• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.1
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• pp.8-18
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• 2000

We presented a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. As the frequency of RF system devices increases, the effect of its electrical parasitics in the wireless communication system requires new structure of RF circuit modules because of its needs to be considered of electrical performance for minimization and module mobility. RF circuit modules with BGA packages can provide some advantages such as minimization, shorter circuit routing, and noise improvement by reducing electrical noise affected to analog and digital mixed circuits, etc. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and measured electrical parameters with a TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3${\times}$3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, and self inductance 146pH, whose values were reduced to 34% and 47% of the value of QFP package structure. S11 parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55GHz and the loss of 0.26dB. Routing length of the substrate was reduced to 39.8mm. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.96-99
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• 2000

We presents a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and examined electrical parameters with a HP5475A TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3 $\times$ 3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, self inductance 146pH, mutual capacitance 10.9fF and mutual inductance 16.9pH. S parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55㎓ and the loss of 0.26dB. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.

• Proceedings of the IEEK Conference
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• 2000.07b
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• pp.1119-1122
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• 2000

This paper describes on RF circuit simulation technique, especially on a RF modeling and a model extraction of a LDMOS(Lateral Diffused MOS) that has gate-width (Wg) dependence. Small-signal model parameters of the LDMOSs with various gate-widths extracted from S-parameter data are applied to make the relation between the RF performances and gate-width. It is proved that a source inductance (Ls) was not applicable to scaling rules. These extracted small-signal model parameters are also utilized to remove extrinsic elements in an extraction of a large-signal model (using HP Root MOSFET Model). Therefore, we can omit an additional measurement to extract extrinsic elements. When the large-signal model with Ls having the above gate-width dependence is applied to a high-power LDMOS module, the simulated performances (Output power, etc.) are in a good agreement with experimental results. It is proved that our extracted model and RF circuit simulation have a good accuracy.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.1
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• pp.13-22
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• 2001

This paper presents three dimensional structure of RF packages and the improvement effect of its electrical characteristics when implementing RF transceivers. We divided RF modules into several subunits following each subunit function based on the partitioning algorithm which suggests a method of three dimension stacking interconnection, PAA(pad area array) interconnection and stacking of three dimensional RF package structures. 224MHz ITS(Intelligent Transportation System) RF module subdivided into subunits of functional blocks of a receiver(RX), a transmitter(TX), a phase locked loop(PLL) and power(PWR) unit, simultaneously meeting the requirements of impedance characteristic and system stability. Each sub­functional unit has its own frequency region of 224MHz, 21.4MHz, and 450KHz~DC. The signal gain of receiver and transmitter unit showed 18.9㏈, 23.9㏈. PLL and PWR modules also provided stable phase locking, constant voltages which agree with design specifications and maximize their characteristics. The RF module of three dimension stacking structure showed $48cm^3$, 76.9％ reduction in volume and 4.8cm, 28.4％ in net length, 41.8$^{\circ}C$, 37% in maximum operating temperature, respectively. We have found that three dimensional PAA package structure is able to produce high speed, high density, low power characteristics and to improve its functional characteristics by subdividing RF modules according to the subunit function and the operating frequency, and the features of physical volume, electrical characteristics, and thermal conditions compared to two dimensional RF circuit modules.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.165-168
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• 2002

Accurate circuit simulation models for embedded RF passive components in LTCC provide a way to efficiently design high performance RF modules. Particularly, consideration of unavoidable parasitic components is required certainly. In this study, the parasitic components which is appeared from 3-D structure is considered.

• Journal of Advanced Navigation Technology
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• v.20 no.6
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• pp.556-561
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• 2016

This paper describes implementation of a 13.56 MHz, 5 kW RF high power generator for ISM band applications. This RF generator consists of four LDMOS modules of 1.25kW class-AB push-pull power amplifier with drive amplifier and its outputs are combined by using Wilkinson type transmission-line transformers. Its generator has a high efficiency and output power better than linearity. In order to discharge power transistor heats, we used on water cooled copper plate. Also, these have a composite circuit of combiner and low-pass filter and safety circuit to detector over and reflected power. The RF generator has achieved a efficiency of 79 % at 5.33 kW of saturated power level experimentally.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1067-1070
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• 2003

In this paper, we present a remote measurement system for the wireless monitoring of ECU Sensor Signals of vehicle. In order to measure the ECU sensor signals, the interface circuit is designed to communicate ECU and designed terminal wirelessly according to the ISO, SAE regulation of communication protocol standard. A micro-controller 80C196KC is used for communicating ECU sensor signals. ECU sensor signals are transmitted to the RF-wireless terminal that was developed using the micro controller 80386EX. LCD, and RF-module. 80386EX software is programmed to monitor the ECU sensor signals using the Borland C++ compiler in which the half duplex method was used for the RS232 communication. The algorithms for measuring the ECU sensor signals are verified to monitor ECU state. At the same time, the information to fix the vehicle's problem can be shown on the developed monitoring software. The possibility for remote measurement of ECU sensor signals using 80386EX is also verified through the developed systems and algorithms.

• Electronics and Telecommunications Trends
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• v.37 no.5
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• pp.11-21
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• 2022

GaN (Gallium-Nitride) is a promising candidate material in various radio frequency applications due to its inherent properties including wide bandgap, high carrier concentration, and high electron mobility/saturation velocity. Notably, AlGaN/GaN heterostructure field effect transistor exhibits high operating voltage and high power-density/power at high frequency. In next-generation radar systems, GaN power transistors and monolithic microwave integrated circuits (MMICs) are significant components of transmitting and receiving modules. In this paper, we introduce technological trends for C-/X-/Ku-band GaN MMICs including power amplifiers, low noise amplifiers and switch MMICs, focusing on the status of GaN MMIC fabrication technology and GaN foundry service. Additionally, we review the research for the localization of C-/X-/Ku-band GaN MMICs using in-house GaN transistor and MMIC fabrication technology. We also discuss the results of C-/X-/Ku-band GaN MMICs developed at Defense Materials and Components Convergence Research Department in ETRI.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.20 no.12
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• pp.2417-2424
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• 2016

Small size and light weight is very important for components used in radar mounted platform such as airborne radar. Recently, the active phased array radar is developed as an array of antennas for thousands of transmit/receive modules to be used as a multi-function radar that can detect and track targets. In this case, the size and weight of the transmit/receive modules are critical factor for developing the radar. In this paper, we developed a compact transmit/receive module using the 10W RF MEMS switch domestically localizing and reduced the circuit area to about 86.5% compared to using a circulator. The developed module satisfies not only electrical requirements but also MIL-STD's environmental specifications. So it can be used in a military device. It can be used at adaptive tunable receivers, reconfigurable smart active antennas and wide band beam electrical steering antennas.

• ETRI Journal
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• v.35 no.3
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• pp.386-396
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• 2013

A 10-Gbit/s wireless communication system operating at a carrier frequency of 300 GHz is presented. The modulation scheme is amplitude shift keying in incoherent mode with a high intermediate frequency (IF) of 30 GHz and a bandwidth of 20 GHz for transmitting a 10-Gbit/s baseband (BB) data signal. A single sideband transmission is implemented using a waveguide-tapered 270-GHz high-pass filter with a lower sideband rejection of around 60 dB. This paper presents an all-electronic design of a terahertz communication system, including the major modules of the BB and IF band as well as the RF modules. The wireless link shows that, aided by a clock and data recovery circuit, it can receive $2^7$-1 pseudorandom binary sequence data without error at up to 10 Gbit/s for over 1.2 m using collimating lenses, where the transmitted power is 10 ${\mu}W$.