• 제목/요약/키워드: Pulse plating

검색결과 68건 처리시간 0.024초

펄스 도금법에 의한 메탄연료 직접 사용을 위한 Cu-Ni-YSZ SOFC 연료극 제조 및 특성평가 (Fabrication and Characterization of Cu-Ni- YSZ SOFC Anodes for Direct Utilization of Methane via Cu pulse plating)

  • 박언우;문환;이종진;현상훈
    • 한국세라믹학회지
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    • 제45권12호
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    • pp.807-814
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    • 2008
  • The Cu-Ni-YSZ cermet anodes for direct use of methane in solid oxide fuel cells have been fabricated by electroplating Cu into the porous Ni-YSZ cermet anode. The uniform distribution of Cu in the Ni-YSZ anode could be obtained via pulse electroplating in the aqueous solution mixture of $CuSO_4{\cdot}5H_{2}O$ and ${H_2}{SO_4}$ for 30 min with 0.05 A of average applied current. The power density ($0.17\;Wcm^{-2}$) of a single cell with a Cu-Ni-YSZ anode was shown to be slightly lower in methane at $700^{\circ}C$, compared with the power density ($0.28\;Wcm^{-2}$) of a single cell with a Ni-YSZ anode. However, the performance of the Ni-YSZ anode-supported single cell was abruptly degraded over 21 h because of carbon deposition, whereas the Cu-Ni-YSZ anode-supported single cell showed the enhanced durability upto 52 h.

레이저에 의한 폴리머상의 무전해 도금 시드 형성 메커니즘 연구 (Study on the Formation Mechanism of Electroless Plating Seeds on Polymer by Laser)

  • 백병만;이제훈;신동식;이건상
    • 한국정밀공학회지
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    • 제29권1호
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    • pp.41-47
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    • 2012
  • The LDS(Laser Direct Structuring) is one of the new direct writing methods to fabricate conductive patterns by energy beam. It uses thermoplastic polymers with an additive compound that serves as plating seed after the activation by laser. The advantages of LDS include the miniaturization of electrical components, design flexibility, and a reduced number of production steps. The purpose of this study is to investigate the fundamental mechanism for LDS and the characteristics of conductive patterns by laser parameters. These results were studied by SEM, EDX, and XPS analysis. We have used a 20W pulse-modulated fiber laser and copper electroless plating to fabricate conductive patterns on polymer. The result showed that electroless copper plating seed caused the laser cracking of additive compound. In particular, the additive compound contained in copper metal oxides atoms will be changed to copper metal elements. Also, the characteristics of conductive patterns were dependent on laser parameter, especially laser fluence.

Effects of Electroplating Current Density and Duty Cycle on Nanocrystal Size and Film Hardness

  • Sun, Yong-Bin
    • 반도체디스플레이기술학회지
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    • 제14권1호
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    • pp.67-71
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    • 2015
  • Pulse electroplating was studied to form nanocrystal structure effectively by changing plating current density and duty cycle. When both of plating current density and duty cycle were decreased from $100mA/cm^2$ and 70% to $50mA/cm^2$ and 30%, the P content in the Ni matrix was increased almost up to the composition of $Ni_3P$ compound and the grain growth after annealing was retarded as well. The as-plated hardness values ranging from 660 to 753 HV are mainly based on the formation of nanocrystal structure. On the other hand, the post-anneal hardness values ranging from 898 to 1045 HV, which are comparable to the hardness of hard Cr, are coming from how competition worked between the precipitation of $Ni_3P$ and the grain coarsening. According to the ANOVA and regression analysis, the plating current density showed more strong effect on nanocrystal size and film hardness than the duty cycle.

LIFT 방법에 의한 전도성 미세 패터닝 공정 연구 (Micro patterning of conductor line by laser induced forward transfer(LIFT))

  • 이제훈;한유희
    • 한국레이저가공학회지
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    • 제2권3호
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    • pp.52-61
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    • 1999
  • The laser induced forward transfer(LIFT) technique employs a pulsed laser to transfer parts of a thin metal film from an optically transparent target onto an arbitrary substrate in close proximity to the metal film on the target. In this work, a two-step method, the combination of LIFT process, in which a Au film deposited on the $Al_2$O$_3$ substrate by Nd:YAG laser and subsequent Au electroless metal plating on the by LIFT process generated Au seed, was presented. The influence of laser parameters, wavelength, laser power, film thickness and overlap ratio of pulse tracks, on the shapes of deposit and conductor line after electroless plating is experimentally studied. As a results, the threshold power densities for ablation, deposition and metallization were determined and comparison of threshold value between the wave length 1064nm and the second harmonic generated 532nm. In odor to determine a possible application in the electronic industry, a smallest conduct spot size, line width and isolated line space were generated.

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Bipolar pulse power를 사용하여 증착한 MgO 박막의 특성에 관한 연구 (A study on the Characteristics of MgO Thin Films Deposited by Bipolar pulse power)

  • 김영수;김성찬;송근영;최훈영;정해영;서정현;이석현
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2003년도 추계학술대회 논문집 전기물성,응용부문
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    • pp.167-169
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    • 2003
  • AC PDP(Plasma Display panel)에서 MgO 보호막은 방전공간에 직접 노출되어 있기 때문에, AC PDP의 수명과 방전 특성이 직접적인 영향을 미친다. 그동안 보다 좋은 특성의 MgO 보호막을 증착하기 위한 연구가 Magnetron-sputtering, E-beam, ion-plating 등 여러 가지 방법에 의해 진행되어 왔다. 본 논문에서는 Bipolar pulse power를 사용하여 sputtering 방법으로 MgO 보호막을 증착하여, 그 전기적, 광학적 특성을 기존의 magnetron-sputtering 방법으로 증착한 MgO 보호막과 비교하였다. 그 결과 Bipo1ar pulse power를 이용한 MgO 보호막의 결정립이 더 크게 나타났으며 그것으로부터 AC PDP의 수명향상에 효과가 있을 것으로 사료된다.

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용융탄산염형 연료전지의 NiO 공기극의 용해거동에 미치는 알루미나 코팅효과에 대한 연구 (A study on the effect of alumina coating on NiO dissolution in molten carbonate fuel cell)

  • 류보현;윤성필;한종희;남석우;임태훈;홍성안
    • 신재생에너지
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    • 제1권1호
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    • pp.64-71
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    • 2005
  • The stability of alumina-coated NiO cathodes was studied in $Li_{0.62}/K_{0.38}$ molten carbonate electrolyte. Alumina was effectively coated on the porous Ni plate using galvanostatic pulse plating method. The deposition mechanism of alumina was governed by the concentration of hydroixde ions near the working electrode, which was controlled by the temperature of bath solution. Alumina-coated NiO cathodes were formed to $A1_2O_3-NiO$ solid solution by the oxidation process and their Ni solubilities were were than that of NiO up to the immersion time of 100h. However, their Ni solubilities increased and were similar to that of the bare NiO cathode after 100h. It was because aluminum into the solid solution was segregated to $\alpha-LiAlO_2$ on the NiO and its Product did not Play a role of the Physical barrier against NiO dissolution.

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소각중성자 산란법을 이용한 도금층의 극미세 균열 형상의 비파괴적 분석 (Non-destructive Analysis of Nano-sized Crack Morphology of Electro-deposit by Using Small Angle Neutron Scattering)

  • 최용;신은주;한영수;성백석
    • 한국표면공학회지
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    • 제49권2호
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    • pp.111-118
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    • 2016
  • A method to quantitatively analyze the defects formed by the hydrogen evolution during electroplating was suggested based on the theoretical approach of the small angle neutron scattering technique. In case of trivalent chrome layers, an isolated defect size due to the hydrogen evolution was about 40 nm. Direct and pulse plating conditions gave the average defect size of about 4.9 and $4.5{\mu}m$ with rod or calabash shape, respectively. Current density change of the pulse plating from $1.5A/dm^2$ to $2.0A/dm^2$ enlarged the average defect size from 3.3 to $7.8{\mu}m$. The defect morphology like rod or calabash was originated by inter-connecting the isolated defects. Small angle neutron scattering was useful to quantitatively evaluate defect morphology of the deposit.

전해 석출 기술의 최근 개발 동향 (Recent Advances in Electrodeposition Technology)

  • 김선규
    • 한국표면공학회지
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    • 제34권6호
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    • pp.553-567
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    • 2001
  • Electrodeposition technology is widely used in industry for various kinds of coatings. Modifications in this technology led to several processes to meet various requirements. Electrolysis in ionic liquids has many advantages such as low energy consumption of energy, low pollutant emission and low operating costs. Although ionic liquids have already been used in liquid/liquid extraction processes, only recently their use in electrodeposition was exploited. Electrochemical deposition of composites is an expanding area. Coupled with the progress in the synthesis of nanometric powder, this research will open a large number of innovative materials. Pulse current plating is another electrodeposition technique which yields improved coatings. Although electrodeposition is now regarded as an environmental non-friendly process, it is economically viable and has many inherent advantages. For certain applications, alternatives to electrodeposition have not yet been fully implemented. Hence, continued research in this technology is warranted. This article reviews some recent advances in electrodeposition technology. Aspects of electrodeposition such as electrolysis in ionic liquids, electrodeposition of composites, pulse current plating techniques, metal and alloy deposition, compound deposition and effects of additives are discussed in this review.

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금속연료-피복재 상호확산 방지를 위한 크롬 도금법 적용 연구 (Cr Electroplating Technology to prevent Interdiffusion between Metallic Fuel and Clad Material)

  • 김준환;이강수;양성우;이병운;이찬복
    • 대한금속재료학회지
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    • 제49권12호
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    • pp.937-944
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    • 2011
  • Studies have been carried out in order to reduce fuel-cladding chemical interaction (FCCI) behavior of metallic fuel in sodium-cooled fast reactors (SFR) using an electroplating technique. A $20{\mu}m$ thick Cr layer has been plated by the electrochemical method in the Sargent bath over the HT9 (12Cr-1Mo) clad material and diffusion couple tests of the U-10Zr metallic fuel as well as the rare earth alloy (70Ce-29La) have been conducted. The results show that the Cr plating can prevent FCCI behavior along the fuel-clad interface. However, cracks developed through the thickness during plating, which resulted in the migration of some fuel constituents. Variation of bath temperature, application of pulse current, and post heat treatment have been conducted to control such cracks. We found out that some conditions like the pulse current and the post heat treatment enhanced the layer property by reducing the internal cracks and improving the diffusion couple test.