• Title/Summary/Keyword: Pt/$TiO_2$

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Pyroelectric Properties of PLT Thin Films Prepared by Sol-Gel Method (Sol-Gel 법으로 제조한 PLT박막의 초전특성)

  • Chung, Jang-Ho;Lee, Moon-Kee;Park, In-Gil;Lee, Young-Hie
    • Proceedings of the KIEE Conference
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    • 1997.07d
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    • pp.1488-1490
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    • 1997
  • $(Pb_{1-x}La_x)Ti_{1-x/4}O_3$ (x=0, 0.02, 0.04, 0.06, 0.08) ceramic thin films were fabricated by Sol-Gel method. A stock solution of (Pb,La)$TiO_3$ with excess Pb 10mol% was made and spin-coated on the Pt/Ti/$SiO_2$/Si substrate at 4000rpm for 30 seconds. Coated specimens were dried on the hot-plate at $350^{\circ}C$ for 10 min and sintered at $500{\sim}750^{\circ}C$ for 1 hour. The dielectric constant, remanent polarization and coercive field of the PLT(6 at.%) thin films sintered at $650^{\circ}C$ were 884, $13.95{\mu}C/cm^2$ and 8.7kV/cm, respectively. Pyroelectric coefficient, figure of merit of pyroelectric current, voltage responsivity and detectivity of PLT(6at.%) thin films were $3.2{\times}10^{-8}\;C/cm^2K$, $1.02{\times}10^{-8}\;C{\cdot}cm/J$, $2.9{\times}10^{-11}\;C{\cdot}cm/J$, $0.29{\times}10^{-8}\;C{\cdot}cm/J$, respectively.

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Fabrication of PbZrO$_3$ thin films crystal by sol-gel processing (Sol-Gel법에 의한 PbZrO$_3$박막 결정의 제작)

  • 전기범;김원보;배세환
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.10 no.3
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    • pp.211-218
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    • 2000
  • $PbZrO_3$precursor was prepared for the spin coating on the Pt/Ti/$SiO_2$/Si substrate. Two different heat treatment methods were used and the differencies were studied. One of the method is that the films were inserted into the furnace for 30 minutes and the other is that the films were annealed by rapid thermal annealing (RTA) for 1 minute at the same temperatures. We also examined the tendency of crystallization by annealing at the fixed temperature, $700^{\circ}C$ as a function of time, namely during 1, 10, 20, and 30 minitues, respectively. The optimum conditions for the crystallization of these films were at $550^{\circ}C$ during 30 min. and at $700^{\circ}C$ during 10 min. in muffle furnace and at $650^{\circ}C$ during 1 min in RTA furnace. The best condition for making good quality grains needs 30 min. at $700^{\circ}C$.

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Improvement of Electrical Property in Ferroelectric Thin Films for ULSI's Capacitor (초고집적반도체의 커패시터용 강유전 박막의 전기적 특성 개선)

  • Mah Jae-Pyung;Park Sam-Gyu
    • Journal of the Microelectronics and Packaging Society
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    • v.11 no.3 s.32
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    • pp.91-97
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    • 2004
  • PBT thin films were formed by rf-magnetron sputtering on $Pt/Ti/SiO_2/Si$ substrate. Bulk-PZT target containing $5\%$-excess PbO was used. After PZT thin films had been deposited at room temperature, remaining portion of the thin film was formed by in-situ process. The ferroelectric perovskite phase was formed at $650^{\circ}C$. The leakage current property was improved dramatically by 2-step sputtering, and in the sample containing optimum thickness of room temp.-layer very low leakage current of $2{\times}10^{-7}A/cm^2$ was shown. As a result of the investigation on the leakage current mechanism, the electrical conduction mechanism in all PZT thin films formed by several conditions was confirmed as bulk-limited mechanism.

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Fabrication of Vesy Thin Pb(Zr, Ti)$\textrm{O}_3$ Dielectric Films of 0.12nm $\textrm{SiO}_2$ Equivalent Thickness by ECR PECVD (ECR 플라즈마 화학기상증착법에 의한 0.12nm $\textrm{SiO}_2$ 환산두계를 갖는 Pb(Zr, Ti)$\textrm{O}_3$유전박막의제조)

  • Kim, Jae-Hwan;Kim, Yong-Il;Wi, Dang-Mun;Lee, Won-Jong
    • Korean Journal of Materials Research
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    • v.7 no.8
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    • pp.635-639
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    • 1997
  • ECR-PECVD법을 사용하여 450-49$0^{\circ}C$이하의 온도에서 Pt/SiO$_{2}$/Si기판 위에 PZT 박막을 증착하였다. 기판 온도가 46$0^{\circ}C$ 이하일 경우에는 페로브스이트 상과 제2상으로 이루어진 박막이 성장하였으며 기판온도가 47$0^{\circ}C$이상일 때에는 페로브스카이트 단일상의 PZT 박막이 성장하였다. 49$0^{\circ}C$에서 매우 얇은 페로브스카이트의 PZT 박막을 증착한 후 $650^{\circ}C$에서 1분간 raped thermal annealing(RTA) 처리한 결과 박막의 조성과 결정성에는 거의 변화가 없었으나 박막의 전하 저장 밀도는 크게 향상되었다. 이는 RTA 처리에 의한 저유전 계면층의 소멸이 주된 이유라고 판단된다. 열처리 후 두께 40-45nm의 PZT박막은 200kV/cm의 전장 하에서 $10^{-6}$$\textrm{cm}^2$이하의 누설전류값을 갖고 있었으며, 인가전압 1V에서 300fF/$\mu$$m^2$의 정전용량, 즉 SiO$_{2}$환산두께 0.12nm를 나타내었다.

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Dielectric Relaxation in PMN-PT Relaxor Ferroelectrics under Weak and Strong Electric Field (완화형 강유전체 PMN-PT계에서 약전계 및 강정계 조건에서의 relaxation 거동)

  • Park, Jae-Hwan;Kim, Yun-Ho;Park, Sun-Ja
    • Korean Journal of Materials Research
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    • v.8 no.2
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    • pp.95-98
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    • 1998
  • 완화형 강유전체인 0.9MPb*Mg$_{1}$3/Nb$_{2}$3/)O$_{3}$-0.1PbTiO$_{3}$에서 강유전-상유전 상전이에 수반되는 relaxation거동을 살펴보기위해 낮은 전계에서 측정된 유전특성과 높은 전계에서 측정된 전계유기 분극 거동 등을 조사하였다. -50-9$0^{\circ}C$의 상전이 온도범위에 걸쳐 1V/mm의 낮은 전계에서 측정된 유전특성의 온도의존성을 구하고 수 kVmm의 강전계하에서 발생된 분극의 온도의존성을 관찰하였다. 이 모든 결과들은 Vogel-Fulcher관계식에 비교적 정확하게 일치되었으며 그 결과 T$_{f}$ 는 294.6˚K로 나타났다. 본 연구결과를 통하여 Vogel-Fulcher관계식에 의한 주파수 의존성은 낮은 전계하에서의 유전특성 뿐 아니라 강전계하에서의 여러물성들도 동일하게 적용되는 것을 확인할 수 있었다.

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Orientation and Ferroelectric Properties of SBN60 Thin Films Prepared by Ion Beam Sputtering (IBS법으로 제조된 SBN60박막의 배향도 및 강유전특성)

  • Jeong, Seong-Won;Lee, Hee-Young;Kim, Jeong-Joo;Cho, Sang-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.393-394
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    • 2005
  • SBN25 박막을 씨앗층으로 사용하여 이온빔으로 증착한 SBN60/SBN25 다층박막에 대하여 결정화 및 배향 특성을 고찰하였다. 기판은 Pt(111)/TiO2/SiO2/Si(100) 웨이퍼 (Pt 두께 200nm)를 사용하였으며, 약 3000${\AA}$으로 증착한후 650~$750^{\circ}C$에서 후열처리를 하였다. 제작된 박막의 증착조건 및 열처리 조건에 따른 결정화특성 변화에 대하여 연구하였으며, SBN 박막을 MFM 구조의 박막커패시터로 제조하여 강유전특성을 측정하였다.

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Microstructures and Electrical Properties of Niobium-doped Bi4Ti3O12 Thin Films Fabricated by a Sol-gel Route (졸-겔 법으로 성장시킨 Nb가 첨가된 Bi4Ti3O12 박막의 미세구조와 전기적 성질)

  • Kim, Sang-Su;Jang, Ki-Wan;Han, Chang-Hee;Lee, Ho-Sueb;Kim, Won-Jeong;Choi, Eun-Kyung;Park, Mun-Heum
    • Korean Journal of Materials Research
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    • v.13 no.5
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    • pp.317-322
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    • 2003
  • Bismuth layered structure ferroelectric thin films, $Bi_4$$Ti_3$$O_{12}$ / (BTO) and Nb-doped BTO (BTN) were prepared on the Pt(111)/Ti/$SiO_2$/Si(100) substrates by a sol-gel route. We investigated the Nb-doping effect on the grain orientation and ferroelectric properties. $Nb^{5+}$ ion substitution for $Ti^{4+}$ ion in perovskite layers of BTO decreased the degree of c-axis orientation and increased the remanent polarization (2Pr). The fatigue resistance of Nb-doped BTO thin film was shown to be superior to that of BTO, and the leakage current of Nb-doped BTO thin film was decreased about 1 order of magnitude compared with BTO. The improvement of ferroelectric properties with $Nb^{5+}$ doping in BTO could be attributed to the changes in space charge densities and grain orientation in the thin film.

Investigation of Domain Structure in (001) PMN-x%PT Crystals by Scanning Force Microscope (Scanning Force Microscope에 의한 (001) PMN-x%PT 단결정의 도메인 구조에 대한 연구)

  • Lee, Eun-Gu;Lee, Jae-Gab
    • Korean Journal of Materials Research
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    • v.19 no.6
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    • pp.300-304
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    • 2009
  • The domain structures of annealed (001)-oriented $Pb(Mg_{1/3}Nb_{2/3})O_3-x%PbTiO_3$ (PMN-x%PT) crystals for x = 10, 20, 30, 35, and 40 at% were investigated by Polarized Optical Microscopy (POM) and Scanning Force Microscopy (SFM) in the piezoresponse mode. Both Polar Nano-Domains (PND) and long strip-like domains were clearly observed. The results also showed how the domain structure changed between phases with an increasing x in the PMN-x%PT crystals and the domain hierarchy on various length scales ranging from 40 nm to 0.1 mm. Distorted pseudo-cubic phase (x < 20%) consisted of PNDs that did not self-assemble into macro-domain plates. The rhombohedral phase (x = 30%) consisted of PNDs that began to self-assemble into colonies along preferred {110} planes. The monoclinic phase (x = 35%) consisted of miniature polar domains on the nm scale, whereas, the tetragonal phase (x = 40%) consisted of {001} oriented lamella domains on the mm scale that had internal nano-scale heterogeneities, which self-assembled into macro-domain plates oriented along {001} the mm scale.

Effect of Annealing Temperature on the Properties of Sputtered Bi3.25La0.75Ti3O12 Thin Films

  • Kang, Hyunil;Song, Joontae
    • Transactions on Electrical and Electronic Materials
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    • v.14 no.3
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    • pp.130-132
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    • 2013
  • $Bi_{3.25}La_{0.75}Ti_3O_{12}$(BLT) thin films were prepared on the Pt(150 nm)/Ti(50 nm)/$SiO_2$/Si substrate using the rf magnetron sputtering method. The BLT thin films were annealed at temperatures ranging from $600^{\circ}C$ to $750^{\circ}C$ using the rapid thermal annealing. The structure and surface morphology of the thin films were characterized by x-ray diffraction and field emission scanning electron microscopy. The hysteresis loop of the BLT thin films showed that the remanent polarization (2Pr) of the film annealed at $700^{\circ}C$ was 10.92 ${\mu}C/cm^2$. The fatigue characteristic of the BLT thin film annealed at $700^{\circ}C$ was shown change polarization up to $1.2{\times}10^9$ switching cycles. We confirmed the excellent remnant polarization (Pr) and fatigue properties compared with other fabrication methods and suggested a good method for BLT thin films fabrications.

Effects of Substrate Temperatures on the Crystallinity and Electrical Properties of PLZT Thin Films (기판온도에 따른 PLZT 박막의 결정성과 전기적 특성)

  • Lee, In-Seok;Yoon, Ji-Eun;Kim, Sang-Jih;Son, Young-Guk
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.1
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    • pp.29-34
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    • 2009
  • PLZT thin films were deposited on platinized silicon (Pt/$TiSiO_2$/Si) substrate by RF magnetron sputtering. A $TiO_2$ buffer layer was fabricated, prior to deposition of PLZT films. the layer was strongly affected the crystallographic orientation of the PLZT films. X-ray diffraction was performed on the films to study the crystallization of the films as various substrate temperatures (Ts). According to increasing Ts, preferred orientation of films was changed (110) plane to (111) plane. The ferroelectric, dielectric and electrical properties of the films were also investigated in detail as increased substrate temperatures. The PLZT films deposited at $400^{\circ}C$ showed good ferroelectric properties with the remnant polarization of $15.8{\mu}C/cm^2$ and leakage current of $5.4{\times}10^{-9}\;A/cm^2$.