• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.25-29
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• 2014

Plasma organic thin film for PCB surface finish is a potential replacement of the conventional PCB finishes because of environment-friendly process, high corrosion-resistance and long shelf life over 1 year. In this study, solder joint properties of the plasma organic surface finish were estimated and compared with OSP surface finish. The plasma surface finish was deposited by chemical vapor deposition from fluorine-based precursors. The thickness of the plasma organic coating was 20 nm. Sn-3.0Ag-0.5Cu (SAC305) solder was used as solder joint materials. From a salt spray test, the plasma organic coating had higher corrosion resistance than the OSP surface finish. The spreadability of SAC305 on plasma organic coating was higher than that on OSP surface finish. SEM and TEM micrographs showed that the interfacial microstructure of the plasma surface finish sample were similar to that of the OSP sample. Solder joint strength of the plasma finish sample was also similar to that of the OSP finished sample.

• Steel and Composite Structures
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• v.17 no.5
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• pp.687-704
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• 2014

A great number of moment-resisting steel structures collapsed due to ductile crack initiation at welded beam-column connections, followed by explosive brittle fracture in the Kobe (Hyogoken-Nanbu) earthquake in 1995. A series of experimental and numerical studies on cracking behaviors of beam-column connections in steel bridge piers were carried out by the authors' team. This paper aims to study the effect of post weld treatment on cracking behaviors of the connections during a strong earthquake event. Experiments of three specimens with different weld finishes, i.e., as-welded, R-finish, and burr grinding, were conducted. The experimental results indicate that the instants of ductile crack initiation are greatly delayed for the specimens with R-finish and burr grinding finishes compared with the as-welded one. The strain concentration effect in the connection is also greatly reduced in the specimens with post weld treatment compared with the as-welded one, which was also verified in the tests.

• The monthly packaging world
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• s.312
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• pp.71-75
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• 2019

• Special Issue of the Society of Naval Architects of Korea
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• 2006.09a
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• pp.40-45
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• 2006

For ships of ice class, finish Maritime Administration(FMA) requires brackets on intersections between longitudinal frames and the web frames within the ice-strengthened area. The main object of this paper is to verify ultimate load carrying capacity of longitudinal frame without brackets of engine room region of 74,100 DWT Product Oil Tanker. Comparative approach between proposed structures from builder (the proposed structure) and structures satisfying the Finnish-Swedish ice class rules (the rule structure) is used for the analysis.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.47-53
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• 2015

The effects of electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the in-situ intermetallics reaction and the electromigration (EM) reliability of Sn-3.0Ag-0.5Cu (SAC305) solder bump were systematically investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of the ENIG surface finish at solder top side, while at the OSP surface finish at solder bottom side,$ Cu_6Sn_5$ and $Cu_3Sn$ IMCs were formed. Mean time to failure on SAC305 solder bump at $130^{\circ}C$ with a current density of $5.0{\times}10^3A/cm^2$ was 78.7 hrs. EM open failure was observed at bottom OSP surface finish by fast consumption of Cu atoms when electrons flow from bottom Cu substrate to solder. In-situ scanning electron microscope analysis showed that IMC growth rate of ENIG surface finish was much lower than that of the OSP surface finish. Therefore, EM reliability of ENIG surface finish was higher than that of OSP surface finish due to its superior barrier stability to IMC reaction.

• Journal of the Korean Society of Clothing and Textiles
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• v.17 no.1
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• pp.151-161
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• 1993

The purpose of this study was to investigate the effect of hydrophilic finish for polyester (PET) fabric and hydrophobic finish for cotton fabric on the water transport and comfort properties. Polyester fabric was treated with 10% sodium hydroxide solution to impart hydrophilicity. Cotton fabric was sprayed with Scotch-gard$^{(R)}$ water and oil repellent finish to impart hydrophobicity. Porosity, air permeability, contact angle, wickability and water vapor transport rate (WVTR) were measured to determine the water transport properties of fabrics. To compare the comfort properties of treated and untreated fabrics, wear test was performed by putting fabric patches on the upper back: stratum corneum water content (SCWC), subjective wettedness and comfort rating were determined. The results were as follows: (1) The contact angle of water on treated polyester fabric was decreased and that of treated cotton fabric was increased. Also, the wickability of treated polyester fabric was increased and the wickability of cotton fabric was decreased. (2) Although each finish did not change porosity, the water vapor transport rate of treated polyester fabric was increased and that of treated cotton fabric was decreased slightly. (3) The results of stratum corneum water content measurements showed good agreement with the results of the contact angle and the wickability, i.e., the better the liquid water transport properties are, the less the stratum corneum water contents were resulted. (4) The realtionship of subjective wettedness or comfort and stratum corneum water content was independent. Therefore, it was concluded that human perception on the subjective wettedness or the comfort is affected by the skin contact of wet fabric rather than by the stratum corneum water content.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• Journal of the Korea Institute of Building Construction
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• v.10 no.1
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• pp.137-145
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• 2010

The mechanical properties of stone structures are generally characterized according to the strength of the stone used. An ultrasonic velocity method that does not damage cultural heritages is used to measure the strength of stone. However, there is no correction involved for surface roughness and thickness of the stone in the ultrasonic method currently used. In addition, a contact agent such as grease can cause contamination on the surface of a cultural heritage. Accordingly, this study suggests an indirect method of strength estimation formula for stone structures based on the surface roughness of the structure, its thickness, and the type of contact agent. (1) Rock strength estimation formula using ultrasonic velocity method of dabbed finish : $f_{su}=30.51\;Vp^{0.82}(R^2=95)$ (2) Rock strength estimation formula using ultrasonic velocity method of harsh finish : $f_{su}=61.52\;Vp^{0.32}(R^2=92)$.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.51-56
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• 2015

It has been used various pad finish materials to enhance the reliability of solder joint and recently Electroless Ni Electroless Pd Immersion Gold (the following : ENEPIG) pad has been used more than others. This study is about reliability according to being used in commercial Electrolytic Ni pad and ENEPIG pad, and was observed behavior of various Cu contents. After reflow, the inter-metallic compound (IMC) between solder and pad is composed of $Cu_6Sn_5$ (Ni substituted) by using EDS, and in case of ENEPIG, between IMC and Ni layer was observed the dark layer ($Ni_3P$ layer). Additional, it could be controlled the thickness of dark layer according to Cu contents. Investigated the different fracture mode between electrolytic Ni and ENEPIG pad after drop shock test, in case of soft Ni, accelerated stress propagated along the interface between $1^{st}$ IMC and $2^{nd}$ IMC, and in case of ENEPIG pad, accelerated stress propagated along the weaken surface such as dark layer. The unstable interface exists through IMC, pad material and solder bulk by the lattice mismatch, so that the thermal and physical stress due to the continuous exterior impact is transferred to the IMC interface. Therefore, it is strongly requested to control solder morphology, IMC shape and thickness to improve the solder reliability.

• The Journal of Advanced Prosthodontics
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• v.7 no.4
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• pp.271-277
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• 2015

PURPOSE. This study was to evaluate the marginal fit of two CAD-CAM anatomic contour zirconia crown systems compared to lithium disilicate glass-ceramic crowns. MATERIALS AND METHODS. Shoulder and deep chamfer margin were formed on each acrylic resin tooth model of a maxillary first premolar. Two CAD-CAM systems (Prettau$^{(R)}$Zirconia and ZENOSTAR$^{(R)}$ZR translucent) and lithium disilicate glass ceramic (IPS e.max$^{(R)}$press) crowns were made (n=16). Each crown was bonded to stone dies with resin cement (Rely X Unicem). Marginal gap and absolute marginal discrepancy of crowns were measured using a light microscope equipped with a digital camera (Leica DFC295) magnified by a factor of 100. Two-way analysis of variance (ANOVA) and post-hoc Tukey's HSD test were conducted to analyze the significance of crown marginal fit regarding the finish line configuration and the fabrication system. RESULTS. The mean marginal gap of lithium disilicate glass ceramic crowns (IPS e.max$^{(R)}$press) was significantly lower than that of the CAD-CAM anatomic contour zirconia crown system (Prettau$^{(R)}$Zirconia) (P<.05). Both fabrication systems and finish line configurations significantly influenced the absolute marginal discrepancy (P<.05). CONCLUSION. The lithium disilicate glass ceramic crown (IPS e.max$^{(R)}$press) had significantly smaller marginal gap than the CAD-CAM anatomic contour zirconia crown system (Prettau$^{(R)}$Zirconia). In terms of absolute marginal discrepancy, the CAD-CAM anatomic contour zirconia crown system (ZENOSTAR$^{(R)}$ZR translucent) had under-extended margin, whereas the CAD-CAM anatomic contour zirconia crown system (Prettau$^{(R)}$Zirconia) and lithium disilicate glass ceramic crowns (IPS e.max$^{(R)}$press) had overextended margins.