• 한국전기전자재료학회논문지
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• 제24권2호
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• pp.89-94
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• 2011

The cause of the thickness non-uniformity in the large area deposition of $SiO_2$ films by PECVD(Plasma Enhanced Chemical Vapor Deposition) was investigated by the plasma diagnostics. The spatial distribution of the plasma species in the chamber was obtained with DLP(Double Langmuir Probe) and the new-designed probe-type QMS(Quadrupole Mass Spectrometer). From the relationship between the spatial distribution of the plasma species and the depositing rate of the $SiO_2$ films, it was conformed that the non-uniform deposition of $SiO_2$ films was related with the spatial distribution of the oxygen radical density and electron temperature.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1997년도 춘계학술대회 논문집
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• pp.285-288
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• 1997

Generally the high dielectric films, such as PZT(Pb(Z $r^{1-x}$ $Ti_{x}$ ) $O_3$) and BST(B $a_{l-x}$S $r_{x}$ Ti $O_3$) have been formed on the Pt thin films. However it is generally known that the dry etching of Pt is difficult because of its chemical stability. So, the dry etching of Pt remains at the preliminary work. Therefore, in this study, Pt etching mechanism was investigated with Ar/C $l_2$gas plasma by using XPS(X-ray photoelectron spectroscopy) and QMS(Quadrupole mass spectrometry). Ion current density was measured with Ar/C $l_2$gas plasma by using single Langmuir probe. XPS results shoved that the atomic % of Cl element on the etched Pt sample increased with increasing Ar/(Ar+C $l_2$). And QMS results showed that the increase of Ar partial pressure in the plasma resulted in the improvement of C $l_2$dissociation and Cl redical formation and simultaniously the increase of ion bombardment effects.s.s.

• 한국전기전자재료학회논문지
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• 제21권8호
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• pp.727-732
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• 2008

In this work, the etch characteristics of $VO_2$ thin films were investigated using inductively coupled plasma (ICP) of $Cl_2/Ar$ gas mixtures. To analyze the plasma characteristics, a quadrupole mass spectrometer (QMS), an optical emission spectroscopy (OES), and a Langmuir probe measuring system were used. The surface reaction of the $VO_2$ thin films was investigated using X-ray photoelectron spectroscopy (XPS). It was found that an increase in Ar fraction in the $Cl_2/Ar$ plasma at fixed gas pressure, input power, and bias power resulted in increasing $VO_2$ etch rate which reached a maximum value of 87.6 nm/min at 70-75 % Ar. It was confirmed that the etch rate of the $VO_2$ films was mainly controlled by the ion flux. On the basis of measuring results, we will discuss possible etching mechanism of $VO_2$ film in the $Cl_2/Ar$ plasma.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.40-40
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• 2010

사중극 질량 분석기(Quadrupole Mass Spectrometer, QMS)는 높은 정확도와 사용이 쉬운 장점으로 인해 반도체 및 디스플레이 산업 등의 진공공정에서 잔류가스를 측정하고 분석하는 기기로써 반도체 및 디스플레이 소자제조를 위한 공정 진단에서 많이 사용되고 있다. 특히 고진공으로 내려가면서 리크 디텍션(leak detection)과 미세 량의 잔류기체 감지가 더욱더 요구되며 특히 $H_2$ 및 CO의 경우 측정에 많은 어려움이 있다. 따라서 $H_2$ 및 CO의 미세 량을 감지하기 위하여 QMS의 성능을 평가할 수 있는 parameter 중 하나가 될 수 있는 minimum detectable partial pressure(MDPP)를 측정하였다. 실제 고진공에 도달하여 MDPP를 계산하기 위해서는 bake out이 필요하며 또한 가스가 주입되지 않은 상태에서 잔류기체의 조성을 정확히 알 수 없기 때문에 정량적 분석이 어렵다는 단점이 있다. 본 실험에서는 측정하고자 하는 물질의 소량 포함된 표준가스를 사용하여 부피확장방법으로 가스 챔버로 희석하여 이동시키고 핀홀에서 가스유량을 더 줄여서 QMS가 기체를 감지하는 압력범위를 유지하면서 가스를 인가하여 주어 그때의 MDPP를 계산하였다. 또한 tuning을 통해 이온전류를 증폭시켜 더 향상된 MDPP를 측정하였다. 이 방법을 사용하면 bake out을 통한 고진공에 도달하지 않고서도 MDPP를 측정할 수 있으며, 정확한 조성 및 부분압을 알 수 있고 또한 희석된 가스를 사용하여 MDPP를 더욱 더 향상시킬 수 있다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.168-168
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• 2011

사중극 질량분석기(Quadrupole Mass Spectrometer, QMS)에서 사용하여 이온소스의 신뢰성을 평가하는 방법으로 약 50 ppm으로 $H_2$ 가스를 Ar 가스에 희석한 혼합기체를 주입하여 MDPP(Minimum Detectable Partial Pressure)를 측정하는 기술을 연구하였다. 수소 이온의 전류와 배경 노이즈의 비율(Signal/Noise)을 극대화하기 위하여 QMS를 튜닝하였고, 튜닝을 여러 번 반복한 결과 약 1 order 이내에서 repeatability를 얻을 수 있었다. 이 MDPP 평가방법을 이용하여 상용 이온소스와 한국표준과학연구원에서 기존 이온소스를 개선한 두 가지 다른 타입의 이온소스를 평가 비교하였고, 이 평가는 진공 챔버를 $2{\times}10^{-9}$ Torr로 배기한 뒤, 혼합된 희석기체를 주입하여 ~$10^{-7}$ Torr를 유지한 상태에서 QMS 200의 신호를 증폭시키기 위해 SEM (Secondary Electron Multiplier)을 사용하여 진행되었다. 사용한 혼합 희석기체는 한국표준과학연구원의 가스표준실에서 제조하였으며, 혼합비의 불확도는 수 ppm이다. 이 희석된 혼합가스를 사용하여 MDPP 값을 비교 분석하여 이온소스의 신뢰성 평가 연구를 하였다.

• 한국표면공학회지
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• 제38권2호
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• pp.73-78
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• 2005

A real-time monitoring of ICP(inductively coupled plasma) assisted magnetron sputtering of MgO was carried out using a QMS(quadrupole mass spectrometer), an OES(optical emission spectrometer), and a digital oscilloscope with a high voltage probe and a current monitor. At the time of ICP ignition, the most distinct impurity was OH emission (308.9 nm) which was dissociated from water molecules. For reactive deposition oxygen was added to Ar and the OH emission intensity was reduced abruptly When the discharge voltage was regulated by a PID controller from 240V(metallic mode) to 120V(oxide mode), the emission intensity from Mg (285.2 nm) changed proportionally to the discharge voltage, but the intensity of Ar I(811.6 nm) was constant. At 100V of discharge voltage, Mg sputtering was almost stopped. Emissions from Ar I(420.1 nm) and Mg I were dropped down to 1/10, but Ar I(811.6 nm) didn't change. And the emission from atomic oxygen (O I, 777.3 nm) was increased to 10 times. These results are compatible with those from QMS study.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
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• pp.85-87
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• 2000

In this study, high-density plasma etching characteristics of ITO(indium tin oxide) films used for transparent electrodes in display devices have been investigated. The etch characteristics of ITO as a function of $Ar/CH_4$ gas mixtures were analyzed using QMS(quadrupole mass spectrometry), OES(optical emission spectroscopy), and ESP(electrostatic probe). ITO etch rates were increased with the addition of moderate amount of $CH_4$ to Ar due to the increased chemical reaction between $CH_3$ or H and ITO in addition to the physical sputtering of ITO by Ar ion bombardment. However, the addition of excess amount of $CH_4$ decreased the ITO etch rates possibly due to the increased polymer formation on the ITO surface. Also, the measurement data obtained by QMS and OES suggested that $CH_3$ radicals are more activity involved in the etching of ITO compared to H radicals.

• 대한안전경영과학회지
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• 제13권4호
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• pp.161-169
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• 2011

International Organization for Standardization has recently published ISO 9001:2008 which is the basic requirements for a quality management system that an organization must fulfil to demonstrate its ability to consistently provide products that enhance customer satisfaction and meet applicable statutory and regulatory requirements. Not many empirical researches based on ISO 9001:2008 have been done up until now. In this article we outline transitional features for ISO 9000 quality management system (QMS) since its first publication in 1987. In order to effectively maintain ISO 9001:2008 QMS certification and continuously enhance quality management activities, we perform statistical analysis for the minor nonconformity data generated from follow-up audits for subcontractors of shipbuilding industry based on ISO 9001:2008 requirements. A Kruskal-Wallis test is used to show relationships between the minor nonconformity data and three classification criteria: the type of business, the size of business, and the number of follow-up audits.

• 한국정보시스템학회지:정보시스템연구
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• 제23권2호
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• pp.49-66
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• 2014

In today's competitive business environment it is a necessary condition for a company to produce high-quality product for its survival and growth. That is the case in the auto-part industry as well where the international standards, ISO/TS 16949 certification, are required by customers to adopt mandatory. This study presents a successful implementation of quality management system(QMS) in a major auto-part manufacturer in Korea, utilizing SAP's QM(qualaity management) module and a mobile office system. The QMS brought the company "A" a variety of benefits such as real-time availability of product-inspection data, speedy decision-making, reduction in time required for defect-handling, ease of vertical integration of business partners in supply chain, and ease of business process standardization between headquarters and overseas subsidiaries. It is expected that the findings of this study can be used as a useful guideline for companies to consider implementing ERP-based quality management systems successfully.

• International Journal of Quality Innovation
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• 제7권2호
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• pp.69-82
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• 2006

Organisations worldwide strive to develop their management systems for business functions, ranging from quality and environment to safety, information security and social responsibility. During the latest decade a considerable amount of these efforts has been concentrated on introducing and applying standards such as the ISO 9001 and ISO 14001. The need for Integrated Management Systems (IMS) often arises as a result of decisions to implement Environmental Management System (EMS) and/or an occupational health and safety management system in addition to a Quality Management System (QMS). At the end of 2003, approximately 3200 organisations in Sweden had an ISO 9001 certificate, and approximately 3400 organisations had a certificate based on an EMS. Dealing with separate management systems and ensuring that they align with the organisation's strategies and goals, has proved difficult. Owing to the large number of organisations certified according to multiple types of systems, an increasing number of organisations are establishing IMS. There are examples of companies, which chose to integrate EMS and QMS into a co-ordinated implementation approach, and although sparse, the research within this area indicates potential benefits of using an integrated approach. This paper presents both a theoretical and an empirical investigation with the aim to elucidate problems related to the integration of management systems. Furthermore, the paper will present recommendations for succeeding in such integrations and, hence, contributing to an increased understanding on how IMSs should be designed and implemented.