• 한국주조공학회지
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• 제33권6호
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• pp.248-253
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• 2013

To add alloying elements into a pure copper melt, the wire-feeding efficiency of cored (alloy containing) wire was evaluated using a commercial, computational fluid-dynamics program. The model design was based on an industrial-scale production line. The variables calculated included wire feed rate, melt temperature, wire diameter, melt flow rate and wire temperature. Efficiency was evaluated after a series of calculations based on the penetration depth of the alloy-wire into the molten copper bath. Of the five variables investigated, the wire feed rate and wire diameter were the most influential factors affecting the feeding efficiency of the cored-wire.

• 대한전기학회논문지
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• 제40권9호
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• pp.908-912
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• 1991

YBaCuO oxide superconductor-shows superconductive at Liquid Nitrogen temperature-must be preparate wire or thin film form for utility. The wiring is possible with heat treatment after appropriate mixture of polymeric binder and YBaCuO oxide superconductor has fabricated. This study, analyzed the characteristics of fabricated superconductor and extruded wire after application to each of a mixed at different rate in the superconductor and compared with an original pure sample. From the result, we knew that the binder component influences superconducting characteristics. The best condition for superconductivity occurred at a criticla temperature of 86.4K (8:2 rate) and at a critical current density of 100.27A/cmy with a binder packing ratio of about 20~25 percent.

• 전기학회논문지
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• 제59권7호
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• pp.1272-1275
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• 2010

The Cu powder was prepared in distilled water. It has a wide range of size distribution. The submicron-sized particles in the Cu powder were removed by using continuous type centrifugal separator. The average particle size after classification was approximately 50nm. The XRD analysis showed that pure Cu phase and oxide phase ($Cu_2O$)weremixedinthepowderpreparedbythismethod.

• 한국정밀공학회지
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• 제29권12호
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• pp.1346-1350
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• 2012

Contact wire is one of the most important components supplying electricity to railroad cars. At the beginning of the research on contact wire, wear problem caused by friction between contact wire and pantograph was considered even more important issue for the failure of contact wire. However, since several fatigue fractures were reported from Shinkansen in Japan, fatigue fracture has become another important issue for the failure of contact wire. Despite of its importance, standard of the fatigue test of contact wire has not been established yet. Thus, fatigue characteristics of contact wire is very difficult issue to evaluate quantitatively. Hence, in this study, test method simulating operating conditions of contact wire by Minsung Kang and etc. is used to evaluate the fatigue characteristics of copper alloy contact wire. Also, test results is compared with the result of Minsung Kang's research on pure copper contact wire.

• 한국재료학회지
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• 제12권12호
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• pp.941-946
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• 2002

Both Cu and Cu-oxide nanopowders have great potential as conductive paste, solid lubricant, effective catalysts and super conducting materials because of their unique properties compared with those of commercial micro-sized ones. In this study, Cu and Cu-oxide nanopowders were prepared by Pulsed Wire Evaporation (PWE) method which has been very useful for producing nanometer-sized metal, alloy and ceramic powders. In this process, the metal wire is explosively converted into ultrafine particles under high electric pulse current (between $10^4$ and $10^{ 6}$ $A/mm^2$) within a micro second time. To prevent full oxidations of Cu powder, the surface of powder has been slightly passivated with thin CuO layer. X-ray diffraction analysis has shown that pure Cu nanopowders were obtained at $N_2$ atmosphere. As the oxygen partial pressure increased in $N_2$ atmosphere, the gradual phase transformation occurred from Cu to $Cu_2$O and finally CuO nanopowders. The spherical Cu nanopowders had a uniform size distribution of about 100nm in diameter. The Cu-oxide nanopowders were less than 70nm with sphere-like shape and their mean particle size was 54nm. Smaller size of Cu-oxide nanopowders compared with that of the Cu nanopowders results from the secondary explosion of Cu nanopowders at oxygen atmosphere. Thin passivated oxygen layer on the Cu surface has been proved by XPS and HRPD.

• 한국분말재료학회지
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• 제9권2호
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• pp.124-132
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• 2002

Nano Cu powders, synthesized by Pulsed Wire Evaporation (PWE) method, have been compacted by Magnetic Pulsed Cojpaction(MPC) method. The microstructure and mechanical properties were analyzed. The optimal condition for proper mechanical properties with nanostructure was found. Both pure nano Cu powders and passivated nano Cu powders were compacted, and the effect of passivated layer on the mechanical properties was investigated. The compacts by MPC, which had ultra-fine and uniform nanostructure, showed higher density of 95% of theoretical density than that of static compaction. The pur and passivated Cu compacted at $300^{\circ}C$ exhibited maximum hardnesses of 248 and 260 Hv, respectively. The wear resistance of those compacts corresponded to the hardness.

• 한국분말재료학회지
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• 제17권6호
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• pp.464-469
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• 2010

The Cu nanofluid in ethylene glycol was prepared by electrical explosion of wire, a novel one-step method. The X-ray diffraction, field emission scanning electron microscope and transmission electron microscope were used to study the properties of Cu nanoparticles. The results showed that the nanoparticles were consisted of pure face-centered cubic structure and near spherical shape with average grain size of 65 nm. Ultraviolet-visible spectroscopy (UV-Vis) confirmed Cu nanoparticles with a single absorbance peak of Cu surface plasmon resonance band at 600 nm. The nanofluid was found to be stable due to high positive zeta potential value, +51 mV. The backscattering level of nanofluid in static stationary was decreased about 2% for 5 days. The thermal conductivity measurement showed that Cu-ethylene glycol nanofluid with low concentration of nanoparticles had higher thermal conductivity than based fluid. The enhancement of thermal conductivity of nanofluid at a volume fraction of 0.1% was approximately 5.2%.

• 한국분말재료학회지
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• 제17권4호
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• pp.276-280
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• 2010

In the present work, ethylene glycol-based (EG) copper oxide nanofluids were synthesized by pulsed wire evaporation method. In order to explode the pure copper wire, high voltage of 23 kV was applied to the both ends of wire and argon/oxygen gas mixture was used as reactant gas. EG-based copper oxide nanofluids with different volume fraction were prepared by controlling explosion number of copper wire. From the transmission electron microscope (TEM) image, it was found that the copper oxide nanoparticles exhibited an average diameter about 100 nm with the oxide layer of 2~3 nm. The synthesized copper oxide consists of CuO/$Cu_2O$ phases and the Brunauer Emmett Teller (BET) surface area was estimated to be $6.86\;m^2\;g^{-1}$. From the analyses of thermal properties, it is suggested that viscosity and thermal conductivity of EG-based copper oxide nanofluids do not show temperature-dependent behavior over the range of 20 to $90^{\circ}C$. On the other hand, the viscosity and thermal conductivity of EG-based copper oxide nanofluids increase with volume fraction due to the active Brownian motion of the nanoparticles, i.e., nanoconvection.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.104-107
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• 2001

In order to investigate the effect of Ge addition to the Cu matrix on the microstructure and the critical current density, four kinds of internal tin processed Nb$_3$Sn strands with pure Cu and Cu 0.2, 0.4, 0.6 wt % Ge alloys were drawn to 0.8 mm diameter. The microstructure and critical current of internal tin processed Nb$_3$Sn wires that were heat treated at temperatures ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$ for 240h were investigated. The Ge addition to the matrix did not make workability worse. A Ge rich layer in the Cu-Ge matrix suppressed the growth of the Nb$_3$Sn layer and promoted grain coarsening. The greater the Ge content in the matrix, the lower the net Jc result after Nb$_3$sn reaction heat treatment. There was no significant variation in Jc observed with heat treatment temperature ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$. The values of AC loss of Ge added wires were decreased to 40 % compare with no addition wire. Low AC loss was due to segregation of Ge rich layer in the Cu-Ge matrix. If Ge added wire with thin Nb filaments were fabricated, slow diffusion rate of Sn would be overcome and decreased AC loss that is weak Point of internal tin method.

• 한국재료학회지
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• 제34권3호
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• pp.170-174
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• 2024

In this study, we report the microstructural evolution and shear strength of an Sn-Sb alloy, used for die attach process as a solder layer of backside metal (BSM). The Sb content in the binary system was less than 1 at%. A chip with the Sn-Sb BSM was attached to a Ag plated Cu lead frame. The microstructure evolution was investigated after die bonding at 330 ℃, die bonding and isothermal heat treatment at 330 ℃ for 5 min and wire bonding at 260 ℃, respectively. At the interface between the chip and lead frame, Ni₃Sn₄ and Ag₃Sn intermetallic compounds (IMCs) layers and pure Sn regions were confirmed after die bonding. When the isothermal heat treatment is conducted, pure Sn regions disappear at the interface because the Sn is consumed to form Ni₃Sn₄ and Ag₃Sn IMCs. After the wire bonding process, the interface is composed of Ni₃Sn₄, Ag₃Sn and (Ag,Cu)₃Sn IMCs. The Sn-Sb BSM had a high maximum shear strength of 78.2 MPa, which is higher than the required specification of 6.2 MPa. In addition, it showed good wetting flow.