• Title/Summary/Keyword: RIE texture

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A study on Dry Etching for Lage Area Multi-Cystalline Silicon Solar Cell (대면적 다결정 실리콘 태양전지 제작을 위한 건식식각에 관한 연구)

  • Han, Kyu-Min;Su, Jin;Yoo, Kwon-Jong;Kwon, Jung-Young;Choi, Sung-Jin;Lee, Hi-Deok
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.243-243
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    • 2010
  • This paper two different etching, HF : HNO3 :DI and RIE were used for etching in multi-crystalline Silicon(Mc-Si) solar cell fabrication. The wafers etched in RIE texture showed low reflectance compared to the wafers etched in Acid soultion after SiNx deposition. In light current-voltage results, the cells etched in RIE texture exhibited higher short circuit current and open circuit voltage than those of the cells etched in acid solution. We have obtained 15.1% conversion efficiency in large area($156cm^2$) Multi-Si solar cells etched in RIE texture.

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Improvement of Surface-enhanced Raman Spectroscopy Response Characteristics of Nanoporous Ag Metal Thin Film with Surface Texture Structures (표면 요철구조를 적용한 나노 다공성 Ag 금속박막의 SERS 응답 특성 개선)

  • Kim, Hyeong Ju;Kim, Bonghwan;Lee, Dongin;Lee, Bong-Hee;Cho, Chanseob
    • Journal of Sensor Science and Technology
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    • v.29 no.4
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    • pp.255-260
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    • 2020
  • In this study, we developed a method of improving the surface-enhanced Raman spectroscopy (SERS) response characteristics by depositing a nanoporous Ag metal thin film through cluster source sputtering after forming a pyramidal texture structure on the Si substrate surface. A reactive ion etching (RIE) system with a metal mesh inside the system was used to form a pyramidal texture structure on the Si surface without following a complicated photolithography process, unlike in case of the conventional RIE system. The size of the texture structure increased with the RIE process time. However, after a process time of 60 min, the size of the structure did not increase but tended to saturate. When the RF power increased from 200 to 250 W, the size of the pyramidal texture structure increased from 0.45 to 0.8 ㎛. The SERS response characteristics were measured by depositing approximately 1.5 ㎛ of nanoporous Ag metal thin film through cluster sputtering on the formed texture structure by varying the RIE process conditions. The Raman signal strength of the nanoporous Ag metal thin film deposited on the Si substrate with the texture structure was higher than that deposited on the general silicon substrate by up to 19%. The Raman response characteristics were influenced by the pyramid size and the number of pyramids per unit area but appeared to be influenced more by the number of pyramids per unit area. Therefore, further studies are required in this regard.

Study of Low Reflectance and RF Frequency by Rie Surface Texture Process in Multi Crystall Silicon Solar Cells (공정가스와 RF 주파수에 따른 웨이퍼 표면 텍스쳐 처리 공정에서 저반사율에 관한 연구)

  • Yun, Myoung-Soo;Hyun, Deoc-Hwan;Jin, Beop-Jong;Choi, Jong-Young;Kim, Joung-Sik;Kang, Hyoung-Dong;Yi, Jun-Sin;Kwon, Gi-Chung
    • Journal of the Korean Vacuum Society
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    • v.19 no.2
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    • pp.114-120
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    • 2010
  • Conventional surface texturing in crystalline silicon solar cell have been use wet texturing by Alkali or Acid solution. But conventional wet texturing has the serious issue of wafer breakage by large consumption of wafer in wet solution and can not obtain the reflectance below 10% in multi crystalline silicon. Therefore it is focusing on RIE texturing, one method of dry etching. We developed large scale plasma RIE (Reactive Ion Etching) equipment which can accommodate 144 wafers (125 mm) in tray in order to provide surface texturing on the silicon wafer surface. Reflectance was controllable from 3% to 20% in crystalline silicon depending on the texture shape and height. We have achieved excellent reflectance below 4% on the weighted average (300~1,100 nm) in multi crystalline silicon using plasma texturing with gas mixture ratio such as $SF_6$, $Cl_2$, and $O_2$. The texture shape and height on the silicon wafer surface have an effect on gas chemistry, etching time, RF frequency, and so on. Excellent conversion efficiency of 16.1% is obtained in multi crystalline silicon by RIE process. In order to know the influence of RF frequency with 2 MHz and 13.56 MHz, texturing shape and conversion efficiency are compared and discussed mutually using RIE technology.

Characteristics of Double Texturization by Laser and Reactive Ion Etching for Crystalline Silicon Solar Cell (레이저를 이용한 결정질 실리콘 태양전지의 Double Texturing 제조 및 특성)

  • Kwon, Jun-Young;Han, Kyu-Min;Choi, Sung-Jin;Song, Hee-Eun;Yoo, Jin-Soo;Yoo, Kwon-Jong;Kim, Nam-Soo
    • Korean Journal of Materials Research
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    • v.20 no.12
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    • pp.649-653
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    • 2010
  • In this paper, double texturization of multi crystalline silicon solar cells was studied with laser and reactive ion etching (RIE). In the case of multi crystalline silicon wafers, chemical etching has problems in producing a uniform surface texture. Thus various etching methods such as laser and dry texturization have been studied for multi crystalline silicon wafers. In this study, laser texturization with an Nd:$YVO_4$ green laser was performed first to get the proper hole spacing and $300{\mu}m$ was found to be the most proper value. Laser texturization on crystalline silicon wafers was followed by damage removal in acid solution and RIE to achieve double texturization. This study showed that double texturization on multi crystalline silicon wafers with laser firing and RIE resulted in lower reflectance, higher quantum yield and better efficiency than that process without RIE. However, RIE formed sharp structures on the silicon wafer surfaces, which resulted in 0.8% decrease of fill factor at solar cell characterization. While chemical etching makes it difficult to obtain a uniform surface texture for multi crystalline silicon solar cells, the process of double texturization with laser and RIE yields a uniform surface structure, diminished reflectance, and improved efficiency. This finding lays the foundation for the study of low-cost, high efficiency multi crystalline silicon solar cells.

Reactive Ion Etching Process Integration on Monocrystalline Silicon Solar Cell for Industrial Production

  • Yoo, Chang Youn;Meemongkolkiat, Vichai;Hong, Keunkee;Kim, Jisun;Lee, Eunjoo;Kim, Dong Seop
    • Current Photovoltaic Research
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    • v.5 no.4
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    • pp.105-108
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    • 2017
  • The reactive ion etching (RIE) technology which enables nano-texturatization of surface is applied on monocrystalline silicon solar cell. The additional RIE process on alkalized textured surface further improves the blue response and short circuit current. Such parameter is characterized by surface reflectance and quantum efficiency measurement. By varying the RIE process time and matching the subsequent processes, the absolute efficiency gain of 0.13% is achieved. However, the result indicates potential efficiency gain could be higher due to process integration. The critical etch process time is discussed which minimizes both front surface reflectance and etching damage, considering the challenges of required system throughput in industry.

RIE/WET Texturing 구조의 결정질 태양전지의 입사각에 따른 양자효율

  • Seo, Il-Won;Son, Chan-Hui;Kim, Dong-Hae;Yun, Myeong-Su;No, Jun-Hyeong;Gang, Jeong-Uk;Jo, Gwang-Seop;Gwon, Gi-Cheong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.599-599
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    • 2012
  • 태양광 발전은 태양광의 입사각과 셀 단면이 이루는각도에 따라 출력특성이 변화된다. 따라서 태양의 위치에 따른 출력특성이 바뀌며 이에 의해 발전가능 시간이 변화된다. 더욱이 건재 일체형(BIPV)의 경우 설치 방향을 조절 할 수 없으므로 입사각에 따른 출력특성이 더욱 중요하다. 이와 따라 결정질 태양전지의 입사각에 따른 광학 특성 변화는 태양전지 표면에 형성되는 Texture의 영향을 받는다. 일반적으로 습식 texturing 방법으로는 화학적인 반응을 이용한 WET 공정, 그리고 건식 texturing 방법으로는 플라즈마를 이용한 reactive ion etching (RIE) 공정이 사용된다. 본 연구에서는 RIE, WET 공정을 사용하여 만든 texturing 구조의 결정질 태양전지를 SEM 장비를 이용하여 표면의 형상을 분석하고, 광 입사각에 따른 양자효율의 특성에 대하여 분석하였다.

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Black Silicon of Pyramid Structure Formation According to the RIE Process Condition (RIE 공정 조건에 의한 피라미드 구조의 블랙 실리콘 형성)

  • Jo, Jun-Hwan;Kong, Dae-Young;Cho, Chan-Seob;Kim, Bong-Hwan;Bae, Young-Ho;Lee, Jong-Hyun
    • Journal of Sensor Science and Technology
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    • v.20 no.3
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    • pp.207-212
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    • 2011
  • In this study, pyramid structured black silicon process was developed in order to overcome disadvantages of using wet etching to texture the surface of single crystalline silicon and using grass/needle-like black silicon structure. In order to form the pyramidal black silicon structure on the silicon surface, the RIE system was modified to equip with metal-mesh on the top of head shower. The process conditions were : $SF_6/O_2$ gas flow 15/15 sccm, RF power of 200 W, pressure at 50 mTorr ~ 200 mTorr, and temperature at $5^{\circ}C$. The pressure did not affect the pyramid structure significantly. Increasing processing time increased the size of the pyramid, however, the size remained constant at 1 ${\mu}M$ ~ 2 ${\mu}M$ between 15 minutes ~ 20 minutes of processing. Pyramid structure of 1 ${\mu}M$ in size showed to have the lowest reflectivity of 7 % ~ 10 %. Also, the pyramid structure black silicon is more appropriate than the grass/needle-like black silicon when creating solar cells.