• Title/Summary/Keyword: Rapid processing

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Query Processing based Branch Node Stream for XML Message Broker

  • Ko, Hye-Kyeong
    • International journal of advanced smart convergence
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    • v.10 no.2
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    • pp.64-72
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    • 2021
  • XML message brokers have a lot of importance because XML has become a practical standard for data exchange in many applications. Message brokers covered in this document store many users. This paper is a study of the processing of twig pattern queries in XML documents using branching node streams in XML message broker structures. This work is about query processing in XML documents, especially for query processing with XML twig patterns in the XML message broker structure and proposed a method to reduce query processing time when parsing documents with XML twig patterns by processing information. In this paper, the twig pattern query processing method of documents using the branching node stream removes the twigging value of the branch node that does not include the labeling value of the branch node stream when it receives a twig query from the client. In this paper, the leaf node discovery time can be reduced by reducing the navigation time of nodes in XML documents that are matched to leaf nodes in twig queries for client twig queries. Overall, the overall processing time to respond to queries is reduced, allowing for rapid question-answer processing.

Bang-Bang plus PID Temperature Control Scheme for Rapid Thermal Processing (급속 열처리 공정을 위한 Bang-Bang/PID 온도제어기법)

  • Song, Tae-Seung;Lyu, Joon
    • Journal of IKEEE
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    • v.3 no.1 s.4
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    • pp.109-117
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    • 1999
  • This paper describes the quick and precise control of the wafer temperature essential in rapid thermal processing(RTP). The bang-bang plus PID controller structure is introduced to satisfy rapid ramp-up rate and reduce overshoot and steady state error. The controller employs the PID action when the magnitude of the error between reference signal and the output temperature signal is smaller than some prescribed value. To find PID gains, the plant(autoregressive) model is first identified and Kappa-Tau tuning rule is used. The developed controller is applied to experimental RTP apparatus, and performances are evaluated.

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Implementation of process and surface inspection system for semiconductor wafer stress measurement (반도체 웨이퍼의 스트레스 측정을 위한 공정 및 표면 검사시스템 구현)

  • Cho, Tae-Ik;Oh, Do-Chang
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.45 no.8
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    • pp.11-16
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    • 2008
  • In this paper, firstly we made of the rapid thermal processor equipment with the specifically useful structure to measure wafer stress. Secondly we made of the laser interferometry to inspect the wafer surface curvature based on the large deformation theory. And then the wafer surface fringe image was obtained by experiment, and the full field stress distribution of wafer surface comes into view by signal processing with thining and pitch mapping. After wafer was ground by 1mm and polished from the back side to get easily deformation, and it was heated by three to four times thermal treatments at about 1000 degree temperature. Finally the severe deformation between wafer before and after the heat treatment was shown.

Efficient Calculation of Trapped Volumes in Layered Manufacturing Process (적층 성형 과정에서 고립 체적의 효율적 계산)

  • 김진영;이건우;정융호
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.2
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    • pp.154-161
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    • 1998
  • Prototypes of a design are always needed for the purpose of visualization and evaluation in the aspect of manufacturability functionality, and aesthetic appearance. Since the prototyping process requires a significant amount of cost and time, various rapid prototyping processes are recently being introduced in the process. However, it is usually necessary for a part built up by a rapid prototyping system to be refined by a post-processing process, in which the stair steps on the surfaces, the support structures (if they exist), and the unprocessed material are eliminated. This post-processing is usually done manually and is a time-consuming task. Especially, eliminating the trapped volumes, the volume of the unprocessed material entrapped by the solidified portion, is sometimes impossible in some processes. This study provides a designer with a tool to detect the existence and to calculate the quantity of the trapped volumes at the given build-up direction, so that the proper build-up direction is chosen or the part is built by pieces to avoid the problems caused by the trapped volumes in advance. Since the proposed algorithm can efficiently calculate the amount of the trapped volumes at any build-up direction, it has the potential of such application as optimizing the build-up direction to minimize the trapped volumes.

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Study of Growth and Temperature Dependence of SnS Thin Films Using a Rapid Thermal Processing (황화급속열처리를 이용한 SnS 박막성장 및 온도의존성 연구)

  • Shim, Ji-Hyun;Kim, Jeha
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.2
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    • pp.95-100
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    • 2016
  • We fabricated a tin sulfide (SnS) layer with Sn/Mo/glass layers followed by a RTP (rapid thermal processing), and studied the film growth and structural characteristics as a function of annealing temperature and time. The elemental sulfur (S) was cracked thermally and applied to form SnS polycrystalline film out of the Sn percursor at pre-determined pressures in the RTP tube. The sulfurization was done at the temperature from $200^{\circ}C$ to $500^{\circ}C$ for a time period of 10 to 40 min. At ${\leq}300^{\circ}C$, 20 min., p-type SnS thin films was grown and showed the best composition of at.% of [S]/[Sn] $${\sim_=}$$ 1 and [111] preferred orientation as investigated from using XRD (X-ray diffraction) analysis and EDS (energy dispersive spectroscopy) and SEM (scanning electron microscopy), and optical absorption by a UV-VIS spectrometer. In this paper, we report the details of growth characteristics of single phase SnS thin film as a function of annealing temperature and time associated with the pressure and ambient gas in the RTP tube.

Development of a CUBRID-Based Distributed Parallel Query Processing System

  • Kim, Hyeong-Il;Yang, HyeonSik;Yoon, Min;Chang, Jae-Woo
    • Journal of Information Processing Systems
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    • v.13 no.3
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    • pp.518-532
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    • 2017
  • Due to the rapid growth of the amount of data, research on bigdata processing has been highlighted. For bigdata processing, CUBRID Shard is able to support query processing in parallel way by dividing the database into a number of CUBRID servers. However, CUBRID Shard can answer a user's query only when the query is required to gain accesses to a single CUBRID server, instead of multiple ones. To solve the problem, in this paper we propose a CUBRID based distributed parallel query processing system that can answer a user's query in parallel and distributed manner. Finally, through the performance evaluation, we show that our proposed system provides 2-3 times better performance on query processing time than the existing CUBRID Shard.

The optimal paremeter design of rapid thermal processing to improve wafer temperature uniformity on the semiconductor manufacturing (반도체 공정에서 웨이퍼의 온도균일도향상을 위한 고속열처리공정기의 최적 파라미터 설계)

  • 최성규;최진영;권욱현
    • 제어로봇시스템학회:학술대회논문집
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    • 1997.10a
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    • pp.1508-1511
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    • 1997
  • In this paper, design parameters of Rapid Thermal Processing(RrW) to minimize the wafer tempera ture uniformity errors are proposed. 1,anip ling positions and the wafer height are important parameters for waf er temperature uniformity in R'I'P. We propose the method to seek lamp ling positions and the wafer height for optimal temperature uniformity. l'he ~~roposed method is applied to seek optimal lamp ling positions and the waf er height of 8 inch wafer. 'I'o seek the optimal lamp ling positions and the wafer height, we var\ulcorner. lamp ling 110s itions and the wafer height and then formulate the wafer temperature uniformity problem to the linear programmi ng problem. Finally, it is shown that the wafer temperature uniformity in RI'I' designed by optimal prarneters is improved to comparing with Ii'l'P designed by the other method.

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Estimation of Temperature Distribution on Wafer Surface in Rapid Thermal Processing Systems (고속 열처리공정 시스템에서의 웨이퍼 상의 온도분포 추정)

  • Yi, Seok-Joo;Sim, Young-Tae;Koh, Taek-Beom;Woo, Kwang-Bang
    • Journal of Institute of Control, Robotics and Systems
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    • v.5 no.4
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    • pp.481-488
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    • 1999
  • A thermal model based on the chamber geometry of the industry-standard AST SHS200MA rapid thermal processing system has been developed for the study of thermal uniformity and process repeatability thermal model combines radiation energy transfer directly from the tungsten-halogen lamps and the steady-state thermal conducting equations. Because of the difficulties of solving partial differential equation, calculation of wafer temperature was performed by using finite-difference approximation. The proposed thermal model was verified via titanium silicidation experiments. As a result, we can conclude that the thermal model show good estimation of wafer surface temperature distribution.

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Enzyme Immunoassay for Rapid Detection of the Fungicide Iprovalicarb Residues (살균제 Iprovalicarb 잔류물의 신속한 검출을 위한 효소면역분석법)

  • Cho, H.K.;Kyung, K.S.;Lee, E.Y.
    • Journal of Biosystems Engineering
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    • v.31 no.6 s.119
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    • pp.535-540
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    • 2006
  • For a biosensor development, an enzyme-linked immunosorbent assay (ELISA) of the fungicide iprovalicarb was developed by minimizing the processing time. The time for whole incubation process was reduced from 135 minutes to 15 minutes. The concentration of antibody was varied to improve sensitivity. The total processing time was reduced from 2.5 hours to 20 minutes, the final sensitivity ($IC_{50}$ value) of 7.93 ng/mL and the lowest detection limit of 0.045 ng/mL were obtained. This ELISA was applied to potatoes and onions, and the recoveries were in the range of 98.85 $\sim$ 101.20% and 87.97 $\sim$ 102.70%, respectively. Accordingly, this method can be used as basis for a biosensor for rapid monitoring of iprovalicarb residues in crops.

Surface Alloying of Iron Base Rapid Solidification Materials Using Laser Beam (레이저 빔을 이용한 철계 급랭 응고 재료의 표면 합금화)

  • Nam, K.S.;Lee, K.H.
    • Journal of the Korean Society for Heat Treatment
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    • v.9 no.4
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    • pp.229-233
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    • 1996
  • This work has been carried out to reduce the softening of heat affected zone on laser surface alloying. Iron based rapid solidification material with $Cr_{5-10}$, $V_{1-3}$, $Mo_{3-7}$, $W_{2-5}$, $B_{7-8}$, $C_{2-3}$, $Si_{0.5-1}at%$ was alloyed on the surface of SM45C steel. The excellent softening resistance in alloyed and heat affected zone showed, which could be attributed to the formation of stable high temperature precipitates.

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