• Journal of Biomedical Engineering Research
• /
• v.36 no.6
• /
• pp.251-263
• /
• 2015

Scaffolds play a crucial role in the tissue engineering. Biodegradable polymers with great processing flexibility and biocompatability are predominant scaffolding materials. New developments in biodegradable polymers and their nanocomposites for the tissue engineering are discussed. Recent development in the scaffold designs that mimic nano and micro features of the extracellular matrix (ECM) of bones, cartilages, and vascular vessels are presented as well.

• Journal of Welding and Joining
• /
• v.31 no.6
• /
• pp.17-26
• /
• 2013

Recent developing tendency of overlay welding on welding materials are studied by searching of NDSL, Science Direct, KIPRIS and so on. Fe, Co, Ni and WC are selected as welding materials. Development and improvement of various new overlay welding technology, especially improvement of quality and formation of crack are introduced. Also the prospective technologies of overlay welding are anticipated.

• Economic and Environmental Geology
• /
• v.47 no.3
• /
• pp.265-273
• /
• 2014

Unconventional resources are natural resources which require greater than industry-standard levels of technology or investment to exploit the commercial development. The key point is that unconventional resources are lower quality fuel sources and are not as economically viable as crude oil and conventional gas. Over the past 100 years, Conventional oil and gas has been satisfied with the energy demands. But developing countries such as China and India, the introduction of the developed countries and the surge of energy due to the depletion of unconventional energy resources will be the limelight. According to be analyzed in the academic literature to unconventional gas and oil(2000~2012) by the program of 'web of science', the research activities 402 papers in unconventional gas and 1,581 papers in unconventional oil.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2010.10a
• /
• pp.726-729
• /
• 2010

Copper Pillar Tin Bump (CPTB) was investigated for high density chip interconnect technology development, which was prepared by electroplating and electro-less plating methods. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM-1250 dry film photoresist (DFR), with copper electroplating for Copper Pillar Bump (CPB) formation firstly, and then tin electro-less plating on it for control oxidation. Electric resistivity and mechanical shear strength measurements were introduced to characterize the oxidation effects and bonding process as a function of thermo-compression. Electrical resistivity increased with increasing oxidation thickness, and shear strength had maximum value with $330^{\circ}C$ and 500 N thermo-compression process. Through the simulation work, it was proved that when the CPTB decreased in its size, it was largely affected by the copper oxidation.

• Journal of Welding and Joining
• /
• v.29 no.1
• /
• pp.65-73
• /
• 2011

Microstructural characteristics of two high strength (600 MPa & 800 MPa) weld metals produced by flux-cored arc welding process (FCAW) were evaluated. The 600 MPa grade weld metal was consisted of 75% acicular ferrite and 25% ferrite which was formed at relatively high temperature (grain boundary ferrite, widmanstatten ferrite, polygonal ferrite). However, the 800 MPa grade weld metal was composed of about 85% acicular ferrite and 15% low temperature forming phases (bainite, martensite). The prior austenite grain size of 800 MPa grade weld metal was decreased by solute drag force. The compositions and sizes of inclusions which are the dominant factors for the formation of acicular ferrite were analyzed by a transmission electron microscopy (TEM). In both 600 MPa and 800MPa grade weld metals, the inclusions were mainly consisted of Ti-oxide and Mn-oxide, and the average size of inclusions was $0.7{\mu}m$. The 800 MPa grade weld metal exhibited higher tensile strength and similar toughness compared with the 600 MPa grade weld metal. This result is mainly due to a higher fraction of low temperature products and a lower fraction of grain boundary ferrite in the 800 MPa grade weld metal.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2011.10a
• /
• pp.903-906
• /
• 2011

The electroplating and electro-less plating methods have been applied for the high density chip interconnect of the Copper Pillar Tin Bump (CPTB) preparation. The CPTB was prepared, which had been electroplated about $100{\mu}m$ pitch of copper layer firstly, and then the Tin layer was deposited on the copper pillar surface to protect the oxidation of it. It was also very important to get uniform thickness of electroplated copper layer, though it was difficult and sensitive. In order to control the thickness distribution, it was examined that the current separating disk of Insulating Gate with a hole in the center was installed between electrodes. The current flows through the center hole of the Insulating Gate in the cylindrical electroplating bath and the other parts were blocked to protect current flowing. The main current flowed through the center hole of the Insulating Gate directly to the opposite electrode of wafer disk. As the results, it was verified that the copper layer was thick in the center part of wafer disk with distribution of thinner to the outer part toward edge.

• Korean Journal of Metals and Materials
• /
• v.49 no.12
• /
• pp.924-929
• /
• 2011

It is well known that grain boundary cavitation is the main failure mechanism in austenitic stainless steel under tensile hold creep-fatigue interaction conditions. The cavities are nucleated at the grain boundary during cyclic loading and grow to become grain boundary cracks. The attenuation of ultrasound depends on scattering and absorption in polycrystalline materials. Scattering occurs when a propagation wave encounters microstructural discontinuities, such as internal voids or cavities. Since the density of the creep-fatigue cavities increases with the fatigue cycles, the attenuation of ultrasound will also be increased with the fatigue cycles and this attenuation can be detected nondestructively. In this study, it is found that individual grain boundary cavities are formed and grow up to about 100 cycles and then, these cavities coalesce to become cracks. The measured ultrasonic attenuation increased with the cycles up to cycle 100, where it reached a maximum value and then decreased with further cycles. These experimental measurements strongly indicate that the open pores of cavities contribute to the attenuation of ultrasonic waves. However, when the cavities develop, at the grain boundary cracks whose crack surfaces are in contact with each other, there is no longer any open space and the ultrasonic wave may propagate across the cracks. Therefore, the attenuation of ultrasonic waves will be decreased. This phenomenon of maximum attenuation is very important to judge the stage of grain boundary crack development, which is the indication of the dangerous stage of the structures.

• Corrosion Science and Technology
• /
• v.8 no.5
• /
• pp.184-187
• /
• 2009

The trend of the microjoining technology by the laser-soldering process has been reviewed. Among the production technologies, joining technology plays an important role in the fabrication of electronic components. This has led to an increasing attention towards the use of modern microjoining technology such as micro-resistance spot joining, micro-soldering, micro-friction stir joining and laser-soldering, etc. This review covers the recent technical trends of laser-soldering collected from the COMPENDEX DB analysis of published papers, research subject and research institutes.

• Journal of Welding and Joining
• /
• v.34 no.3
• /
• pp.31-39
• /
• 2016

The joining technology of the metal and engineering plastic is rising lately as the important issue in concerning with the method of reducing the weight and air pollution of the transportation structure such as automotive and vehicles. The metal/ plastic joining technology has been developed in 2 types of adhesively bonding and direct joining without adhesives. Moreover, in the direct joining method, there are 2 kinds of mechanical joining and welding. This review paper presents the present world wide status and tendency of the development of metal/plastic joining technology. This article intends to offer the materials for development and raising of the domestic metal/plastic joining technology.

• Corrosion Science and Technology
• /
• v.10 no.3
• /
• pp.77-79
• /
• 2011

The research trend in the corrosion behaviour of stainless steel weldment has been reviewed. The welding technology plays an important role in the fabrication of structure such as chemical plant, power plant, because welding can influence various factors in the performance of plant and equipment. This has led to an increasing attention towards the corrosion behaviour of weldment which has been one of the major issues for both welding and corrosion research engineers. The aim of this paper is to give a short survey of the recent technical trends of welding and corrosion including the electrochemical corrosion, stress corrosion cracking, and corrosion fatigue in connection with the welding materials, welding process, and welding fabrication. This study covers the corrosion behaviour of stainless steel weldment collected from the COMPENDEX DB analysis of published papers, research subject and research institutes.