• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 추계학술대회논문집
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• pp.267-270
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• 2004

In Micro injection process, it is needed to the technique of making micro die, Rapid Thermal Pressing (RTP) and other techniques. Those techniques are independent. But the mutual connected system of techniques is needed. The target of this paper is the design of micro mold and the development of the entire micro injection techniques for functional polymer.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 추계학술대회논문집
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• pp.284-289
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• 2004

Since polymer materials at elevated temperatures are usually rate-sensitive, the analysis of RTP process requires considering the effect of the rate-dependent. The material behavior that exhibits rate-sensitivity is called visco-plastic. A two-dimensional visco-plastic finite element formulation which constitutive equation is based on the formulation proposed by Perzyna is presented. This Paper is purposed to calcuate pressure distribution on PMMA in compression process and to predict the relationship with defects after demolding process. This paper analyzes, both analytically and numerically, the pressure distributions on the surface of PMMA during open-die RTP process. In this research, PMMA is used to be simulated at $110^{\circ}C$ near the transition temperature.

• 한국분말재료학회지
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• 제3권4호
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• pp.253-259
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• 1996

The efficiency of thermoelectric devices for different applications is known to depend on the thermoelectric effectiveness of the material which tends to grow with the increase of its chemical homogeneity. Thus an important goal for thermal devices is to obtain chemically homogeneous solid solutions. In this work, the new process with rapid solidification (melt spinning method) followed by hot pressing was investigated to produce homogeneous material. Characteristics of the material were examined with HRD, SEM, EPMA-line scan and bending test. Property variations of the materials were investigated as a function of variables, such as dopant ${CdCl}_{2}$ quantity and hot pressing temperature. Quenched ribbons are very brittle and consist of homogeneous $Bi_2Te_3$, ${Bi}_{2}{Se}_{3}$ solid solutions. When the process parameters were optimized, the maximum figure of merit was 2.038$\times$$10^{-3}K^{-4}. The bending strength of the material hot pressed at 50$0^{\circ}C$ was 8.2 kgf/${mm}^2$.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.571-572
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• 2006

RTP (rapid thermal pressing), one of micro-pattern replication techniques like hot embossing, is focused on achieving shorter cycle time. DFSS(Design for Six Sigma) has been applied in order to enhance the completeness of the development process for RTP system. According to DIDOV roadmap, we derived design concepts and subsequently decided the main performances, design factors, and components for RTP system. In the design process of RTP system using finite element analysis, it was realized that its structural characteristics affect large area replicability. Optimizing structural design factors, based on CAE, it was checked out that its large area replicability could be improved in a virtual test. Finally, we have a plan to validate the large area replicability of the developed RTP system, by performing micro-pattern replication tests with polymeric sheets.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 추계학술대회논문집
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• pp.294-297
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• 2004

RTP(Rapid Thermal Pressing) is to fabricate desired pattern on polymer substrate by pressing patterned mold against the substrate heated around glass transition temperature. For a successful RTP process, the whole process including heating, molding, cooling and demolding should be conducted 'rapidly' as possible. As the RTP process is effective in replicating patterns on flat large surface without causing shape distortion after cooling, it is being widely used for fabricating various micro/bio application components, especially with channel-type microstructures on surface. This investigation finally aims to develop a RTP process machine for mass-producing micro/bio application components. As a first step for that purpose, we intended to examine the technological difficulties for realizing mass production by RTP process. Therefore, in the current paper, 4 kinds of RTP machines were examined and then the RTP process was conducted experimentally for PMMA film by using one of the machines, HEX 03. The micro-patterned molds used for RTP experiment was fabricated from silicon wafer by semi-conduct process. The replicated micro patterns on PMMA films were examined using SEM and the causes of defect observed in the replicated patterns were discussed.

• 한국해양공학회지
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• 제25권3호
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• pp.28-33
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• 2011

The thermal shock properties of SiC materials were investigated for high temperature applications. In particular, the effect of thermal shock temperature on the flexural strength of SiC materials was evaluated, in conjunction with a detailed analysis of their microstructures. The efficiency of a nondestructive technique using ultrasonic waves was also examined for the characterization of SiC materials suffering from a cyclic thermal shock history. SiC materials were fabricated by a liquid phase sintering process (LPS) associated with hot pressing, using a commercial submicron SiC powder. In the materials, a complex mixture of $Al_2O_3$ and $Y_2O_3$ powders was used as a sintering additive for the densification of the microstructure. Both the microstructure and mechanical properties of the sintered SiC materials were investigated using SEM, XRD, and a three point bending test. The SiC materials had a high density of about 3.12 Mg/m3 and an excellent flexural strength of about 700 MPa, accompanying the creation of a secondary phase in the microstructure. The SiC materials exhibited a rapid propagation of cracks with an increase in the thermal shock temperature. The flexural strength of the SiC materials was greatly decreased at thermal shock temperatures higher than $700^{\circ}C$, due to the creation of microcracks and their propagation. In addition, the SiC materials had a clear tendency for a variation in the attenuation coefficient in ultrasonic waves with an increase in thermal shock cycles.

• 마이크로전자및패키징학회지
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• 제31권1호
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• pp.7-15
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• 2024

유연신축성 전자 디바이스의 다기능화, 소형화 및 고출력화 추세에 따라 우수한 열 전달 특성을 갖춘 재료나 구조가 이슈로 부상하고 있다. 기존의 열계면 소재는 급격한 구부림, 비틀림, 신축 등을 겪어야 하는 유연신축성 전자 디바이스의 방열 요구성능을 충족시키지 못한다. 이러한 문제를 해결하기 위하여 높은 열전도성과 신축성을 동시에 갖는 열계면 소재 개발이 요구된다. 본 논문에서는 Liquid metal, Carbon, Ceramic 기반 신축성 열계면 소재의 연구동향을 살펴보고 열적, 기계적 특성 향상을 위한 효과적 전략을 알아보고자 한다.

• 한국재료학회지
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• 제14권3호
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• pp.218-223
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• 2004

P-type $\beta$-FeSi$_2$ with a nominal composition of $Fe_{0.92}Mn_{0.08}Si_2$ powders has been produced by mechanical alloying process. As-milled powders were spray dried and consolidated by atmospheric plasma thermal spraying as a rapid sintering process. As-milled powders were of metastable state and fully transformed to $\beta$-$FeSi_2$ phase by subsequent isothermal annealing. However, as-thermal sprayed $Fe_{0.92}Mn_{0.08}Si_2$ consisted of untransformed mixture of $\alpha$-$Fe_2Si_{5}$ and $\varepsilon$-FeSi phases. Isothermal annealing has been carried out to induce transformation to the thermoelectric semiconducting $\beta$-$FeSi_2$ phase. Isothermal annealing at $845^{\circ}C$ in vacuum gradually led to the thermoelectric semiconducting $\beta$-$FeSi_2$ phase transformation, but some residual metallic $\alpha$ and $\varepsilon$ phases were unavoidable even after prolonged annealing. Thermoelectric properties of $\beta$-$FeSi_2$ materials before and after isothermal annealing were evaluated. Seebeck coefficient increased and electric conductivity decreased with increasing annealing time due to the phase transition from metallic phases to semiconducting phases. Thermoelectric properties showed gradual increment, but overall properties appeared to be inferior to those of vacuum hot pressed specimens.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.47-52
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• 2018

본 연구에서는 디스플레이에 적용되는 기능성 고분자 필름의 나노구조에 의한 기계적 물성 저하 문제를 해결하기 위해 열처리 방법과 멀티스케일 계층구조를 통한 PMMA(Poly(methyl-methacrylate)) 필름의 내구성 향상에 대해 연구하였다. PMMA 필름의 기계적 특성을 향상시키기 위한 열처리 공정은 고온/고압의 자유제적 제어공정과 고온 공정 후 급속히 냉각시키는 공정으로 구성되어 있으며, 열 나노임프린트를 이용하여 스크래치로부터 나노구조를 보호하기 위한 멀티스케일 계층구조를 형성하였다. 연필경도 시험에 의해 발생한 미세구조의 손상에 대한 평가를 위해 표면 형상 변화와 기능성 변화를 평가하였으며, 이를 통하여 열처리와 멀티스케일 계층구조가 스크래치에 의한 정접촉각 감소와 투과율 손실 저감에 효과적임을 확인하였다.