• Journal of the Korean Society for Heat Treatment
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• v.23 no.1
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• pp.23-28
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• 2010

The cylindrical magnetron sputtering has not been widely used, although this system is useful for only certain types of applications such as fiber coatings. This paper presents electrode configurations which improved the complicacy of the target assembly by using the positive voltage power supply. It is a modified type which has a target constructed with a large cylindrical part, a conical part and a small cylindrical part. When positive voltage was applied to an anode, a stable glow discharge was established and a high deposition rate was obtained. The substrate bias current was monitored to estimate the effect of ion bombardment. As a result, it was found that the substrate current was large. With cylindrical and conical cathode magnetron sputter deposition on the surface of the substrate to prevent re-sputtering, ion impact because it can increase the effectiveness with excellent ductility and adhesion of Ti film deposition can be obtained. We board at the front end of the ground resistance of $5\;k{\Omega}$ attached to the substrate potential can be controlled easily, and Ti film deposition with excellent adhesion can be obtained. Microstructure and morphology of Ti films deposited on pure Cu wires were investigated by scanning electron microscopy in relation to preparation conditions. High level ion bombardment was found to be effective in obtaining a good adhesion for Cu wire coatings.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.47-52
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• 2013

Gold wire has long been used as a proven method of connecting a silicon die to a substrate in wide variety of package types, delivering high yield and productivity. However, with the high price of gold, the semiconductor packaging industry has been implementing an alternate wire material. These materials may include silver (Ag) or copper (Cu) alloys as an alternative to save material cost and maintain electrical performance. This paper will analyze and compare the electrical characteristics of several wire types. For the study, typical 0.6 mil, 0.8 mil and 1.0 mil diameter wires were selected from various alloy types (2N gold, Palladium (Pd) coated/doped copper, 88% and 96% silver) as well as respective pure metallic wires for comparison. Each wire model was validated by comparing it to electromagnetic simulation results and measurement data. Measurements from the implemented test boards were done using a vector network analyzer (VNA) and probe station setup. The test board layout consisted of three parts: 1. Analysis of the diameter, length and material characteristic of each wire; 2. Comparison between a microstrip line and the wire to microstrip line transition; and 3. Analysis of the wire's cross-talk. These areas will be discussed in detail along with all the extracted results from each type the wire.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.496-499
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• 2000

In order to investigate the effect of Ge addition to the Cu Matrix on the microstructure and the critical current density, four kinds of internal tin processed Nb$_3$Sn strands with pure Cu and Cu 0.2, 0.4, 0.6 wt％ Ge alloy were drawn to 0.8 mm diameter. The microstructure and critical current of internal tin processed Nb$_3$Sn wires that were heat treated at temperatures ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$ for 240 h were investigated. The Ge addition to the matrix did not make workability worse. A Ge rich layer in the Cu-Ge matrix suppressed the growth of the Nb$_3$Sn layer and promoted grain coarsening. The greater the Ge content in the matrix, the lower the net Jc result after Nb$_3$Sn reaction heat treatment. There was no significant variation in Jc observed with heat treatment temperature ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$.

• 한국전산유체공학회:학술대회논문집
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• 2008.03b
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• pp.474-478
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• 2008

It has been shown that a nanofluid consisting of nanoparticles dispersed in base fluid has much higher effective thermal conductivity than pure fluid. In this study, four kinds of nanofluids such as multiwalled carbon nanotube (MWCNT) in water, CuO in water, SiO2in water, and CuO in ethylene glycol, are produced. Their thermal conductivities are measured by a transient hot-wire method. The thermal conductivity of water-based MWCNT nanofluid is shown to be increased by up to 11.3% at a volume fraction of 0.01. The measured thermal conductivities of MWCNT nanofluids are higher than those calculated with Hamilton-Crosser's model due to neglecting solid-liquid interaction at the interface. The results show that the thermal conductivity enhancement of nanofluids depends on the thermal conductivities of both particles and the base fluid. Stability of nanofluids is estimated by UV-vis spectrum analysis. Stability of nanofluid depends on the type of base fluid and the suspended particles. Also it can be improved in addition of a surfactant.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1489-1491
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• 1996

The effect of Ag alloy sheath have been investigated in terns of critical current density and mechanical property. Nevertheless the continuous improvement of critical current density($J_c$) of Ag sheathed Bi2223 oxide superconducting wire processed with powder in tube(PIT) method, poor mechanical strength is still considered to be demerits for power application. In this study, we prepared two kinds of Ag- x wt% Cu alloy and pure Ag sheathed Bi2223 superconducting tapes. The hardness and tensile strength of prepared tapes has been measured. Their mechanical propertes were improved by Ag alloying.

• Journal of the Korean Society of Radiology
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• v.13 no.4
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• pp.581-588
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• 2019

MRI is superior when contrasted to help the organization generate artifacts resolution, but also affect the diagnosis and create a image that can not be read. Metal is inserted into the tooth, it is necessary to often be inhibited in imaging by causing the geometric distortion due to the majority and if the difference between the magnetic susceptibility of a ferromagnetic material or paramagnetic reducing them. The purpose of this study is to conduct a metal artefact in accordance with the analysis using a diamagnetic material. The magnetic material include a wire for the orthodontic bracket and a stainless steel was used as a diamagnetic material was used copper, zinc, bismuth. Testing equipment is sequenced using 1.5T, 3T was used was measured using a SE, TSE, GE, EPI. A self-produced phantom material was used for agarose gel (10%) to a uniform signal artifacts causing materials are stainless steel were tested by placing in the center of the phantom and cover inspection of the positive cube diamagnetic material of 10mm each length.After a measurement artefact artifact zone settings area was calculated using the Wand tool After setting the Low Threshold value of 10 in the image obtained by subtracting images, including magnetic material from a pure tool phantom images using Image J. Metal artifacts occur in stainless steel metal artifact reduction was greatest in the image with the bismuth diamagnetic materials of copper and zinc is slightly reduced, but the difference in degree will not greater. The reason for this is thought to be due to hayeotgi offset most of the susceptibility in bismuth diamagnetic susceptibility of most small ferromagnetic. Most came with less artifacts in image of bismuth in both 1.5T and 3T. Sequence-specific artifact reduction was most reduced artifacts from the TSE 1.5T 3T was reduced in the most artifacts from SE. Signal-to-noise ratio was the lowest SNR is low, appears in the implant, the 1.5T was the Implant + Bi Cu and Zn showed similar results to each other. Therefore, the results of artifacts variation of diamagnetic material, magnetic susceptibility (${\chi}$) is the most this shows the reduced aspect lower than the implant artificial metal artifacts criteria in the video using low bismuth susceptibility to low material the more metal artifacts It was found that the decrease. Therefore, based on the study on the increase, the metal artifacts reduction for the whole, as well as dental prosthesis future orthodontic materials in a way that can even reduce the artifact does not appear which has been pointed out as a disadvantage of the solutions of conventional metal artifact It is considered to be material.