• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1992-1994
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• 2005

In this study, Bragg reflector was formed as tungsten(W) and $SiO_2$ deposited by RF magnetron sputtering according to variable conditions of RF power and working pressure to apply to the SMR type FBAR device, one of the next generation mobile communication devices. The micro-structural properties such as a crystal orientation, roughness and micro- structure were measured by XRD, AFM and SEM and the best condition of Bragg reflector was elicited with analyzing that results of the thin films about each conditions. Finally, FBAR device was fabricated with applying the Bragg reflector was formed on the best condition and measured the resonance properties and compared other research and considered it.

• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.169-170
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• 2000

The conventional AC PDP has a relatively low efficiency which is close to 1.5 lm/W. If the AC sustain period is replaced by the RF sustain period, due to oscillating and low electric field, almost 60% of the supplied energy is spent by Xe excitation [1]. The efficiency of RF PDP can be $4{\sim}5$ times higher than that of AC PDP. In this paper, we will present the RF PDP that is a new type of PDP. A new display method in PDP using RF pulses is suggested and applied on a 4-inch-diagonal Panel (hereinafter 4" panel). Even though there were many researches in RF discharge, there was not enough research for display application. Now we propose the RF PDP that is a new display field and we will expect to do more research in this field.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2010.11a
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• pp.781-783
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• 2010

Chonbuk national university High-enthalpy plasma research center is under construction for 60kW and 200kw ICP(RF) Plasma system as Advance Material R&D and production equipment. The 60kW & 200kW ICP(RF) plasma systems will contribute to promote Korea's material industrial development and Thermal plasma technology.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.612-614
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• 1993

Sputtering requires a way to bombard the target with sufficient momentum. Positive ions are the most convenient source since their energy and momentum can be controlled by applying a potential to the target. Although many types of discharges have been used for sputtering, magnetrons are now the most widely used because of the high ion current densities. Namely, plasma near the target electrode is confined by magnetic field using permanent magnet, so that the collision probability is increased. It is important to develop RF magnetron sputtering system which has many excellent merits compared with conventional methods. Our study aims to develop 1 kW RF source(13.56 MHz, TR type) and to accumulate the design and construction technology of RF magnetron sputter-deposition system. We developed 1 kW RF sputtering system to deposit thin film. These films are deposited by this RF source matched by auto-matching system using primarily argon gas. Target of Au, Ni, Al, and $SiO_2$ was well deposited on the argon pressure of 5-10 mTorr.

• Journal of IKEEE
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• v.7 no.2 s.13
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• pp.172-180
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• 2003

Based on simulation results and accompanying analysis, we suggest a thyristor-type ESD protection device structure suitable for implementation in standard CMOS processes to reduce the parasitic capacitances added to the input nodes, which is very important in CMOS RF ICs. We compare DC breakdown characteristics of the suggested device to those of a conventional NMOS protection device to show the benefits of using the suggested device for ESD protection. The characteristic improvements are demonstrated and the corresponding mechanisms are explained based on simulations. Structure dependencies are also examined to define the optimal structure. AC simulation results are introduced to estimate the magnitude of reduction in the added parasitic capacitance when using the suggested device for ESD protection. The analysis shows a possibility of reducing the added parasitic capacitance down to about 1/40 of that resulting with a conventional NMOS protection transistor, while maintaining robustness against ESD.

• IEIE Transactions on Smart Processing and Computing
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• v.6 no.4
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• pp.299-304
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• 2017

A wireless passive sensor network is a network consisting of sink nodes, sensor nodes, and radio frequency (RF) sources, where an RF source transfers energy to sensor nodes by radiating RF waves, and a sensor node transmits data by consuming the received energy. Against theoretical expectations, a wireless passive sensor network suffers from many practical difficulties: scarcity of energy, non-simultaneity of energy reception and data transmission, and inefficiency in allocating time resources. Perceiving such difficulties, we propose a simple contending-type medium access control (MAC) scheme for many sensor nodes to deliver packets to a sink node. Then, we derive an approximate expression for the network-wide throughput attained by the proposed MAC scheme. Also, we present an approximate expression for the optimal partition, which maximizes the saturated network-wide throughput. Numerical examples confirm that each of the approximate expressions yields a highly precise value for network-wide throughput and finds an exactly optimal partition.

• Journal of the Korean institute of surface engineering
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• v.39 no.3
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• pp.142-146
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• 2006

A novel internal-type linear inductive antenna, which we refer to as a double comb-type antenna, was developed for a large-area plasma source with substrate size of $880\;mm{\times}660\;mm$ ($4^{th}$ generation glass size). In this study, effect of plasma confinement by applying multi-polar magnetic field was investigated. High density plasmas of the order of $3.18{\times}10^{11}\;cm^{-3}$ could be obtained with a pressure of 15 mTorr Ar at an inductive power of 5000 W with good plasma stability. This plasma density is higher than that obtained for the conventional double comb-type antenna, possibly due to the plasma confinement, low rf voltage, resulting in high power transfer efficiency. Also, due to the remarkable reduction in the antenna rf voltage and length, a plasma uniformity of less than 3% could be obtained within a substrate area of $880\;mm{\times}660\;mm$ as rf power increased.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.144-145
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• 2006

ZnO is a promising material to make high efficiency violet or blue light emitting diodes (LEDs) for its large binding energy (60meV) and big bandgap. But the high quality p-type conduction of ZnO is a dilemma to achieve LEDs with it. In present study, we presented a reliable method to prepare ZnO thin films on (100)silicon substrates by RF magnetron sputtering in the mixture ambient of $N_2$ and $O_2$, accompanying with low pressure annealing in the sputtering chamber in $O_2$ at $600^{\circ}C$ and $800^{\circ}C$ respectively. X-ray diffraction and Hail effect with Van der Paul method were performed to test ZnO films. Seeback effect was also carried out to identify carrier types in ZnO films and showed the N-doped ZnO film annealed at $800^{\circ}C$ had achieved p-type conduction.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.91-91
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• 2008

ZnO는 넓은 밴드갭(3.37eV)과 큰 엑시톤(exciton) 결합에너지(60meV) 를 가지는 II-VI족 산합물 반도체로, 상온에서도 높은 재결합 효율이 기대되는 엑시톤 전이가 가능하여 자발적인 발광특성 및 레이저 발진을 위한 낮은 임계전압을 보여주는 장점을 가지고 있다. 이러한 특성을 이용해, 최근 ZnO 박막을 이용한 LED 및 LD 소자 제작에 대한 연구가 국내외적으로 매우 활발하게 이루어지고 있다. 하지만 아직까지 p-type ZnO는 전기적 특성 및 재현성 문제를 극복하지 못하고 있기 때문에 ZnO를 이용한 동종접합구조를 이용한 소자제작은 어려움이 따른다. 이런 문제점을 극복하기 위해 최근 p-type 물질을 ZnO와 결정구조 및 특성이 거의 유사한 GaN를 많이 이용하고 있다. 또한 RF 스퍼터링법을 이용해 박막을 성장할 경우 성장조건 및 불순물 도핑 등에 따라 성장되는 n-type ZnO의 전기적 특성 및 밴드갭을 조절할 수 있다. 본 연구에서는 RF 스퍼터링법을 이용해 p-type GaN 기판위에 n-type ZnO를 성장한 이종접합구조를 이용해 발광 다이오드를 제작하고 그에 대한 특성 평가를 하였다. 이때 성장시킨 n-type ZnO는 여러 가지 성장 변수 및 불순물 도핑으로 전기전 특성 변화 및 밴드갭 조절을 통해 발광특성 변화에 대해 특성 평가를 하였다.

• Transactions on Electrical and Electronic Materials
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• v.10 no.1
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• pp.24-27
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• 2009

N-doped ZnO thin films were deposited on n-type Si(100) and homo-buffer layer, and undoped ZnO thin film was also deposited on homo-buffer layer by RF magnetron sputtering method. After deposition, all films were in-situ annealed at $800^{\circ}C$ for 5 minutes in ambient of $O_2$ with pressure of 10Torr. X -ray diffraction shows that the homo-buffer layer is beneficial to the crystalline of N-doped ZnO thin films and all films have preferable c-axis orientation. Atomic force microscopy shows that undoped ZnO thin film grown on homo-buffer layer has an evident improvement of smoothness compared with N-dope ZnO thin films. Hall-effect measurements show that all ZnO films annealed at $800^{\circ}C$ possess p-type conductivities. The undoped ZnO film has the highest carrier concentration of $1.145{\times}10^{17}cm{-3}$. The photoluminescence spectra show the emissions related to FE, DAP and many defects such as $V_{Zn}$, $Zn_O$, $O_i$ and $O_{Zn}$. The p-type defects ($O_i$, $V_{Zn}$, and $O_{Zn}$) are dominant. The undoped ZnO thin film has a better p-type conductivity compared with N-doped ZnO thin film.