• Journal of the Korean Ceramic Society
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• v.34 no.5
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• pp.483-490
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• 1997

Al2O3/metal composites were fabricated by oxidation and reaction of molten Al-alloy into two types of commercial Al2O3-SiO2 fibrous insulation board. The growth rate, composition and microstructure of these materials were described. An AlZnMg(7075) alloy was selected as a parent alloy. Mixed polycrystalline fiber and glass phase fiber were used as a filler. The growth surface of an alloy was covered with and without SiO2. SiO2 powder was employed as a surface dopant to aid initial oxidation of Al-alloy. Al-alloy, SiO2, fiber block and growth inhibitor CaSiO3 were packed sequentially in a alumina crucible and oxidized in air at temperature range 90$0^{\circ}C$ to 120$0^{\circ}C$. The growth rate of composite layer was calculated by measuring the mass increasement(g) per unit surface($\textrm{cm}^2$). XRD and optical microscope were used to investigate the composition and phase of composites. The composite grown at 120$0^{\circ}C$ and with SiO2 dopant showed rapid growth rate. The growth behavior differed a little depending on the types of fiber used. The composites consist of $\alpha$-Al2O3, Al, Si and pore. The composite grown at 100$0^{\circ}C$ exhibited better microstructure compared to that grown at 120$0^{\circ}C$.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.19-25
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• 2000

Dielectric polymer films produced from benzocyclobutene (BCB) formulations (CYCLOTENE＊ family resins) are known to possess many desirable properties for microelectronic applications; for example, low dielectric constant and dissipation factor, low moisture absorption, rapid curing on hot plate without reaction by-products, minimum shrinkage in curing process, and no Cu migration issues. Recently, BCB-based products for thick film applications have been developed, which exhibited excellent dissipation factor and dielectric constant well into the GHz range, 0.002 and 2.50, respectively. Derived from these properties, the applications are developed in: bumping/wafer level packaging, Ga/As chip ILD, optical waveguide, flat panel display, and lately in BCB-coated Cu foil for build-up board. In this paper, we review the relevant properties of BCB, then the application areas in bumping/wafer level packaging and BCB-coated Cu foil for build-up board.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.426-432
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• 2000

The hydraulic loading system real-time simulator using a PC and I/O interface board is developed to simulate the dynamic characteristics of hydraulic loading system in real time. The simulator receives the digital on-off control signals generated by the operator through the D/I channels, updates the state and output variables of the hydraulic loading system responding to the input signals and draw the moving pictuters of the lift cylinder, lift arm and loading box on the PC monitor in real time. Also, the operator can observe the displacement and pressure of cylinder, the rotatinal angle, reaction force, and safety factors of lift arm representing the operation of hydraulic loading system through the PC monitor in real time. The real-time simulator can be a very useful tool to design industrial dynamic systems and feel the goodness of the system operation since the operator can observe the moving pictures of the operating system in real time as he operates the real time simulator.

• KIEE International Transactions on Electrophysics and Applications
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• v.2C no.6
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• pp.309-313
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• 2002

In this paper, we have studied minimization of the kerf-width and surface burning, which occurred after the conventional singulation process of the multi-layer BGA board with copper, polyethylene and epoxy glass fiber. The high thermal energy of a pulsed Nd:YAG laser is used to cut the multi-layer board. The most considerable matter in the laser cutting of the multi-layer BGA boards is their different absorption coefficient to the laser beam and their different heat conductivity. The cut mechanism of a multi-layer BGA board using a 2$^{nd}$ harmonic Nd:YAG laser is the thermal vaporization by high temperature rise based on the Gaussian profile and copper melting point. In this experiment, we found that the sacrifice layer and Na blowing are effective in minimizing the surface burning by the reaction between oxygen in the air and the laser beam. In addition, N2 blowing reduces laser energy loss by debris and suppresses surface oxidation. Also, the beam incidence on the epoxy layer compared to polyimide was much more suitable to reduce damage to polyimide with copper wire for the multi layer BGA singulation. When the polyester double-sided tape is used as a sacrifice layer, surface carbonization becomes less. The SEM, non-contact 3D inspector and high-resolution microscope are used to measure cut line-width and surface morphology.

• Journal of Mechanical Science and Technology
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• v.19 no.6
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• pp.1338-1346
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• 2005

Effects of thermal contact resistance between heater and susceptor, susceptor and graphite board in a MOCVD reactor on temperature distribution and film growth rate were analyzed. One-dimensional thermal resistance model considering thermal contact resistance and heat transfer area was made up at first to find the temperature drop at the surface of graphite board. This one-dimensional model predicted the temperature drop of 18K at the board surface. Temperature distribution of a reactor wall from the three-dimensional computational fluid dynamics analysis including the gap at the wafer position showed the temperature drop of 20K. Film growth rates of InP and GaAs were predicted using computational fluid dynamics technique with chemical reaction model. Temperature distribution from the three-dimensional heat transfer calculation was used as a thermal boundary condition to the film growth rate simulations. Temperature drop due to the thermal contact resistance affected to the GaAs film growth a little but not to the InP film growth.

• Physical Therapy Rehabilitation Science
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• v.10 no.2
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• pp.161-166
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• 2021

Objective: The purpose of this study was to quantitatively evaluate the Wii Balance Board (WBB)-based jump performance for the elderly and to confirm the difference in jump performance according to age. Design: Cross-sectional study. Methods: 40 young adults (aged 22.5±2.2 years) and 33 elderly (aged 75.1±5.2 years) without orthopedics disease participated in this study. Standing on the WBB then, with the signal "start," jump vertically to the maximum height at which you can jump, land on the force plate after jump and keep it standing on both feet. All subjects were required to practice the jump sufficiently before starting the measurement, each measuring three times, and the mean values were used. A one-minute break was provided between each trial. Evaluators waited within 1meter for every test to prepare for fall. Results: The vertical ground reaction force of elderly and young adults when jumping using WBB showed a significant difference (p<0.05) and demonstrated discriminant validity. Between two groups, there were significant differences in overall jump time (p<0.05), maximum value (p<0.05), minimum value (p<0.05), center of pressure (COP) pathlength (p<0.05), and flight time p<0.05). Conclusions: This study found that performing the vertical jump, the elderly showed longer jump time, lower vertical ground reaction force, COP pathlength and shorter flight phase than healthy young adults using WBB and demonstrated that as a measurement tool, WBB discriminated vertical jump performance between elderly and young adults.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1948-1953
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• 2005

The Teakwondo is composed of the breaking, competition and poomsea. In the hand breaking, the breaking impact of human is affected by the breaking posture. In this paper, impact analysis of the human model for breaking posture is carried out. The LifeMOD is used in breaking modeling and simulation. The simulation model createsthe human model to hit and to grasp a pine board. For the breaking, the poomsea motion of the hand joint inputs the splines pass condition. As the results, the reaction of human joint is presented

• Korean Journal of Agricultural Science
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• v.36 no.1
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• pp.11-18
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• 2009

The purpose of this study is to examine a proper amount of addition and a proper point for addition of titanium dioxide for the manufacture of E0 type of urea-formaldehyde resin (UF). The reduction of free formaldehyde from UF resin treated particle board was also investigated. $TiO_2$ content was 0.5%, 1% and 3% on the dry basis of UF resin. UV light was used to initiate reaction. The results of this study are as follows: 1. During UF resin manufacturing process, the second adding step of urea was proper point for $TiO_2$ addition. 2. 1 % addition of $TiO_2$ gave good values for the Eo type urea-formaldehyde resin. 3. There was no significant difference between physical properties of particle board, but the higher the adding content of titanium dioxide resulted in the lower the mechanical properties.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.30 no.8
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• pp.126-132
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• 2002

Jitter induced from several payloads on-board satellites degrade the performance of pointing accuracy and attenuate the resolving power of highly-precise camera image such as KOMPSAT II. In this paper, we introduce a micro-vibration measurement technique, analysis of dynamic characteristics, and modeling method for a reaction wheel assembly which is one of the major sources of jitter in satellites and an effective vibration reduction techniques are considered. Based on these techniques, vibration measurement and passive control were performed with an micro-vibration generator which was designed to have similar dynamic performances with an actual reaction wheel assembly above 50Hz.

• Aerospace Engineering and Technology
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• v.5 no.2
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• pp.188-194
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• 2006

This paper deals with the development of Engineering Model for the TCU( Thruster Control Unit) and simulation system of the reaction control system using cold gas. TCU communicates with TLM(Telemetry) and ground control console so that it transmits monitoring data of pressures and temperatures for reaction control system. The cpu/communication board performs MIL-STD-1553B communication, RS-422 communication, data input/output processing and program loading to EEPROM. We applied Intel 80386DX Microprocessor, 256Kbytes EEPROM and 256Kbytes SRAM for program storage and execution. Also, we developed the direct access interface circuit to EEPROM and simulation system for TCU.