• Journal of the Korean Society for Heat Treatment
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• v.8 no.3
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• pp.213-221
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• 1995

Temperature distribution, transformation and residual stresses generated during the quenching process of carbon steel. It follows many difficulties in the analytical considerations on those quenching process because of the coupling effects on temperature and metallic structures. In this paper one of the basic study on the quenching stresses was carried out for the case of the round steel bar specimen(SM45C) with 40mm both in its diameter and length. The temperature distributions considering strain hysteresis were numerically calculated by finite element technique. In calculating the transient temperature field, the heat flux between water and rod surface was determined from the heat transfer coefficient. The gradient of temperature is almost same to geometric of specimen. At early stage of the quenching process, the abrupt temperature gradient has been shown in the surface of the specimen.

• Korean Journal of Materials Research
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• v.30 no.12
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• pp.693-700
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• 2020

Direct water quenching technique can be used in hot stamping process to obtain higher cooling rate compared to that of the normal die cooling method. In the direct water quenching process, setting proper water flow rate in consideration of material thickness and the size of the area directly cooled in the component is important to ensure uniform microstructure and mechanical properties. In this study, to derive proper water flow rate conditions that can achieve uniform microstructure and mechanical properties, microstructure and hardness distribution in various water flow rate conditions are measured for 3.2 mm thick boron steel sheet. Hardness distribution is uniform under the flow condition of 1.5 L/min or higher. However, due to the lower cooling rate in that area, the lower flow conditions result in a drastic decrease in hardness in some areas in the hot-stamped part, resulting in low martensite fraction. From these results, it is found that the selection of proper water flow rate is an important factor in hot stamping with direct water quenching process to ensure uniform mechanical properties.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.12
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• pp.113-122
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• 2021

Complicated residual stress distributions occur in the vicinity of a deposited region via directed energy deposition (DED) process owing to the rapid heating and cooling cycle of the deposited region and the substrate. The residual stress can cause defects and premature failure in the vicinity of the deposited region. Several heat treatment technologies have been extensively researched and applied on the part deposited by the DED process to relieve the residual stress. The aim of this study was to investigate the residual stress characteristics of a specimen fabricated by DED and a quenching process using thermomechanical analyses. A coupled thermomechanical analysis technique was adopted to predict the residual stress distribution in the vicinity of the deposited region subsequent to the quenching step. The results of the finite element (FE) analyses for the deposition and the cooling measures show that the residual stress in the vicinity of the deposited region significantly increases after the completion of the elastic recovery. The results of the FE analyses for the heating and quenching stages further indicate that the residual stress in the vicinity of the deposited region remarkably increases at the initial stage of quenching. In addition, it is observed that the residual stress for quenching is lesser than that after the elastic recovery, irrespective of the deposited material.

• Current Applied Physics
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• v.18 no.12
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• pp.1592-1599
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• 2018

The present study deals with the effect of dual cathode buffer layer (CBL) on the performance of bilayer of 4,4'-cyclohexylidenebis[N,N-bis(4-methylphenyl)benzenamine] (TAPC) and fullerene (C70)-based organic solar cell (OSC) with low donor concentration. OSC devices with CBLs have been fabricated using thermal vapor deposition technique. We report the use of lithium fluoride (LiF) and molybdenum trioxide ($MoO_3$) as CBLs. The insertion of LiF between C70 and aluminium (Al) electrode enhances the power conversion efficiency (PCE) of device from 1.89% to 2.47% but quenching of photogenerated excitons is observed at interface of C70 and LiF layers. Incorporation of $MoO_3$ between LiF and Al electrode further enhances PCE of device to 3.51%. This has also improved the material quality and device properties, by preventing the formation of gap states and diminishing exciton quenching.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.5 s.248
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• pp.397-404
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• 2006

Effects of surface defect distribution on flame instability during flame-surface interaction are experimentally investigated. To examine chemical quenching phenomenon which is caused by radical adsorption and recombination processes on the surface, thermally grown silicon oxide plates with well-defined defect density were prepared. ion implantation technique was used to control the number of defects, i.e. oxygen vacancies. In an attempt to preferentially remove oxygen atoms from silicon dioxide surface, argon ions with low energy level from 3keV to 5keV were irradiated at the incident angle of $60^{\circ}$. Compositional and structural modification of $SiO_2$ induced by low-energy $Ar^+$ ion irradiation has been characterized by Atomic Force Microscopy (AFM) and X-ray Photoelectron Spectroscopy (XPS). It has been found that as the ion energy is increased, the number of structural defect is also increased and non-stoichiometric condition of $SiO_x({\le}2)$ is enhanced.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.439-442
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• 2001

Chalcogenide glassy semiconductors(CGS) can be obtained by the melt quenching technique. We have investigated the thin film heterostructures : metal-chalcogenide glassy semiconductors, where metal is copper, and chalcogenide glassy semiconductors are glasses of the system As-Se. CU/CGS film heterostructure were produced in the vacuum evaporator by the method of vacuum thermal evaporation. Doped films are very sensitive to external actions, and this property allows developing supersensitive precision sensors of temperature, humidity, illumination, and etc. based on them. Cu/CGS film has shown that resistance strongly depend on the temperature. The ratio of resistance vs. temperature has shown over a 2 k$\Omega$/degree. The slop of temperature and resistance shows linear.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.727-730
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• 2002

Chalcogenide glassy semiconductors(CGS) can be obtained by the melt quenching technique. We have investigated the thin film heterostructures : metal-chalcogenide glassy semiconductors, where metal is copper, and chalcogenide glassy semiconductors are glasses of the system As-Se. Cu/CGS film heterostructure were produced in the vacuum evaporator by the method of vacuum thermal evaporation. Doped films are very sensitive to external actions, and this property allows developing supersensitive precision sensors of temperature, humidity, illumination, and etc. based on them. Cu/CGS film has shown that resistance strongly depend on the temperature. The slop of temperature and resistance shows linear.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 1999.02a
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• pp.34-38
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• 1999

An acoustic emission(AE) technique has been used to monitor and diagnose quenching phenomenon in racetrack shaped superconducting magnets at cryogenic environment of 4.2K. The ultimate goal is to ensure the safety and reliability of large superconducting magnet systems by being able to identity and locate the sources of quench in superconducting magnets. The characteristics of AE parameters have been analyzed by correlating with quench number, winding tension of superconducting coil and charge rate by transport current. It was found in this study stat there was good correlation between quench current and AE parameters. The source location of quenching in superconducting magnet was also discussed on the correlation between magnet voltage and AE energy.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1995.06a
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• pp.25-34
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• 1995

Large-scale low-alloy steel shafts, used in the manufacture of steam turbine, are produced by ingot making, forging and heat treatemtn processes. The numerical analysis techniques are introduced to analyze and design the working conditions in each process. The solidification of a steel ingot is studied through the finite element method. The open die press forging and quenching process are simulated by viscoplastic and elastic-plastic finite element method, respectively. Thus numerical analysis techniques are very useful tools to study favorable working conditions for better and more desirable product quality.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.4
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• pp.78-84
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• 2001

This study deals with the heat-treatment technique of SM45C steel with respect to less of deformation in control. The whole process for the production of landing gear must go through with uniformally controlled heat treatment, where as most deformation usually occur in nonuniform cooling environment. When a heated metal is submerged into a certain quenchant, the rate of cooling rapidity can be measured rather slow during the early stage of the procedure due to an Occurrence of a vapor blanked. As the additional course of cooling action is applied and the vapor from a vapor blanked is destroyed simultaneously, the speed of cooling promptness can be considered rather swift. The object of this study is to control the certain deformations as in the procedure of a heat treatment for landing gear by analyzing and improving the conditions of different substance of quenching liquids. Several noticeable curves indicating the temperature variation on the ap-plied metals during the cooling procedures, along with detectable rates of water verses oil and that of different polymer solutions are illustrated.