• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.357-357
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• 2012

박막트랜지스터의 전극으로 Au, Ag, Mo, ITO와 같은 물질들이 이미 많이 연구되어 왔으며, 투명 Source/Drain 전극을 활용한 물질로는 ITO에 초점이 맞춰져 왔다. 하지만 ITO의 높은 가격과 Indium의 인체 유해한 독성 때문에 ITO를 대체하는 물질에 대해 많은 연구가 진행되고 있다. 그 중 Al이 도핑된 ZnO (AZO) 는 가시광 영역에서 85% 이상의 높은 투과율과 높은 전도성, 낮은 비저항으로 다양한 광전소자의 전극과 윈도우 물질로 많은 응용 가능성을 보여주고 있다. 본 실험에서는 고 품질의 박막성장이 가능하고, 박막의 두께를 세밀하게 조절할 수 있는 Pulsed Laser Deposition (PLD) 을 이용하여 온도변화에 따라 AZO 박막을 성장시키고 구조적, 전기적, 광학적 특성을 조사하였다. 또한 온도변화가 AZO 박막 특성에 미치는 영향을 분석하여 Source/Drain 전극으로 사용하기 위한 조건을 최적화하였고, 실제 투명박막트랜지스터 제작을 통해 소자의 I-V Curve 와 Transfer 특성을 확인하고, Transfer Length Method 방법을 이용하여 투명박막트랜지스터의 접촉저항, 채널 비저항 등을 확인해 보았다. 소결된 타겟으로는 99.99%의 순도를 갖는 ZnO-$Al_2O_3$ (98:2 wt%) 타겟을 이용하였으며, 장비조건으로는 355 nm의 파장대역을 갖는 Nd:YAG 레이저를 사용하였고, 실험변수로는 온도범위 RT, $200^{\circ}C$, $400^{\circ}C$, $600^{\circ}C$에서 실험을 진행하였다. AZO 박막의 구조적, 전기적 특성을 분석하기 위해 각각 X-Ray Diffraction (XRD), Hall measurement 장비를 사용하였으며, 광학적 특성을 분석하기 위한 투과도의 측정은 UV-Visible spectrophotometer 장비를 사용하였다.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.113-117
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• 2020

In this paper, We investigated the effect of heat treatment process using photo-thermal effect in order to improve mechanical properties of nanostructure on polymer films made by nanoimprint process with hybrid resin. Nanostructures which have a low refractive characteristic were fabricated by UV nanoimprint and after that heat treatment was performed using IPL (intense pulsed light) under process condition of 550 V voltage, pulse width 5 ms, frequency 0.5 Hz. The transmittance and mechanical property of fabricated nanostructure films were evaluated to observe changes in the pattern transfer rate and mechanical properties of nanostructures. The transmittance of the nanostructure was measured at 97.6% at 550 nm wavelength. Nanoindentation was performed to identify improved anti-scatch properties. Result was compared by the heat source. In case of post treatment with IPL, hardness was 0.51 GPa and in the case of hotplate was 0.27 GPa, resulting the increase of hardness of 1.8 times. Elastic modulus of IPL treated sample was 5.9GPa and Hotplate treated one was 4GPa, showing the 1.4 time increase.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.151-151
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• 2012

A new plasma process, i.e., the combination of PIII&D and HIPIMS, was developed to implant non-gaseous ions into materials surface. HIPIMS is a special mode of operation of pulsed-DC magnetron sputtering, in which high pulsed DC power exceeding ~1 kW/$cm^2$ of its peak power density is applied to the magnetron sputtering target while the average power density remains manageable to the cooling capacity of the equipment by using a very small duty ratio of operation. Due to the high peak power density applied to the sputtering target, a large fraction of sputtered atoms is ionized. If the negative high voltage pulse applied to the sample stage in PIII&D system is synchronized with the pulsed plasma of sputtered target material by HIPIMS operation, the implantation of non-gaseous ions can be successfully accomplished. The new process has great advantage that thin film deposition and non-gaseous ion implantation along with in-situ film modification can be achieved in a single plasma chamber. Even broader application areas of PIII&D technology are believed to be envisaged by this newly developed process. In one application of non-gaseous plasma immersion ion implantation, Ge ions were implanted into SiO2 thin film at 60 keV to form Ge quantum dots embedded in SiO2 dielectric material. The crystalline Ge quantum dots were shown to be 5~10 nm in size and well dispersed in SiO2 matrix. In another application, Ag ions were implanted into SS-304 substrate to endow the anti-microbial property of the surface. Yet another bio-application was Mg ion implantation into Ti to improve its osteointegration property for bone implants. Catalyst is another promising application field of nongaseous plasma immersion ion implantation because ion implantation results in atomically dispersed catalytic agents with high surface to volume ratio. Pt ions were implanted into the surface of Al2O3 catalytic supporter and its H2 generation property was measured for DME reforming catalyst. In this talk, a newly developed, non-gaseous plasma immersion ion implantation technique and its applications would be shown and discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.465-466
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• 2009

Dye-sensitized Solar Cell (DSC) is a new type of solar cell by using photocatalytic properties of $TiO_2$. The electric potential distribution in DSCs has played a major role in the operation of such cells. $TiO_2$ thin films were deposited on the ITO substrate by Nd:YAG Pulsed Laser Deposition(PLD) at room temperature and post-deposition annealing at $500^{\circ}C$ in flowing $O_2$ atmosphere for 1hour. The structural properties of $TiO_2$ thin films have investigated by X-ray diffraction(XRD). We manufactured DSC unit cells then I-V and efficiency were tested by solar simulator.

• 한국초전도학회:학술대회논문집
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• v.9
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• pp.87-90
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• 1999

We have studied the annealing effects of 570 (SrTiO$_3$) single crystal substrate and the I-V properties of step-edge junctions after Ar ion milling. YBa$_2Cu_3O_7$ (YBCO) thin films are fabricated on the substrates by using pulsed laser deposition (PLD) and photolithography. The surface of Ar ion milled substrate was characterized with atomic force microscope (AFM) and scanning electron microscope (SEM) images. After the substrate was damaged by milling, the critical current density of YBCO thin films deposited on the substrate was lowered. The annealing of the damaged substrate at about 1000 $^{\circ}C$ recovered the critical current density to that before the milling. Futhermore the annealing helped junction formation due to high quality film and increased the yield rate for the fabrication of high quality step-edge junction.

• 한국초전도학회:학술대회논문집
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• v.9
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• pp.147-151
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• 1999

YBCO step-edge Josephson junction were fabricated on sapphire substrates. The steps were formed on R-plane sapphire substrates by using Ar ion milling with PR masks. The step angle was controlled in the wide range from 25$^{\circ}$ to 50$^{\circ}$ by adjusting both the Ar ion incident angle and the photoresist mask rotation angle relative to the incident Ar ion beam. CeO$_2$ buffer layer and in-situ YBa$_2Cu_3O_{7-{\delta}}$ (YBCO) thin films was deposited on the stepped R-plane sapphire substrates by pulsed laser deposition method. The YBCO film thickness was varied to obtain the ratio of film thickness to step height in the range from 0.5 to 1. The step edge junction exhibited RSJ-like behaviors with I$_cR_n$ product of 100 ${\sim}$ 300 ${\mu}$V, critical current density of 10$^3$ ${\sim}$ 10$^5$ A/ cm$^2$ at 77 K.

• 한국초전도학회:학술대회논문집
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• v.10
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• pp.146-150
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• 2000

Two methods have been investigated to fabricate good quality step-edge Josephson junctions on STO, MgO, and LAO single crystal substrates. One is the annealing of substrates at 1050$^{\circ}$C in 1 atmospheric oxygen after Ar-ion milling. The other is the cleaning of step-edge by using Ar ion milling. The step-edge is characterized with atomic force microscope (AFM) images. And YBCO thin films are deposited by using pulsed laser. The I-V properties of step-edge junctions are characterized. The yield rate of step-edge junction is increased by new fabrication methods.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2004.03a
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• pp.271-277
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• 2004

As one of the concepts of the laser/electric hybrid propulsion system, a feasibility study on possibilities of electrostatic acceleration of a laser ablation plasma induced from a solid target was conducted. Energy distributions of accelerated ions were measured by a Faraday cup. A time-of-flight measurement was also conducted for ion velocity measurement. It was found that an average speed of ions from a pure laser ablation in this case was about 20 km/sec for pulse energy of 40 $\mu$J/pulse with pulse width of 250 psec. On the other hand, through an electrostatic field with a + I ,000 V electrode, the speed could be accelerated up to 40 km/sec. It was shown that the electrode with positive potential was more effective than that with negative potential for positive-ion acceleration in laser induced plasma, or pulsed plasma, in which ions were induced with the Coulomb explosion following electrons. In addition, the ion-acceleration or deceleration strongly depended on conditions of pairs of inner diameter and electrodes gap.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.155.2-155.2
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• 2013

Strain-relaxed SiGe layer on Si substrate has numerous potential applications for electronic and opto- electronic devices. SiGe layer must have a high degree of strain relaxation and a low dislocation density. Conventionally, strain-relaxed SiGe on Si has been manufactured using compositionally graded buffers, in which very thick SiGe buffers of several micrometers are grown on a Si substrate with Ge composition increasing from the Si substrate to the surface. In this study, a new plasma process, i.e., the combination of PIII&D and HiPIMS, was adopted to implant Ge ions into Si wafer for direct formation of SiGe layer on Si substrate. Due to the high peak power density applied the Ge sputtering target during HiPIMS operation, a large fraction of sputtered Ge atoms is ionized. If the negative high voltage pulse applied to the sample stage in PIII&D system is synchronized with the pulsed Ge plasma, the ion implantation of Ge ions can be successfully accomplished. The PIII&D system for Ge ion implantation on Si (100) substrate was equipped with 3'-magnetron sputtering guns with Ge and Si target, which were operated with a HiPIMS pulsed-DC power supply. The sample stage with Si substrate was pulse-biased using a separate hard-tube pulser. During the implantation operation, HiPIMS pulse and substrate's negative bias pulse were synchronized at the same frequency of 50 Hz. The pulse voltage applied to the Ge sputtering target was -1200 V and the pulse width was 80 usec. While operating the Ge sputtering gun in HiPIMS mode, a pulse bias of -50 kV was applied to the Si substrate. The pulse width was 50 usec with a 30 usec delay time with respect to the HiPIMS pulse. Ge ion implantation process was performed for 30 min. to achieve approximately 20 % of Ge concentration in Si substrate. Right after Ge ion implantation, ~50 nm thick Si capping layer was deposited to prevent oxidation during subsequent RTA process at $1000^{\circ}C$ in N2 environment. The Ge-implanted Si samples were analyzed using Auger electron spectroscopy, High-resolution X-ray diffractometer, Raman spectroscopy, and Transmission electron microscopy to investigate the depth distribution, the degree of strain relaxation, and the crystalline structure, respectively. The analysis results showed that a strain-relaxed SiGe layer of ~100 nm thickness could be effectively formed on Si substrate by direct Ge ion implantation using the newly-developed PIII&D process for non-gaseous elements.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.200-200
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• 2010

In recent times, metal oxide semiconductors thin films transistor (TFT), such as zinc and indium based oxide TFTs, have attracted considerable attention because of their several advantageous electrical and optical properties. There are many deposition methods for fabrication of ZnO-based materials such as chemical vapor deposition, RF/DC sputtering and pulsed laser deposition. However, these vacuum process require expensive equipment and result in high manufacturing costs. Also, the methods is difficult to fabricate various multicomponent oxide semiconductor. Recently, several groups report solution processed metal oxide TFTs for low cost and non vacuum process. In this study, we have newly developed solution-processed TFTs based on Ti-related multi-component transparent oxide, i. e., InTiO as the active layer. We propose new multicomponent oxide, Titanium indium oxide(TiInO), to fabricate the high performance TFT through the sol-gel method. We investigated the influence of relative compositions of Ti on the electrical properties. Indium nitrate hydrate [$In(NO^3).xH_2O$] and Titanium isobutoxide [$C_{16}H_{36}O_4Ti$] were dissolved in acetylacetone. Then monoethanolamine (MEA) and acetic acid ($CH_3COOH$) were added to the solution. The molar concentration of indium was kept as 0.1 mol concentration and the amount of Ti was varied according to weighting percent (0, 5, 10%). The complex solutions become clear and homogeneous after stirring for 24 hours. Heavily boron (p+) doped Si wafer with 100nm thermally grown $SiO_2$ serve as the gate and gate dielectric of the TFT, respectively. TiInO thin films were deposited using the sol-gel solution by the spin-coating method. After coating, the films annealed in a tube furnace at $500^{\circ}C$ for 1hour under oxygen ambient. The 5% Ti-doped InO TFT had a field-effect mobility $1.15cm^2/V{\cdot}S$, a threshold voltage of 4.73 V, an on/off current ratio grater than $10^7$, and a subthreshold slop of 0.49 V/dec. The 10% Ti-doped InO TFT had a field-effect mobility $1.03\;cm^2/V{\cdot}S$, a threshold voltage of 1.87 V, an on/off current ration grater than $10^7$, and a subthreshold slop of 0.67 V/dec.