권5호
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• pp.242-248
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• 2016

연료전지에서의 전체 반응 속도는 산화전극에서 일어나는 수소산화반응에 비해 그 반응 속도가 현저히 느린 환원전극에서의 산소환원반응(oxygen reduction reaction, ORR)에 의해 결정된다. ORR 효율성 평가를 용이하게 하는 지표(descriptor)로서 촉매 표면에서의 산소원자 흡착강도를 활용하는데, 산소흡착강도는 촉매 표면의 기하학적 구조 변형에 따른 전자구조를 변형함으로써 조절할 수 있다. 이에 본 연구에서는 백금 표면의 원자모델을 이용하여 표면의 기하학적 구조가 산소흡착강도에 미치는 영향과 그 원인을 밀도범함수이론(density functional theory, DFT) 계산을 통해 분석하였다. 먼저, 기하학적 구조를 인위적으로 변형시킨 Pt(111) 표면에서의 산소흡착반응을 밀도범함수이론 계산을 이용해 분석함으로써 기하학적 구조변화가 산소흡착강도에 미치는 영향(strain effect)을 확인하였다. 최적화한 Pt 격자상수($3.977{\AA}$)에 ${\pm}1%$ 간격의 변화율을 적용하고 각 변화율마다의 산소흡착강도를 계산하였는데, Pt-Pt 원자 간 거리가 멀어질수록 산소흡착강도가 강해지는 것을 확인하였다. 이는 원자 간 거리가 증가할수록 d-band center가 페르미 준위(Fermi level)쪽으로 이동하게 되며, 이로써 일부 반결합 오비탈(anti-bonding orbitals)에 전자가 채워지지 않기 때문에 전체적으로 반결합 오비탈이 형성될 가능성이 적어지기 때문이다. 결과적으로, 순수한 백금이 가진 격자상수($3.9771{\AA}$) 보다 약 2~4% 작은 백금 표면 격자크기를 가질 수 있도록 유도할 수 있다면 산소흡착강도가 적절히 약하게 조절될 수 있으며, 이는 순수한 백금보다 더 향상된 ORR 성능을 가진 촉매물질 개발 연구를 위한 기초자료로서 활용할 수 있을 것이다.

• 마이크로전자및패키징학회지
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• 제19권1호
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• pp.67-73
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• 2012

본 연구는 고밀도 미세회로 형성 및 원가절감에 유리한 페이스트의 인쇄/건조, 프리프레그 관통 및 적층 공법을 이용한 $B^2it$ 공법을 이용하여 FMC 기판을 제조한 후 열적 스트레스에 대한 범프의 계면반응 연구를 수행하였다. 열적 스트레스에 대한 Ag 범프의 접합 신뢰성을 조사하기 위해 열충격시험, 열응력시험을 수행한 후 전기적 특성 및 단면분석을 통해 균열발생 여부를 조사하였다. 또한 Ag 범프와 Cu 랜드의 접합계면에 대한 계면반응 특성을 분석하기 위해 주사전자현미경(SEM), 에너지분산스펙트럼(EDS) 및 FIB분석을 수행하여 계면에서 발생되는 확산반응을 분석하였다. 이러한 결과를 바탕으로 열적 스트레스에 대한 Ag 페이스트 범프/Cu 랜드 접합계면에서 계면반응에 의해 형성된 Ag-Cu 합금층을 확인할 수 있었다. 이러한 합금층은 Cu ${\rightarrow}$ Ag 보다, Ag ${\rightarrow}$ Cu 로의 확산속도가 빠르기 때문에, Cu층에서의 (Ag, Cu) 합금층이 보다 많이 관찰되었으며, 합금층이 Ag범프의 계면 접합력 향상에 기여하는 것을 알 수 있었다.

• 한국재료학회지
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• 제20권12호
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• pp.681-685
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• 2010

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

• 한국분말재료학회지
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• 제4권3호
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• pp.196-204
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• 1997

Joining of AIN ceramics to W and Cu by active-metal brazing method was tried with use of (Ag-Cu)-Ti alloy as insert-metal. Joints were produced under various conditions of temperature, holding time and Ti-content in (Ag-Cu) alloy Reaction and microstructural development in bonded interface were investigated through observation and analysis by SEM/EDS, EPMA and XRD. Joint strengths were measured by shear test. Bonded interface consists of two layers: an insert-metal layer of eutectic Ag- and Cu-rich phases and a reaction layer of TiN. Thickness of reaction layer increases with bonding temperature, holding time and Ti-content of insert-metal. It was confirmed that the growth of reaction layer is a diffusion-controlled process. Activation energy for this process was 260 KJ/mol which is lower than that for N diffusion in TiN. Maximum shear strength of 108 MPa and 72 MPa were obtained for AIN/W and AIN/Cu joints, respectively. Relationship between processing variables, joint strength and thickness of reaction layer was also explained.

• 열처리공학회지
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• 제20권1호
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• pp.17-21
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• 2007

In this study, brazing characteristics of the dissimilar Ti and Cu metals using a Zr-base amorphous filler ($Zr_{41.2}Ti_{13.8}Cu_{12.5}Ni_{10.0}Be_{22.5}$ in at.%) have been investigated for various bonding temperatures. In the sample brazed at $790^{\circ}C$ for 10 min., the Ti-rich phases in the joint were observed, while the Cu-rich phases were obtained in the sample brazed at $825^{\circ}C$ for 10 min.. Such a different microstructure and composition in the joints could be explained by the degree of the dissolution reaction. At $790^{\circ}C$, the reaction between the Zr-rich liquid phase and the Ti base metal was actively occurred to form Ti-rich liquid phase in the joint. As the temperature increased to $825^{\circ}C$, however, the reaction between the Ti-rich liquid phase and the Cu base metal was promoted to form the Cu-rich liquid phase in the joint finally. Such a different interface reaction is attributed to the reactivity or solubility between the Zr as a main element in the filler and the Ti and Cu as a base metal element.

• 대한금속재료학회지
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• 제50권12호
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• pp.939-948
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• 2012

A 3-ply clad metal consisting of aluminum and copper was fabricated by roll bonding process and the microstructures and mechanical properties of the roll-bonded and post-roll-bonding heat treated Cu/Al/Cu clad metal were investigated. A brittle interfacial reaction layer formed at the Cu/Al interfaces at and above $400^{\circ}C$. The thickness of the reaction layer increased from $12{\mu}m$ at $400^{\circ}C$ to $28{\mu}m$ at $500^{\circ}C$. The stress-strain curves demonstrated that the strength decreased and the ductility increased with heat treatment up to $400^{\circ}C$. The clad metal heat treated at $300^{\circ}C$ with no indication of a reaction layer exhibited an excellent combination of the strength and ductility and no delamination of layers up to final fracture in the tensile testing. Above $400^{\circ}C$, the ductility decreased rasxpidly with little change of strength, reflecting the brittle nature of the intermetallic interlayers. In Cu/Al/Cu clad heat treated above $400^{\circ}C$, periodic parallel cracks perpendicular to the stress axis were observed at the interfacial reaction layer. In-situ optical microscopic observation revealed that cracks were formed in the Cu layer due to the strain concentration in the vicinity of horizontal cracks in the intermetallic layer, promoting the premature fracture of Cu layer. Vertical cracks parallel to the stress axis were also formed at 15% strain at $500^{\circ}C$, leading to the delamination of the Cu and Al layers.

• 한국염색가공학회지
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• 제4권3호
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• pp.116-121
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• 1992

This paper is on for a material to replace the petroleum-based resins used as adhesives for the fiber in rubber composite materials. The study limited to the reaction properties of tannin with formaldehyde. Tannin-formaldehyde(TF) reactions were carried out in aqueous media. Rates of reaction were strongly dependent on concentration, temperature, pH, and the mole ratio of tannin to formaldehyde. Viscosities of reaction mixtures were followed up to gelation. The reactivity of tannin-formaldehyde resins was greater than that of resorcinol-formaldehyde resins. To formulate an adhesive, a styrene-butadiene-vinyl pyridine terpolymer latex(L) was added to the TF. This preliminary results suggest that the condensed tannins have considerable promise as substitutes for resorcinol used in resin formulation for bonding of fiber to rubber.