• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.27 no.2
• /
• pp.71-75
• /
• 2014

To observe the optical characteristic of oxide semiconductor depending on the degree of bonding structures, SiOC, ZnO and IGZO were prepared by the RF magnetron sputter system and chemical vapor deposition. Generally, crystal ZnO, amorphous SiOC and IGZO changed the optical characteristics in according to the electro-chemical behavior due to the oxygen vacancy at an interface between different groups. Transmittance of SiOC and IGZO with amorphous structures was higher than that of ZnO with crystal structure, because of lowering the carrier concentration due to the recombination of electron and holes carriers as oxygen vacancies. Besides, the energy gap of amorphous SiOC and IGZO was higher than the energy gap of crystal ZnO. The diffusion mobility of holes is higher than the drift mobility of electrons.

• Applied Science and Convergence Technology
• /
• v.23 no.2
• /
• pp.90-96
• /
• 2014

Flexible $ZrO_2$ films as dielectric materials for high-energy-density capacitors were deposited on polyethylene terephthalate (PET) substrates by RF magnetron sputtering. The growth behavior, microstructure and electrical properties of the flexible $ZrO_2$ films were dependent on the sputtering pressure and gas ratio. Although $ZrO_2$ films were deposited at room temperature, all films showed a tetragonal crystalline structure regardless of the sputtering variables. The surface of the film became a surface with large white particles upon an increase in the $O_2/Ar$ gas ratio. The RMS roughness and crystallite size of the $ZrO_2$ films increased with an increase in the sputtering pressure. The electrical properties of the $ZrO_2$ films were affected by the microstructure and roughness. The $ZrO_2$ films exhibited a dielectric constant of 21~38 at 1 kHz and a leakage current density of $10^{-6}{\sim}10^{-5}A/cm^2$ at 300 kV/cm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2000.07a
• /
• pp.519-522
• /
• 2000

The correlation of surface morphology and magnetic property of NiFe thin films on Si(001) deposited by RF-magnetron sputter has been investigated, using AFM, XRD and MR measurements. During short field annealing for 15 min, there was no significant change in XRD patterns of NiFe thin films. However, the degree of surface roughness was changed with increasing annealing temperature. With variation of surface roughness, there was significant difference in MR characteristics of NiFe thin films. In the case of as-deposited NiFe thin films(T$\_$G/ = 150$^{\circ}C$) and UFA400 (T$\_$A/ = 400$^{\circ}C$) having smooth surface, good linearity of MR Curve was observed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2000.11a
• /
• pp.246-250
• /
• 2000

Reactive radio frequency (RF)magnetron sputter has been used to deposit AlN thin film on a Si substrate. (002)Preferred orientation of AlN thin film has been obtained at low sputtering pressure and high $\textrm{N}_2$ concentration. Also it has been shown that properties of AlN thin film are affected by presputtering time. As presputtering time increased aluminum and nitride concentration of AlN thin film decreased. But oxygen concentration and grain size increased. The good preferred orientation was shown with the short presputtering time.

• Proceedings of the KIEE Conference
• /
• 2006.07c
• /
• pp.1311-1312
• /
• 2006

This paper describes the ohmic contact formation between a TiW film as a contact material deposied by RF magnetron sputter and polycrystalline 3C-SiC films deposied on thermally grown Si wafers. The specific contact resistance (${\rho}_c$) of the TiW contact was measured by using 4he C-TLM. The contact phase and interfacial reaction between TiW and 3C-SiC at high-temperature were also analyzed by XRD and SEM. All of the samples didn't show cracks of the TiW film and any interfacial reaction after annealing. Especially, when the sample was annealed at $800^{\circ}$ for 30min., the lowest contact resistivity of $2.90{\times}10^{-5}{\Omega}{\cdot}cm^2$ of was obtained due to the improved interfacial adhesion.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.06a
• /
• pp.406-407
• /
• 2006

This paper describes the ohmic contact formation between a TiW film as a contact material deposied by RF magnetron sputter and polycrystalline 3C-SiC films deposied on thermally grown Si wafers. The specific contact resistance (${\rho}_c$) of the TiW contact was measured by using the C-TLM. The contact phase and interfacial reaction between TiW and 3C-SiC at high-temperature were also analyzed by XRD and SEM. All of the samples didn't show cracks of the TiW film and any interfacial reaction after annealing. Especially, when the sample was annealed at $800^{\circ}$ for 30min., the lowest contact resistivity of $2.90{\times}10^{-5}{\Omega}cm^2$ was obtained due to the improved interfacial adhesion.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.08a
• /
• pp.306-306
• /
• 2013

p-type Si(100)기판위에 Al2O3 박막을 증착하고 Si/SiO2 박막을 연속 증착하여 태양전지를 제작하였다. Si/SiO2 박막을 연속으로 증착하면 양자 구속이 일어나고 이로 인한 유효밴드 갭이 증가하게 되고, tunnel effect와 계면에서의 passivation 효과를 기대할 수 있다. 이런 효과들을 이용하여 고효율 태양전지를 기대 할 수 있다. 본 연구에서는 Remote Plasma Atomic Layer Deposition(RPALD)를 이용하여 Al2O3를 증착하였고 RF-Magnetron Sputter와 e-beam Evaporator 장비를 이용하여 Si/SiO2을 증착하였다. 전극으로는 Ti/Ag와 Al을 이용하였다. Solar simulator 장비를 이용하여 cell의 전기적 특성 평가를 평가하였고(Fig. 1) QE 측정장비를 통해 파장대의 따른 광학적 측정을 하였다(Fig. 2). ellipsometer 장비와 ${\alpha}$-step 장비로 박막과 전극의 두께를 측정하였고 4-point prove 장비를 이용하여 면저항, 저항율을 측정 평가하였다. 또한 I-V, C-V 측정 결과 터널링 현상이 일어나는 것을 확인 하였으며, Si/SiO2 다중 박막을 연속 증착 할수록 cell 효율이 더 좋게 나온다는 것을 확인하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.07b
• /
• pp.932-934
• /
• 2004

Due to the increasing variety and capacity of information and communication media, systems of microwave band communication have branched out extensively. Surface acoustic wave (SAW) devices fabricated FeSiB thin films on quartz substrate were deposited by RF magnetron sputter and by photolithographic processes. This device is with a center frequency 146MHz and the insertion loss as low as -43dB was obtained.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.59 no.3
• /
• pp.588-593
• /
• 2010

Sputter deposition on a Pt counter electrode was studied using radio frequency (RF) plasma as the improvement of incident photon to current conversion efficiency (IPCE) for dye-sensitized solar cells (DSCs). Effects of the sputtering thickness and the incident angle on a Pt counter electrode for DSCs were investigated. Experiments to get the optimal sputtering time for the performance of the DSCs were carried out. And it is found that the optimized sputtering time was 120 seconds, in addition, the incident angles of the substrate was adjusted from $0^{\circ}$ to $60^{\circ}$. The maximum efficiency of 5.37% was obtained at the incident angle of $40^{\circ}$ with an active cell area of $1cm^2$.

• Journal of the Korean Vacuum Society
• /
• v.7 no.3
• /
• pp.237-241
• /
• 1998

The growth orientation and the surface roughness of AIN/Si(111) films grown by radio frequency (RF) reactive magnetron sputtering were investigated using in-situ x-ray scattering technique and atomic force microscopy (AFM). AIN films were initially grown with the <001> preferred growth orientation under most growth conditions. As the film gets thicker, however, the growth orientation changes significantly, especially at high substrate temperature and high RF powers. We attribute the observed behavior to the competition between the surface energy that prefers the <001> growth orientation and the strain energy that randomizes the growth orientation. In addition, we investigated the evolution of the surface morphology during the growth using the x-ray reflectivity measurement.