• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.197-198
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• 2005

본 논문에서는 p-type (100)Si. (100)MgO 그리고 MgO/Si 기판 위에 RF Magnetron sputtering 법으로 $Ba_{0.5}Sr_{0.5}TiO_3$(BST) 박막을 증착 후 $600^{\circ}C$ 의 질소분위에서 RTA(Rapid Thermal Annealing)를 이용한 1 분간의 고온 급속열처리를 하였다. XRD 측정결과 모든 기판에서 (110) $Ba_{0.5}Sr_{0.5}TiO_3$의 주피크가 관찰되어졌고, 열처리 후 피크 세기가 증가함을 확인할 수 있었다. C-V 특성에서 각각의 기판에서 측정된 커패시턴스 값으로 계산된 유전율은 120(bare Si), 305(MgO/Si) 그리고 310(MgO)이었다. 누설 전류 특성에서는 150KV/cm이내의 인가전계에서 0.1$uA/cm^2$이하의 안정된 누설전류값을 보여주었다. 결론적으로 MgO 버퍼층을 이용한 기판이 BST 박막의 증착을 위한 기판으로써 효과적임을 알 수 있었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.150-151
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• 2006

$Si_{0.88}Ge_{0.12}$/Si heterostructure channels grown by RPCVD were employed to n-type metal oxide semiconductor field effect transistors(MOSFETs), and their electrical properties were investigated. SiGe nMOSFETs presented very high transconductance compared to conventional Si-bulk MOSFETs, regardless substantial drawbacks remaining in subthreshold-slope, $I_{off}$, and leakage current level. It looks worthwhile to utilize excellent transconductance properties into rf applications requesting high speed and amplification capability, although optimization works on both device structure and unit processes are necessary for enhanced isolation and reduced power dissipation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.6
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• pp.480-485
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• 2011

ZnO is an n-type semiconductor with a wide band gap near 3.37 eV. It was known that ZnO films with a resistivity of the order of $10^{-4}\;{\Omega}cm$ is not easy to obtain. 1, 3, and 5wt% Si element were added into ZnO in ordre to improve the electrical and optical characteristics. The Si-doped ZnO (SZO) was grown on a glass substrate by radio frequency (RF) magnetron sputtering at the temperature range from 100 to $500^{\circ}C$. X-ray diffraction (XRD) patterns of SZO film showed preferable crystal orientation of (002) plane. It was confirmed that the lowest resistivity of the SZO films was $2.44{\times}10^{-3}{\Omega}cm$ and SZO films were significantly influenced by the working temperature. The average transmittance of the films was over 80% in the visible ranges.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.127-127
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• 2000

다이아몬드상 카본(Diamond-like Carbon, DLC) 필름은 비정질 재료로서 다이아몬드와 유사한 높은 경도, 내마모성, 화학적 안정성, 그리고 광학적 특성을 가지고 있으며, 낮은 마찰계수와 높은 탄성률 등으로 인해 많은 분야에서 응용이 연구되고 있는 재료이다. 그러나 DLC 필름이 이러한 우수한 특성이 가지고 있음에도 불구하고 수 GPa에 이르는 높은 압축 잔류 응력으로 인해 응용에 제약을 받고 있다. 이러한 압축 잔류 응력이 상당한 값에 이르게 되면 기판의 구속에서 벗어나게 되어, 기판으로부터 떨어지게 되고 굽힘을 받게 되는 delamination buckling 현상이 일어나기도 한다. 본 연구에서는 높은 잔류 응력으로 인해 자연적으로 발생하는 buckling 현상과 식각 과정을 통해 인위적으로 기판의 제한으로부터 필름을 완화시키는 freehang 방법을 이용하여 필름이 기판에 접착되는데 필요한 에너지를 평가하려고 한다. 본 실험에서는 rf-PACVD 장비를 이용하여 필름을 증착하였다. 이때 전극과 플라즈마 사이의 바이어스 음전압은 -100~700 Vb로 변화를 주었으며, 합성압력은 9mTorr로 고정하였다. 사용한 반응 가스는 메탄(CH4)이고, 아르곤(Ar)을 이용하여 모든 실험에서 동일하게 기판을 전처리 하였다. buckling 현상을 관찰하기 위해 사용된 기판은 slide glass이고, freehang을 제작하기 위해 사용된 기판은 (100) p-type Si wafer 이다. freehang 제작시 사용한 식각 용액은 KOH(5.6mol)이며 외부 요인을 제거하기 위해 7$0^{\circ}C$ 항온조를 사용하였다. Buckling 된 필름과 freehang은 광학 현미경과 전자 주사 현미경에 의해 관찰되었으며, 사인 함수 형태의 곡면을 가지고 있었다. 또한 freehang 제작시 각각의 주기와 진폭을 통해, 필름과 기판사이의 계면에너지와 buckling 되면서 새로 생성된 두 표면에너지 차이를 구할 수 있게 되고, 이를 통해 접착에너지를 평가할 수 있었다.

• Journal of IKEEE
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• v.23 no.2
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• pp.474-478
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• 2019

In this paper, we analyze the degradation of receiving sensitivity due to the coupling between digital noise and mobile handset antenna using characteristic mode. First, we analyze the coupling mechanism between the antenna and digital noise, and analyze the role of the decoupling capacitor of the ground signal line, which is one of the ways to improve the antenna receiving sensitivity degradation due to camera noise. For the analysis, the digital signal line and the ground line of the FPCB of the camera module are modeled as a loop type feeder that excites the characteristic mode of the PCB ground, and improved model which has a ground line with a capacitor are analyzed.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.75-78
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• 2017

The $CO_2$ gas responsibility of $SnO_2$ thin films was researched with various annealing temperatures. $SnO_2$ was prepared on n-type Si substrate by RF magnetron sputtering system and annealed in a vacuum condition. The bonding structure of $SnO_2$ was changed from amorphous to crystal structure with increasing the annealing temperature, and the content of oxygen vacancy was researched the highest of the annealed at $60^{\circ}C$. The $SnO_2$ annealed at $60^{\circ}C$ had the characteristics of the highest capacitance. The special properties of $CO_2$ gas responsibility was found at the $SnO_2$ thin film annealed at $60^{\circ}C$ with amorphous structure because of the combination with the oxygen vacancies and $CO_2$ gases changed the resistivity. The amorphous structure enhanced the responsibility at the $SnO_2$ surface and the conductivity of $SnO_2$ thin film.

• Journal of IKEEE
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• v.23 no.3
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• pp.873-877
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• 2019

In this paper, we analyze the degree of digital noise coupling for Inverted F Antenna (IFA) and Loop Antenna, which are representative types of portable terminal antenna, using characteristic mode. Firstly, the degree of coupling according to the direction of digital signal lines and characteristic mode current of the printed circuit board (PCB) including the antenna is compared and analyzed, and based on this result, the coupling between WiFi antenna and the front camera noise is analyzed. For analysis, the digital signal line and ground line of the FPCB of the camera module are modeled as a loop feeder that excites the characteristic mode of the PCB ground and the change of noise coupling according to the antenna types are analyzed.

• Journal of the Semiconductor & Display Technology
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• v.20 no.3
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• pp.32-38
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• 2021

We developed an inductively coupled plasma (ICP) etcher for GaN etching using a parallel plasma electrode source with a multifunctional chuck matched to it in order for the low power consumption and low process cost in comparison with the conventional ICP system with a helical-type plasma electrode source. The optimization process condition using it for the micro light-emitting diode (µ-LED) chip fabrication was established, which is an ICP RF power of 300 W, a chuck power of 200 W, a BCl₃/Cl₂ gas ratio of 3:2. Under this condition, the mesa structure with the etch depth over 1 ㎛ and the etch angle over 75° and also with no etching residue was obtained for the µ-LED chip. The developed ICP showed the improved values on the process pressure, the etch selectivity, the etch depth uniformity, the etch angle profile and the substrate temperature uniformity in comparison with the commercial ICP. The µ-LED chip fabricated using the developed ICP showed the similar or improved characteristics in the L-I-V measurements compared with the one fabricated using the conventional ICP method

• Korean Journal of Metals and Materials
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• v.47 no.12
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• pp.860-865
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• 2009

The effect of Co additive on the electrical properties of Fe-Si alloys prepared by a RF inductive furnace was investigated. The electrical conductivity and Seebeck coefficient were measured as a function of the temperature under an Ar atmosphere to evaluate their applicability to thermoelectric energy conversion. The electrical conductivity of the specimens increased as the temperature increased, showing typical semiconducting behavior. The electrical conductivity of Co-doped specimens was higher than that of undoped specimens and increased slightly as the amount of Co additive increased. This is most likely due to the difference in the carrier concentration and the amount of residual metallic phase ${\varepsilon}$-FeSi (The ${\varepsilon}$-FeSi was detected in spite of an annealing treatment of 100 h at $830^{\circ}C$). Additionally, metallic conduction increased slightly as the amount of Co additive increased. On the other hand, Co-doped specimens showed a lower Seebeck coefficient due to the metallic phase. The power factor of Co-doped specimens was higher than that of undoped specimens. This would be affected more by the electrical conductivity compared to the Seebeck coefficient.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.22 no.5
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• pp.93-97
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• 2022

Infrared scenes usually contain also spectral information which cannot be resolved using normal single-band infrared cameras. Multispectral infrared imaging cameras give access to the comprehensive information contained within infrared scenes. A Dual-band infrared Camera, a type of multispectral infrared imaging cameras, has the advantage of simple system. A Dual-band Infrared Camera gives access to the spectral information as wells as the temperature information within infrared scenes. Multispectral imaging generally increases the detection and identification performance of a Dual-band Infrared Camera. This paper describes a design of an infrared Camera using a Dual-band Infrared Detector to simultaneously receive infrared radiation from the medium-wave infrared/long-wave infrared(MWIR/LWIR) bands.