• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.11
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• pp.1034-1046
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• 2011

In this paper, a design and fabrication of 40 W power amplifier for the X-band using load-pull measurement of GaN HEMT chip are presented. The adopted active device for power amplifier is GaN HEMT chip of TriQuint company, which is recently released. Pre-matched fixtures are designed in test jig, because the impedance range of load-pull tuner is limited at measuring frequency. Essentially required 2-port S-parameters of the fixtures for extraction optimal input and output impedances is obtained by the presented newly method. The method is verified in comparison of the extracted optimal impedances with data sheet. The impedance matching circuit for power amplifier is designed based on EM co-simulation using the optimal impedances. The fabricated power amplifier with 15${\times}$17.8 $mm^2$ shows the efficiency above 35 %, the power gain of 8.7~8.3 dB and the output power of 46.7~46.3 dBm at 9~9.5 GHz with pulsed-driving width of 10 usec and duty of 10 %.

• Journal of Navigation and Port Research
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• v.33 no.10
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• pp.691-697
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• 2009

Hardware dedicated off-the-shelf maritime differential GPS RSIM lacks the open architecture to meet all the minimum maritime user requirements and to include future GNSS improvements after recapitalization. This paper carries out a study to replace existing hardware dedicated differential GPS RSIM with software differential GPS RSIM in order to make up the weak point of hardware dedicated off-the-shelf maritime differential GPS RSIM. In this paper, the architecture of software RSIM is proposed for maritime DGPS recapitalization. And the feasibility analysis of the proposed software differential GPS RSIM is performed as the first phase to realize the proposed architecture. For the feasibility analysis, the prototype RF module and DSP module are implemented with properties as wide RF bandwidth, high sampling frequency, and high speed transmission interface. This paper shows that the proposed architecture has the possibility of real time operation of software RSIM functionality onto the PC-based platform through the analysis of computation time. Finally, this paper verifies that the L1/L2 dual frequency software differential RSIM designed according to the proposed method satisfies the performance specifications set out in RTCM paper 221-2006-SC104-STD.

• Journal of Korea Multimedia Society
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• v.10 no.1
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• pp.66-73
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• 2007

SDR technology is a fundamental wireless access technology that combines and accommodates multiple wireless communication standards in one transceiver system through just modifying software using modular communication platforms without any hardware modifications for RF and IF signal processing on the basis of high performance DSP devices. Various communication systems that are designed under diverse and complex network environments require the communication platforms on the basis of SDR supporting reorganization to guarantee simple and fast communication interfaces among the respective wireless networks. This paper introduces a main idea on the implementation of platform on the basis of SDR and a communication platform is designed for experiments that is composed of a DSP board with TMS320C6713 CPU, a FPGA board processing IF signals, and a module with RF transceiver processing wireless LAN frequency bandwidth. Various modulation schemes(BPSK, QPSK, and 16QAM) used in communication systems are applied and tested on the designed platform and the test results shows that it is possible to design a reconfigurable communication terminal platform.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.10 no.10
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• pp.1920-1926
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• 2006

With social interest, there hie been a lot of research on the Service Robot but now we are faced with the limitation of single platform. The alternative plan is the Ubiquitous-based Service Robot connected with a Ubiquitous network to overcome this limitation. Systems using RFID(Radio frequency Identification) and supersonic waves appeared for functions such as recognition of surroundings through Ubiquitous Sensor Networks. This was applied to the real robot and we have got good results. However, this has several limitations to applying to low power-based Sensor Network For example, if RFID uses a passive Sensor, the rate of recognition with the distance is limited. In case of supersonic waves, high power is required to drive them. Therefore, we intend to develop RSSI position recognition system on the basis of embodying a Sensor Network Module in this thesis. This RSSI position recognition system only measures RSSI of signals from each sensor nod. then converts them into distances and calculates the position. As a result, we can still use low power-based Sensor Network and overcome the limitation according to distance as planning Ad-Hoc Network.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.7-18
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• 2008

This paper reviews the current development of an ultra-slim SiP for Radio Frequency (RF) application, in which three flip chips, additional passive components and Surface Acoustic Wave (SAW) filters are integrated side-by-side. A systematic investigation is carried out for the design optimization, process and reliability improvement of the package, which comprises several aspects: a design study based on the 3D thermo-mechanical finite element analysis of the packaging, the determination of stress, warpage distribution, critical failure zones, and the figuration of the effects of material properties, process conditions on the reliability of package. The optimized material sets for manufacturing process were determined which can reduce the number of testing samples from 75 to 2. In addition the molded underfilling (MUF) process is proposed which not only saves one manufacturing process, but also improves the thermo-mechanical performance of the package compared with conventional epoxy underfilling process. In the end, JEDEC's moisture sensitivity test, thermal cycle test and pressure cooker tests have also been carried out for reliability evaluation. The test results show that the optimized ultra-slim SiP has a good reliability performance.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1547-1552
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• 2008

The tip of these catheter with straight needles is not able to reach in the vicinity of the disc bulging, which are the cause of the low back pain and because the far indirect radio-frequency treatment results in the decompression, the nucleoplasty has the limit. Many incurable diseases has not been solved due to the unexistence of the advanced technique for the MIS human body catheter device. To increase the possibility of nucleoplasty, the needle tip should be located at the closest area of the lesion. For this reason, the best way to increase the success rate of the operation is that the needle tip should access 3-dimensionally to the operating field as soon as possible. To achieve this aim, our studies are restricted as follows: 1) the SMA catheter design to control the 3-dimensional direction, 2) the security of the immediate response by the positive control of the SMA element thermal distribution using Peltier thermoelectric elements, 3) the aquisition of the control data by monitoring the relationship between the temperature of SMA element and the displacement, and 4) the design of the controller to guarantee the accurate location.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.37 no.8A
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• pp.661-668
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• 2012

In this paper, we introduce the low power wireless communication method and propose new protocol and algorithm for wireless communication which can be applied Active RFID system. Transceiver module is composed of MCU, RF transceiver and chip antenna. and it used the lithium coin battery for power supply. The experimental result is confirmed minimum power consumption which show average $10{\mu}A$(packet transmit) and $30{\mu}A$(packet receive) per second. It can be used ultra low power wireless communication. this result is possible for using the algorithm which predict the arrival time of packet. and it indicates that are possible to prevent malfunction and enhance responsiveness.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.31-36
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• 2000

We developed embedded inductors in MCM-D substrate for RF applications. The increasing demand for high density packaging was the driving forces to the development of MCM-D technology. Most of these development efforts have been focused on high performance digital circuits. However, recently there is a great need fur mixed mode circuits with a combination of digital, analog and microwave devices. Mixed mode modules often have a large number of passive components that are connected to a small number of active devices. Integration of passive components into the high density MCM substrate becomes desirable to further reduce cost, size, and weight of electronic systems while improving their performance and reliability. The proposed MCM-D substrate was based on Cu/photosensitive BCB multilayer and Ti/Cu is used to form the interconnect layer. Seed metal was formed with 1000 $\AA$ Ti/3000 $\AA$ Cu by sputtering method and main metal was formed with 3 $\mu\textrm{m}$ Cu by electrical plating method. The multi-turn sprial inductors were designed in coplanar fashion. This paper describe the manufacturing process of integrated inductors in MCM-D substrate and the results of electrical performance test.

• International journal of advanced smart convergence
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• v.4 no.2
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• pp.94-102
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• 2015

Optical camera communication (OCC) is an extension of Visible Light Communication. Different from traditional visible light communication, optical camera communications is an almost no additional cost technology by taking the advantage of build-in camera in devices. It was became a candidate for communication protocol for IoT. Camera module can be easy attached to IoT device, because it is small and flexible. Furthermore almost smartphone equip one or two camera for both back and font side with high quality and resolution. It can be utilized for receiving the data from LED or positioning. Actually, OCC combines illumination and communication. It can supply communication for special areas or environment where do not allow Radio frequency such as hospital, airplane etc. There are many concept and experiment be proposed. In this paper we proposed utilizing Android smart-phone camera for receiver and introduce new approach in modulation scheme for LED at transmitter. It also show how Manchester coding can be used encode bits while at the same time being successfully decoded by Android smart-phone camera. We introduce new data frame format for easy decoded and can be achieve high bit rate. This format can be easy to adapt to performance limit of Android operator or embedded system.

• Journal of Satellite, Information and Communications
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• v.7 no.3
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• pp.99-104
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• 2012

The United States will proceed with the effort to modernize the GPS system, and one of its main content is to provide L5 signal. L5 will be transmitted in a radio band reserved exclusively for aviation safety services. And, L5, in combination with L1, will improve the position accuracy via ionospheric correction and robustness via signal redundancy. However, The acquisition processing time of L5 takes longer than that of L1 as the code length of L5 is 10 times longer than that of L1. To reduce this acquisition processing time, a higher number of correlators in the aquisition module should be used. However, there is a problem that this causes increase in the complexity of the correlator configuration and the computation power. So, in this paper, we propose L5 signal tracking scheme using tracking results in the GPS L1/L5 receiver. The proposed scheme could reduce the hardware complexity as the GPS L5 signal acquisition module is not needed, and provide fast and stable tracking of L5 signal by aiding L1 tracking results such as PRN, the code phase synchronization, and the Doppler frequency. The feasibility of the proposed scheme is demonstrated through simulation results.